TWI383002B - - Google Patents

Info

Publication number
TWI383002B
TWI383002B TW097110902A TW97110902A TWI383002B TW I383002 B TWI383002 B TW I383002B TW 097110902 A TW097110902 A TW 097110902A TW 97110902 A TW97110902 A TW 97110902A TW I383002 B TWI383002 B TW I383002B
Authority
TW
Taiwan
Application number
TW097110902A
Other languages
Chinese (zh)
Other versions
TW200902582A (en
Inventor
Yoshihisa Shinya
Jun Yamamoto
Ryota Aizaki
Naoki Hayashi
Misao Konishi
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW200902582A publication Critical patent/TW200902582A/zh
Application granted granted Critical
Publication of TWI383002B publication Critical patent/TWI383002B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
TW097110902A 2007-06-15 2008-03-27 Epoxy resin composition TW200902582A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007158283A JP5190665B2 (ja) 2007-06-15 2007-06-15 エポキシ系樹脂組成物

Publications (2)

Publication Number Publication Date
TW200902582A TW200902582A (en) 2009-01-16
TWI383002B true TWI383002B (cg-RX-API-DMAC10.html) 2013-01-21

Family

ID=40129456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097110902A TW200902582A (en) 2007-06-15 2008-03-27 Epoxy resin composition

Country Status (8)

Country Link
US (1) US8431654B2 (cg-RX-API-DMAC10.html)
EP (1) EP2161292B1 (cg-RX-API-DMAC10.html)
JP (1) JP5190665B2 (cg-RX-API-DMAC10.html)
KR (1) KR101167545B1 (cg-RX-API-DMAC10.html)
CN (2) CN101778882B (cg-RX-API-DMAC10.html)
IN (1) IN2014KN00897A (cg-RX-API-DMAC10.html)
TW (1) TW200902582A (cg-RX-API-DMAC10.html)
WO (1) WO2008152843A1 (cg-RX-API-DMAC10.html)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008303167A (ja) * 2007-06-07 2008-12-18 Sony Chemical & Information Device Corp 新規なスルホニウムボレート錯体
JP4901889B2 (ja) * 2008-02-18 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 磁性シート組成物、磁性シート、及び磁性シートの製造方法
JP5444702B2 (ja) * 2008-12-05 2014-03-19 デクセリアルズ株式会社 新規なスルホニウムボレート錯体
JP4784698B1 (ja) * 2010-05-06 2011-10-05 横浜ゴム株式会社 熱硬化性エポキシ樹脂組成物
EP2581955A4 (en) * 2010-06-09 2015-12-30 Dexerials Corp LIGHT REFLECTING AND ELECTRICALLY CONDUCTIVE ANISOTROPE PASTE AND LIGHT-EMITTING DEVICE
JP5707754B2 (ja) * 2010-07-12 2015-04-30 横浜ゴム株式会社 導電性組成物および太陽電池セル
CN103154074B (zh) * 2010-09-29 2014-10-01 横滨橡胶株式会社 阳离子聚合引发剂以及热固化性环氧树脂组合物
JP5727316B2 (ja) * 2011-07-06 2015-06-03 積水化学工業株式会社 スルホニウム化合物の製造方法、並びにスルホニウムボレート錯体の製造方法
KR101391696B1 (ko) * 2011-11-23 2014-05-07 제일모직주식회사 이방 전도성 조성물 및 필름
KR101391697B1 (ko) * 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
JP6251557B2 (ja) * 2013-12-05 2017-12-20 デクセリアルズ株式会社 化合物、熱硬化性樹脂組成物、及び熱硬化性シート
JP2014131997A (ja) * 2013-12-26 2014-07-17 Dexerials Corp 新規なスルホニウムボレート錯体
KR101665171B1 (ko) * 2014-01-29 2016-10-11 제일모직주식회사 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
KR101706818B1 (ko) 2014-04-30 2017-02-15 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
JP6434748B2 (ja) * 2014-08-29 2018-12-05 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
KR101731677B1 (ko) 2014-08-29 2017-04-28 삼성에스디아이 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
CN107406581B (zh) * 2015-03-10 2019-09-27 横滨橡胶株式会社 阳离子聚合引发剂和环氧树脂组合物
KR20260010480A (ko) 2016-02-22 2026-01-20 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
JP6776609B2 (ja) 2016-02-22 2020-10-28 デクセリアルズ株式会社 異方性導電フィルム
JP7462408B2 (ja) 2019-12-13 2024-04-05 デクセリアルズ株式会社 接着剤組成物、接着フィルム及び接続構造体
JP7764146B2 (ja) 2021-06-03 2025-11-05 デクセリアルズ株式会社 接着剤組成物、接着フィルム、接続構造体および接続構造体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0393893A1 (en) * 1989-04-08 1990-10-24 Sanshin Kagaku Kogyo Co., Ltd. Sulfonium compound and polymerisation initator comprising the sulfonium compound as the main ingredient
JPH09179112A (ja) * 1995-12-21 1997-07-11 Citizen Watch Co Ltd 液晶表示装置
JPH10120766A (ja) * 1996-10-21 1998-05-12 Nippon Kayaku Co Ltd エネルギー線硬化性組成物及び物品

