KR100938323B1 - 표면 처리 방법 및 표면 처리된 물품 - Google Patents

표면 처리 방법 및 표면 처리된 물품 Download PDF

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Publication number
KR100938323B1
KR100938323B1 KR1020077024163A KR20077024163A KR100938323B1 KR 100938323 B1 KR100938323 B1 KR 100938323B1 KR 1020077024163 A KR1020077024163 A KR 1020077024163A KR 20077024163 A KR20077024163 A KR 20077024163A KR 100938323 B1 KR100938323 B1 KR 100938323B1
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South Korea
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water
plasma
article
degrees
liquid
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KR20070113313A (ko
Inventor
마사모또 우에니시
신후꾸 노무라
히로미찌 도요따
Original Assignee
미츠비시 레이온 가부시키가이샤
고쿠리쓰다이가쿠호진 에히메다이가쿠
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D65/00—Accessories or auxiliary operations, in general, for separation processes or apparatus using semi-permeable membranes
    • B01D65/02—Membrane cleaning or sterilisation ; Membrane regeneration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • A—HUMAN NECESSITIES
    • A62—LIFE-SAVING; FIRE-FIGHTING
    • A62D—CHEMICAL MEANS FOR EXTINGUISHING FIRES OR FOR COMBATING OR PROTECTING AGAINST HARMFUL CHEMICAL AGENTS; CHEMICAL MATERIALS FOR USE IN BREATHING APPARATUS
    • A62D3/00—Processes for making harmful chemical substances harmless or less harmful, by effecting a chemical change in the substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02054—Cleaning before device manufacture, i.e. Begin-Of-Line process combining dry and wet cleaning steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
    • H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
    • A61L2/14—Plasma, i.e. ionised gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2321/00—Details relating to membrane cleaning, regeneration, sterilization or to the prevention of fouling
    • B01D2321/20—By influencing the flow
    • B01D2321/2066—Pulsated flow
    • B01D2321/2075—Ultrasonic treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Emergency Management (AREA)
  • Materials Engineering (AREA)
  • Business, Economics & Management (AREA)
  • Metallurgy (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Surface Treatment Of Glass (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Fuel Cell (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • ing And Chemical Polishing (AREA)
KR1020077024163A 2005-03-25 2006-03-24 표면 처리 방법 및 표면 처리된 물품 Expired - Fee Related KR100938323B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005089631 2005-03-25
JPJP-P-2005-00089631 2005-03-25

Publications (2)

Publication Number Publication Date
KR20070113313A KR20070113313A (ko) 2007-11-28
KR100938323B1 true KR100938323B1 (ko) 2010-01-22

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Country Status (5)

Country Link
US (1) US20080210664A1 (enExample)
JP (2) JP5518281B2 (enExample)
KR (1) KR100938323B1 (enExample)
TW (1) TWI405608B (enExample)
WO (1) WO2006104043A1 (enExample)

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WO2011109648A1 (en) * 2010-03-03 2011-09-09 Georgia Tech Research Corporation Through-package-via (tpv) structures on inorganic interposer and methods for fabricating same
US10369327B2 (en) * 2010-04-28 2019-08-06 Clph, Llc Catheters with lubricious linings and methods for making and using them
JP5696447B2 (ja) 2010-11-25 2015-04-08 Ｊｆｅスチール株式会社 表面処理金属材料の製造方法
JP5645163B2 (ja) * 2011-01-26 2014-12-24 国立大学法人大阪大学 フッ素系樹脂材料の表面改質方法及びフッ素系樹脂材料と金属材料の積層体
KR101405721B1 (ko) 2011-04-29 2014-06-13 한국과학기술연구원 소수성이 개선된 기공체 및 그 제조 방법
KR101349075B1 (ko) * 2011-10-10 2014-01-16 한국과학기술연구원 물질전달성이 향상된 연료전지 및 그 제조 방법
US9809493B2 (en) 2015-04-27 2017-11-07 Ford Global Technologies, Llc Surface treatment of glass bubbles
JP2019029333A (ja) * 2017-07-26 2019-02-21 東芝メモリ株式会社 プラズマ処理装置および半導体装置の製造方法
KR102148831B1 (ko) 2018-10-02 2020-08-27 삼성전기주식회사 코일 부품
KR102619877B1 (ko) * 2019-09-11 2024-01-03 삼성전자주식회사 기판 처리 장치
JP7427475B2 (ja) * 2020-02-28 2024-02-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7399209B2 (ja) * 2022-04-05 2023-12-15 エルジー・ケム・リミテッド 処理装置、分解生成物の製造方法、及び処理方法
WO2025070805A1 (ja) * 2023-09-29 2025-04-03 ダイキン工業株式会社 エアフィルタ濾材、エアフィルタ濾材の使用方法、および空気処理装置
CN118952032B (zh) * 2024-09-20 2025-05-30 彤程电子材料(常州)有限公司 一种复合抛光垫及其制备方法和应用

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JP2004306029A (ja) 2003-03-27 2004-11-04 Techno Network Shikoku Co Ltd 化学反応装置および有害物質分解方法
JP2005058887A (ja) 2003-08-11 2005-03-10 Mitsubishi Heavy Ind Ltd 高電圧パルスを利用した廃水処理装置

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JPH03231199A (ja) * 1990-02-06 1991-10-15 Mitsubishi Heavy Ind Ltd 使用ずみ燃料剪断片の減容方法
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JP2004306029A (ja) 2003-03-27 2004-11-04 Techno Network Shikoku Co Ltd 化学反応装置および有害物質分解方法
JP2005058887A (ja) 2003-08-11 2005-03-10 Mitsubishi Heavy Ind Ltd 高電圧パルスを利用した廃水処理装置

Also Published As

Publication number Publication date
TWI405608B (zh) 2013-08-21
JP2013031842A (ja) 2013-02-14
TW200637648A (en) 2006-11-01
JP5518281B2 (ja) 2014-06-11
KR20070113313A (ko) 2007-11-28
JPWO2006104043A1 (ja) 2008-09-04
WO2006104043A1 (ja) 2006-10-05
JP5725304B2 (ja) 2015-05-27
US20080210664A1 (en) 2008-09-04

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