JP5645163B2 - フッ素系樹脂材料の表面改質方法及びフッ素系樹脂材料と金属材料の積層体 - Google Patents
フッ素系樹脂材料の表面改質方法及びフッ素系樹脂材料と金属材料の積層体 Download PDFInfo
- Publication number
- JP5645163B2 JP5645163B2 JP2011013714A JP2011013714A JP5645163B2 JP 5645163 B2 JP5645163 B2 JP 5645163B2 JP 2011013714 A JP2011013714 A JP 2011013714A JP 2011013714 A JP2011013714 A JP 2011013714A JP 5645163 B2 JP5645163 B2 JP 5645163B2
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- adhesive
- organic compound
- fluororesin material
- fluorine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 99
- 239000007769 metal material Substances 0.000 title claims description 26
- 238000002715 modification method Methods 0.000 title claims description 10
- 238000009832 plasma treatment Methods 0.000 claims description 61
- 239000000853 adhesive Substances 0.000 claims description 50
- 230000001070 adhesive effect Effects 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 48
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 32
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 32
- 230000008569 process Effects 0.000 claims description 32
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 31
- 229910052731 fluorine Inorganic materials 0.000 claims description 31
- 239000011737 fluorine Substances 0.000 claims description 31
- 150000002894 organic compounds Chemical class 0.000 claims description 31
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical group [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 claims description 23
- 239000003822 epoxy resin Substances 0.000 claims description 21
- 229920000647 polyepoxide Polymers 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 125000000524 functional group Chemical group 0.000 claims description 16
- 125000002924 primary amino group Chemical class [H]N([H])* 0.000 claims description 16
- 239000002344 surface layer Substances 0.000 claims description 14
- 238000006115 defluorination reaction Methods 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 9
- -1 polytetrafluoroethylene Polymers 0.000 claims description 9
- 238000007142 ring opening reaction Methods 0.000 claims description 9
- 239000012298 atmosphere Substances 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 230000004048 modification Effects 0.000 claims description 5
- 238000012986 modification Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000010559 graft polymerization reaction Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 208000024891 symptom Diseases 0.000 claims 1
- 238000011282 treatment Methods 0.000 description 32
- 238000012545 processing Methods 0.000 description 19
- 239000000243 solution Substances 0.000 description 13
- 238000001228 spectrum Methods 0.000 description 13
- 238000005530 etching Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 230000008859 change Effects 0.000 description 10
- 208000028659 discharge Diseases 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 150000003254 radicals Chemical class 0.000 description 8
- 238000007788 roughening Methods 0.000 description 8
- 229910021642 ultra pure water Inorganic materials 0.000 description 8
- 239000012498 ultrapure water Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000001307 helium Substances 0.000 description 7
- 229910052734 helium Inorganic materials 0.000 description 7
