TWI398205B - 印刷電路基板的製造方法 - Google Patents

印刷電路基板的製造方法 Download PDF

Info

Publication number
TWI398205B
TWI398205B TW098106010A TW98106010A TWI398205B TW I398205 B TWI398205 B TW I398205B TW 098106010 A TW098106010 A TW 098106010A TW 98106010 A TW98106010 A TW 98106010A TW I398205 B TWI398205 B TW I398205B
Authority
TW
Taiwan
Prior art keywords
circuit pattern
metal layer
insulating material
stage
forming
Prior art date
Application number
TW098106010A
Other languages
English (en)
Chinese (zh)
Other versions
TW201002168A (en
Inventor
Jun-Heyoung Park
Je-Gwang Yoo
Chang-Sup Ryu
Sung-Yong Kim
Jong-Seok Bae
Jee-Soo Mok
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW201002168A publication Critical patent/TW201002168A/zh
Application granted granted Critical
Publication of TWI398205B publication Critical patent/TWI398205B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW098106010A 2008-05-07 2009-02-25 印刷電路基板的製造方法 TWI398205B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080042173A KR101008676B1 (ko) 2008-05-07 2008-05-07 인쇄회로기판 제조방법

Publications (2)

Publication Number Publication Date
TW201002168A TW201002168A (en) 2010-01-01
TWI398205B true TWI398205B (zh) 2013-06-01

Family

ID=41438857

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098106010A TWI398205B (zh) 2008-05-07 2009-02-25 印刷電路基板的製造方法

Country Status (3)

Country Link
JP (1) JP4752045B2 (ko)
KR (1) KR101008676B1 (ko)
TW (1) TWI398205B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5143266B1 (ja) 2011-09-30 2013-02-13 株式会社東芝 フレキシブルプリント配線板の製造装置および製造方法
TWI499364B (zh) * 2014-01-03 2015-09-01 Subtron Technology Co Ltd 核心基材與線路板的製作方法
KR102465117B1 (ko) * 2017-11-29 2022-11-11 주식회사 잉크테크 인쇄회로기판 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW556453B (en) * 2002-02-01 2003-10-01 Shiue-Fang Wu PCB with inlaid outerlayer circuits and production methods thereof
JP2004063701A (ja) * 2002-07-26 2004-02-26 Yamaichi Electronics Co Ltd フレキシブルプリント配線基板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264939A (ja) * 1995-03-28 1996-10-11 Toshiba Corp 印刷配線板の製造方法
JP2001144444A (ja) * 1999-11-17 2001-05-25 Ibiden Co Ltd 多層プリント配線板並びにそのコア材となる両面プリント配線板及びその製造方法
JP2002252258A (ja) * 1999-12-27 2002-09-06 Hoya Corp コンタクト部品及び多層配線基板の製造方法、並びにウエハ一括コンタクトボード
JP3636290B2 (ja) * 2000-03-27 2005-04-06 株式会社東芝 プリント配線基板、及びその製造方法
KR100728758B1 (ko) 2006-03-27 2007-06-19 삼성전기주식회사 패턴 코일 기판 및 제조방법
KR100729939B1 (ko) * 2006-05-09 2007-06-19 삼성전기주식회사 다층 인쇄회로기판 제조방법
KR100782402B1 (ko) * 2006-10-24 2007-12-07 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW556453B (en) * 2002-02-01 2003-10-01 Shiue-Fang Wu PCB with inlaid outerlayer circuits and production methods thereof
JP2004063701A (ja) * 2002-07-26 2004-02-26 Yamaichi Electronics Co Ltd フレキシブルプリント配線基板の製造方法

Also Published As

Publication number Publication date
JP4752045B2 (ja) 2011-08-17
TW201002168A (en) 2010-01-01
JP2009272600A (ja) 2009-11-19
KR101008676B1 (ko) 2011-01-18
KR20090116311A (ko) 2009-11-11

Similar Documents

Publication Publication Date Title
KR101015704B1 (ko) 칩 내장 인쇄회로기판 및 그 제조방법
JP2010135721A (ja) 金属バンプを持つプリント基板及びその製造方法
US9572250B2 (en) Printed circuit board and method for manufacturing the same
JP6092117B2 (ja) 印刷回路基板及びその製造方法
JP2006287034A (ja) 電解めっきを利用した配線基板の製造方法
JPH09246719A (ja) 基板の導体層の形成方法
KR20110076803A (ko) 다층 배선기판
KR100619348B1 (ko) 무전해 니켈 도금을 이용한 패키지 기판의 제조 방법
EP1951012B1 (en) Method of manufacturing a wiring board including electroplating
TW201446103A (zh) 電路板及其製作方法
JP6084283B2 (ja) 部品内蔵基板及びその製造方法
TWI398205B (zh) 印刷電路基板的製造方法
KR20110074012A (ko) 캐리어기판, 그의 제조방법, 이를 이용한 인쇄회로기판 및 그의 제조방법
KR20110064216A (ko) 범프를 구비한 회로기판 및 그 제조 방법
JP4203425B2 (ja) 両面型回路配線基板の製造方法
JP3770895B2 (ja) 電解めっきを利用した配線基板の製造方法
JP2008166464A (ja) 配線基板及びその製造方法
JP2008182071A (ja) 電子部品内蔵配線板及びその製造方法、並びに電子機器
KR100688697B1 (ko) 패키지 기판의 제조방법
KR20100109699A (ko) 인쇄회로기판의 제조방법
KR100999515B1 (ko) 인쇄회로기판 제조방법
JP4347143B2 (ja) 回路基板およびその製造方法
JP2015220354A (ja) 配線基板の製造方法
JP2005136282A (ja) 多層配線基板及びその製造方法
KR101231343B1 (ko) 인쇄회로기판 및 그의 제조 방법

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees