TWI388639B - 用於低ｋ介電質之障蔽物漿液 - Google Patents

用於低ｋ介電質之障蔽物漿液 Download PDF

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Publication number
TWI388639B
TWI388639B TW098130809A TW98130809A TWI388639B TW I388639 B TWI388639 B TW I388639B TW 098130809 A TW098130809 A TW 098130809A TW 98130809 A TW98130809 A TW 98130809A TW I388639 B TWI388639 B TW I388639B
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TW
Taiwan
Prior art keywords
polishing composition
ppm
salt
acid
polishing
Prior art date
Application number
TW098130809A
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English (en)
Chinese (zh)
Other versions
TW201016807A (en
Inventor
李守田
史帝芬 葛倫拜
傑佛瑞 戴薩
潘卡 辛
Original Assignee
卡博特微電子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 卡博特微電子公司 filed Critical 卡博特微電子公司
Publication of TW201016807A publication Critical patent/TW201016807A/zh
Application granted granted Critical
Publication of TWI388639B publication Critical patent/TWI388639B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW098130809A 2008-09-19 2009-09-11 用於低ｋ介電質之障蔽物漿液 TWI388639B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9860008P 2008-09-19 2008-09-19

Publications (2)

Publication Number Publication Date
TW201016807A TW201016807A (en) 2010-05-01
TWI388639B true TWI388639B (zh) 2013-03-11

Family

ID=42038105

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098130809A TWI388639B (zh) 2008-09-19 2009-09-11 用於低ｋ介電質之障蔽物漿液

Country Status (9)

Country Link
US (1) US8252687B2 (enExample)
EP (1) EP2356192B1 (enExample)
JP (1) JP5619009B2 (enExample)
KR (1) KR101247890B1 (enExample)
CN (1) CN102159662B (enExample)
IL (1) IL211576A (enExample)
MY (1) MY150487A (enExample)
TW (1) TWI388639B (enExample)
WO (1) WO2010033156A2 (enExample)

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Also Published As

Publication number Publication date
EP2356192B1 (en) 2020-01-15
CN102159662B (zh) 2014-05-21
KR101247890B1 (ko) 2013-03-26
MY150487A (en) 2014-01-30
JP5619009B2 (ja) 2014-11-05
JP2012503329A (ja) 2012-02-02
EP2356192A2 (en) 2011-08-17
US20100075502A1 (en) 2010-03-25
TW201016807A (en) 2010-05-01
EP2356192A4 (en) 2013-05-22
IL211576A0 (en) 2011-05-31
KR20110069107A (ko) 2011-06-22
CN102159662A (zh) 2011-08-17
IL211576A (en) 2014-05-28
US8252687B2 (en) 2012-08-28
WO2010033156A3 (en) 2010-05-20
WO2010033156A2 (en) 2010-03-25

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