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 7
- 238000001878 scanning electron micrograph Methods 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229920006332 epoxy adhesive Polymers 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000295 emission spectrum Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- DVGHHMFBFOTGLM-UHFFFAOYSA-L fluorogold Chemical compound F[Au][Au]F DVGHHMFBFOTGLM-UHFFFAOYSA-L 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- URXNVXOMQQCBHS-UHFFFAOYSA-N naphthalene;sodium Chemical compound [Na].C1=CC=CC2=CC=CC=C21 URXNVXOMQQCBHS-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229920002873 Polyethylenimine Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000001994 activation Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 238000001338 self-assembly Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000001362 electron spin resonance spectrum Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002221 fluorine Chemical class 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Description
2 処理容器
3 電極
4 気泡発生体
5 ヘリウムガスボンベ
6 マスフロメータ
7 ガス供給管
8 試料
9 対向電極
10 高周波電源
11 水槽
12 チューブポンプ
13 吸引管
14 マグネットポンプ
15 供給管
20 大気圧プラズマ処理装置
21 チャンバー
22 電極
23 対向電極
24 試料
25 高周波電源
26 インピダンスマッチング
Claims (9)
- フッ素系樹脂材料と他の材料との接着性を改善するためのフッ素系樹脂材料の表面改質方法であって、
前記フッ素系樹脂材料を水中で発生させたプラズマに曝し、表層部に多孔質構造を導入して粗面化する水中プラズマ処理工程と、
前記フッ素系樹脂材料の粗面化表面を大気圧プラズマに曝して脱フッ素化と、その後の大気暴露時に過酸化物ラジカル基を導入する大気圧プラズマ処理工程と、
前記フッ素系樹脂材料の過酸化物ラジカル基導入面に、接着剤と反応性のある官能基を分子内に持つ有機化合物溶液を塗布し、前記過酸化物ラジカル基を反応点として、有機化合物を自発的に共有結合させて高密度にグラフト重合させるグラフト化工程と、
よりなることを特徴とするフッ素系樹脂材料の表面改質方法。 - 前記フッ素系樹脂材料が、ポリテトラフルオロエチレンを主体としたものである請求項1記載のフッ素系樹脂材料の表面改質方法。
- 前記接着剤がエポキシ樹脂系接着剤であり、前記有機化合物溶液がエポキシ環の開環反応をする第一級アミンを有する有機化合物溶液である請求項1又は2記載のフッ素系樹脂材料の表面改質方法。
- 第一級アミンを有する有機化合物溶液が、水溶性ポリアクリルアミン誘導体である請求項3記載のフッ素系樹脂材料の表面改質方法。
- フッ素系樹脂材料と金属材料とを接着剤にて接着して積層したフッ素系樹脂材料と金属材料の積層体であって、前記フッ素系樹脂材料を水中で発生させたプラズマに曝し、表層部に多孔質構造を導入して粗面化する水中プラズマ処理工程と、前記フッ素系樹脂材料の粗面化表面を大気圧プラズマに曝して脱フッ素化と、その後の大気暴露時に過酸化物ラジカル基を導入する大気圧プラズマ処理工程と、前記フッ素系樹脂材料の過酸化物ラジカル基導入面に、接着剤と反応性のある官能基を分子内に持つ有機化合物溶液を塗布し、前記過酸化物ラジカル基を反応点として、有機化合物を自発的に共有結合させて高密度にグラフト重合させるグラフト化工程と、を経て表面改質したフッ素系樹脂材料に接着剤を塗布して金属材料と接着したことを特徴とするフッ素系樹脂材料と金属材料の積層体。
- 前記フッ素系樹脂材料が、ポリテトラフルオロエチレンを主体としたものである請求項5記載のフッ素系樹脂材料と金属材料の積層体。
- 前記接着剤がエポキシ樹脂系接着剤であり、前記有機化合物溶液がエポキシ環の開環反応をする第一級アミンを有する有機化合物溶液である請求項5又は6記載のフッ素系樹脂材料と金属材料の積層体。
- 第一級アミンを有する有機化合物溶液が、水溶性ポリアクリルアミン誘導体である請求項7記載のフッ素系樹脂材料と金属材料の積層体。
- 前記金属材料が、ステンレス鋼、銅又はアルミニウムの内の1種である請求項5〜8何れか1項に記載のフッ素系樹脂材料と金属材料の積層体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011013714A JP5645163B2 (ja) | 2011-01-26 | 2011-01-26 | フッ素系樹脂材料の表面改質方法及びフッ素系樹脂材料と金属材料の積層体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011013714A JP5645163B2 (ja) | 2011-01-26 | 2011-01-26 | フッ素系樹脂材料の表面改質方法及びフッ素系樹脂材料と金属材料の積層体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012153791A JP2012153791A (ja) | 2012-08-16 |
JP5645163B2 true JP5645163B2 (ja) | 2014-12-24 |
Family
ID=46835868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011013714A Expired - Fee Related JP5645163B2 (ja) | 2011-01-26 | 2011-01-26 | フッ素系樹脂材料の表面改質方法及びフッ素系樹脂材料と金属材料の積層体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5645163B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3190148B1 (en) * | 2014-09-05 | 2021-04-28 | Osaka University | Method for manufacturing surface-modified molded article, and method for manufacturing composite using surface-modified molded article |
