TWI396206B - Laminated Chip Rheostat - Google Patents

Laminated Chip Rheostat Download PDF

Info

Publication number
TWI396206B
TWI396206B TW093139856A TW93139856A TWI396206B TW I396206 B TWI396206 B TW I396206B TW 093139856 A TW093139856 A TW 093139856A TW 93139856 A TW93139856 A TW 93139856A TW I396206 B TWI396206 B TW I396206B
Authority
TW
Taiwan
Prior art keywords
varistor
laminated wafer
internal electrodes
layer
laminated
Prior art date
Application number
TW093139856A
Other languages
English (en)
Chinese (zh)
Other versions
TW200532714A (en
Inventor
Makikazu Takehana
Tadashi Ogasawara
Hideaki Sone
Takehiko Abe
Hidetaka Kitamura
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of TW200532714A publication Critical patent/TW200532714A/zh
Application granted granted Critical
Publication of TWI396206B publication Critical patent/TWI396206B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H01C7/108—Metal oxide
    • H01C7/112—ZnO type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
TW093139856A 2003-12-26 2004-12-21 Laminated Chip Rheostat TWI396206B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003435078A JP3924563B2 (ja) 2003-12-26 2003-12-26 積層型チップバリスタ

Publications (2)

Publication Number Publication Date
TW200532714A TW200532714A (en) 2005-10-01
TWI396206B true TWI396206B (zh) 2013-05-11

Family

ID=34815312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139856A TWI396206B (zh) 2003-12-26 2004-12-21 Laminated Chip Rheostat

Country Status (4)

Country Link
JP (1) JP3924563B2 (ko)
KR (1) KR101060970B1 (ko)
CN (1) CN100541675C (ko)
TW (1) TWI396206B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100411721B1 (ko) * 2000-10-19 2003-12-18 주식회사 바이오제네시스 치아 불소 코팅장치 및 그 방법
JP4910513B2 (ja) * 2005-07-25 2012-04-04 Ｔｄｋ株式会社 サージ吸収回路
JP4710560B2 (ja) * 2005-11-15 2011-06-29 Ｔｄｋ株式会社 積層型チップバリスタの製造方法
KR100834307B1 (ko) * 2005-11-15 2008-06-02 티디케이가부시기가이샤 적층형 칩 바리스터의 제조방법
JP2007165639A (ja) * 2005-12-14 2007-06-28 Tdk Corp バリスタ及びバリスタの製造方法
JP4492579B2 (ja) * 2006-03-31 2010-06-30 Ｔｄｋ株式会社 バリスタ素体及びバリスタ
KR100839682B1 (ko) * 2006-12-22 2008-06-19 주식회사 아모텍 복합 칩 소자
JP4888225B2 (ja) * 2007-03-30 2012-02-29 Ｔｄｋ株式会社 バリスタ及び発光装置
JP5696623B2 (ja) * 2011-08-29 2015-04-08 Tdk株式会社 チップバリスタ
CN112951530A (zh) * 2021-03-29 2021-06-11 北京交通大学 一种电力机车及动车组用带间隙耐老化复合型避雷器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283209A (ja) * 1992-04-03 1993-10-29 Murata Mfg Co Ltd 積層型バリスタ
TW434587B (en) * 1998-07-08 2001-05-16 Murata Manufacturing Co Chip thermistors and methods of making same
US6339367B1 (en) * 1999-03-26 2002-01-15 Tdk Corporation Laminated chip type varistor
US6346871B1 (en) * 1998-01-09 2002-02-12 Tdk Corporation Laminate type varistor
US20030043013A1 (en) * 2001-08-30 2003-03-06 Matsushita Electric Industrial Co., Ltd. Zinc oxide varistor and method of manufacturing same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283209A (ja) * 1992-04-03 1993-10-29 Murata Mfg Co Ltd 積層型バリスタ
US6346871B1 (en) * 1998-01-09 2002-02-12 Tdk Corporation Laminate type varistor
TW434587B (en) * 1998-07-08 2001-05-16 Murata Manufacturing Co Chip thermistors and methods of making same
US6339367B1 (en) * 1999-03-26 2002-01-15 Tdk Corporation Laminated chip type varistor
US20030043013A1 (en) * 2001-08-30 2003-03-06 Matsushita Electric Industrial Co., Ltd. Zinc oxide varistor and method of manufacturing same

Also Published As

Publication number Publication date
CN100541675C (zh) 2009-09-16
CN1637961A (zh) 2005-07-13
TW200532714A (en) 2005-10-01
JP2005197281A (ja) 2005-07-21
JP3924563B2 (ja) 2007-06-06
KR101060970B1 (ko) 2011-09-01
KR20050067026A (ko) 2005-06-30

Similar Documents

Publication Publication Date Title
JP3822798B2 (ja) 電圧非直線抵抗体及び磁器組成物
KR100674385B1 (ko) 적층형 칩 배리스터
TWI423273B (zh) Rheostat elements
TWI396206B (zh) Laminated Chip Rheostat
EP2680278A1 (en) Mounting structure for electronic components
JP5652465B2 (ja) チップバリスタ
US7075405B2 (en) Multilayer chip varistor and method of manufacturing the same
CN100472673C (zh) 积层型片状变阻器
US6339367B1 (en) Laminated chip type varistor
US9875831B2 (en) Method for producing a multi-layer varistor component and a multi-layer varistor component
US9337355B2 (en) Voltage nonlinear resistor and multilayer varistor using same
JP4571164B2 (ja) 電気的過大応力に対する保護のために使用されるセラミック材料、及びそれを使用する低キャパシタンス多層チップバリスタ
JP4492579B2 (ja) バリスタ素体及びバリスタ
JPH0142611B2 (ko)
JP4985989B2 (ja) 積層型セラミック電子部品
JP2005353845A (ja) 積層型チップバリスタ
JP4683068B2 (ja) 積層型チップバリスタ
US12020848B2 (en) Multilayer coil component
JP4292057B2 (ja) サーミスタ用組成物及びサーミスタ素子
JP2021061335A (ja) 積層電子部品およびその製造方法
JP2006269985A (ja) 積層型チップバリスタ
JPH0142612B2 (ko)
JP4041082B2 (ja) バリスタ及びバリスタの製造方法
JP4957155B2 (ja) バリスタ
JP4952175B2 (ja) バリスタ