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2797010B2 (ja) * 1989-04-08 1998-09-17 三新化学工業株式会社 新規なスルホニウム化合物およびその製造方法
JP2797024B2 (ja) * 1989-10-13 1998-09-17 三新化学工業株式会社 スルホニウム化合物
JP2706833B2 (ja) * 1990-02-14 1998-01-28 三新化学工業株式会社 カチオン重合開始剤および重合性組成物
JPH05230189A (ja) * 1992-02-25 1993-09-07 Nippon Soda Co Ltd スルホニウム塩及び増感剤を含有する硬化性組成物
FR2727416A1 (fr) * 1994-11-24 1996-05-31 Rhone Poulenc Chimie Nouveaux amorceurs cationiques thermoactivables, de polymerisation et/ou de reticulation et compositions monomeres et/ou polymeres fonctionnels les mettant en oeuvre
JP3679438B2 (ja) * 1995-01-10 2005-08-03 三新化学工業株式会社 スルホニウム化合物の製造方法
JP3937466B2 (ja) * 1995-12-28 2007-06-27 東洋インキ製造株式会社 感エネルギー線酸発生剤、感エネルギー線酸発生剤組成物および硬化性組成物
JPH10245378A (ja) 1997-02-28 1998-09-14 Nippon Kayaku Co Ltd 新規スルホニウム塩、それからなる光重合開始剤及びエネルギー線硬化性組成物
JP4215852B2 (ja) 1997-03-10 2009-01-28 株式会社日本触媒 テトラキス（フッ化アリール）ボレート誘導体の製造方法
JP4122085B2 (ja) * 1998-03-11 2008-07-23 三新化学工業株式会社 スルホニウム化合物の製造方法
JP2000191751A (ja) * 1998-12-25 2000-07-11 Sumitomo Bakelite Co Ltd 紫外線硬化型樹脂組成物
JP2002097443A (ja) * 2000-09-21 2002-04-02 Hitachi Chem Co Ltd 接着剤組成物及びこれを用いた回路接続材料並びに接続体
JP2005043862A (ja) * 2003-04-09 2005-02-17 Konica Minolta Medical & Graphic Inc ホログラフィック記録用組成物、ホログラフィック記録メディア及びその記録方法
EP1612623A4 (en) 2003-04-09 2007-04-04 Konica Minolta Med & Graphic HOLOGRAPHIC RECORDING MEDIUM AND RECORDING METHOD THEREWITH
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JP2006282633A (ja) * 2005-04-04 2006-10-19 Sanshin Chem Ind Co Ltd スルホニウム化合物および重合組成物
JP5256570B2 (ja) * 2005-06-06 2013-08-07 東洋インキＳｃホールディングス株式会社 封止用組成物
JP2008303167A (ja) 2007-06-07 2008-12-18 Sony Chemical & Information Device Corp 新規なスルホニウムボレート錯体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0393893A1 (en) * 1989-04-08 1990-10-24 Sanshin Kagaku Kogyo Co., Ltd. Sulfonium compound and polymerisation initator comprising the sulfonium compound as the main ingredient
JPH09179112A (ja) * 1995-12-21 1997-07-11 Citizen Watch Co Ltd 液晶表示装置
JPH10120766A (ja) * 1996-10-21 1998-05-12 Nippon Kayaku Co Ltd エネルギー線硬化性組成物及び物品

Also Published As

Publication number Publication date
WO2008152843A1 (ja) 2008-12-18
CN102633994A (zh) 2012-08-15
US20100193228A1 (en) 2010-08-05
CN101778882B (zh) 2012-08-29
EP2161292B1 (en) 2012-06-20
KR101167545B1 (ko) 2012-07-20
KR20100029759A (ko) 2010-03-17
TW200902582A (en) 2009-01-16
EP2161292A4 (en) 2010-09-22
HK1142348A1 (en) 2010-12-03
JP5190665B2 (ja) 2013-04-24
JP2008308596A (ja) 2008-12-25
EP2161292A1 (en) 2010-03-10
HK1170514A1 (en) 2013-03-01
CN101778882A (zh) 2010-07-14
US8431654B2 (en) 2013-04-30
CN102633994B (zh) 2015-06-17
IN2014KN00897A (cg-RX-API-DMAC10.html) 2015-08-21

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