WO2016039349A1 (ja) * | 2014-09-10 | 2016-03-17 | 日本碍子株式会社 | 水酸化物イオン伝導性セラミックスセパレータを用いた二次電池 |
CN105670024B (zh) * | 2016-01-28 | 2018-09-04 | 大连理工大学 | 一种采用大气压等离子体对管内外壁进行表面改性的方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3746868B2 (ja) * | 1997-02-14 | 2006-02-15 | 日東電工株式会社 | フッ素樹脂複合体およびその製造方法 |
JP5518281B2 (ja) * | 2005-03-25 | 2014-06-11 | 三菱レイヨン株式会社 | 表面処理方法 |
JP4935214B2 (ja) * | 2006-07-14 | 2012-05-23 | 公立大学法人大阪府立大学 | 表面被覆フッ素樹脂基体及びその製造方法 |
-
2011
- 2011-01-26 JP JP2011013714A patent/JP5645163B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2012153791A (ja) | 2012-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6085652B2 (ja) | 非晶質炭素膜からなる層への固定化方法及び積層体 | |
CN106687510B (zh) | 表面改性成形体的制造方法、以及使用了该表面改性成形体的复合体的制造方法 | |
JP5849308B2 (ja) | 表面改質フッ素樹脂フィルムの製造方法及び表面改質フッ素樹脂フィルム | |
Sun et al. | Surface modification of poly (tetrafluoroethylene) films via plasma treatment and graft copolymerization of acrylic acid | |
CN1189125A (zh) | 无粘合剂柔韧层合制品及其制作方法 | |
Deshmukh et al. | Surface characterization of polyethylene films modified by gaseous plasma | |
JP5645163B2 (ja) | フッ素系樹脂材料の表面改質方法及びフッ素系樹脂材料と金属材料の積層体 | |
JP5226827B2 (ja) | フッ素系高分子材料の表面を超疎水性表面に改質する方法 | |
Bhatnagar et al. | Physico-chemical characteristics of high performance polymer modified by low and atmospheric pressure plasma | |
Cho et al. | Improvement of paint adhesion to a polypropylene bumper by plasma treatment | |
CN1858091A (zh) | 真空射频等离子体极化处理氟橡胶的方法 | |
Kaplan et al. | Plasma processes and adhesive bonding of polytetrafluoroethylene | |
JP2016016429A (ja) | レーザを用いた部材の接合方法 | |
KR101049927B1 (ko) | 실리콘 코팅된 플라스틱 본딩시트 및 그 제조방법 | |
CN1116437C (zh) | 在材料表面进行等离子体聚合反应 | |
KR100600497B1 (ko) | 실리콘 고무 시트의 표면 개질 방법 | |
Zou et al. | Plasma polymerization and deposition of glycidyl methacrylate on Si (100) surface for adhesion improvement with polyimide | |
JPH0639147B2 (ja) | 複合構造体 | |
Dasilva et al. | Adhesion of copper to poly (tetrafluoroethylene-co-hexafluoropropylene)(FEP) surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma | |
Wang et al. | Electroless deposition of copper on poly (tetrafluoroethylene) films modified by plasma-induced surface grafting of poly (4-vinylpyridine) | |
Yu et al. | Surface passivation of epoxy resin with a covalently adhered poly (tetrafluoroethylene) layer | |
Wu et al. | Modification of poly (tetrafluoroethylene) and copper foil surfaces by graft polymerization for adhesion improvement | |
Zhang et al. | Adhesion improvement of a poly (tetrafluoroethylene)-copper laminate by thermal graft copolymerization | |
Williams | Surface modification by atmospheric pressure plasma for improved bonding | |
Chan-Park et al. | Photografting of argon plasma-treated graphite/PEEK laminate to enhance its adhesion |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131115 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140225 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140401 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20141007 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141024 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5645163 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |