TWI380323B - - Google Patents

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Publication number
TWI380323B
TWI380323B TW93139354A TW93139354A TWI380323B TW I380323 B TWI380323 B TW I380323B TW 93139354 A TW93139354 A TW 93139354A TW 93139354 A TW93139354 A TW 93139354A TW I380323 B TWI380323 B TW I380323B
Authority
TW
Taiwan
Prior art keywords
bis
group
insulating film
acid
decane
Prior art date
Application number
TW93139354A
Other languages
English (en)
Chinese (zh)
Other versions
TW200531084A (en
Inventor
Shiota Atsushi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200531084A publication Critical patent/TW200531084A/zh
Application granted granted Critical
Publication of TWI380323B publication Critical patent/TWI380323B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6684—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H10P14/6686—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW93139354A 2003-12-19 2004-12-17 Insulating film, method for forming same and composition for forming same TW200531084A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003423047A JP4737361B2 (ja) 2003-12-19 2003-12-19 絶縁膜およびその形成方法

Publications (2)

Publication Number Publication Date
TW200531084A TW200531084A (en) 2005-09-16
TWI380323B true TWI380323B (https=) 2012-12-21

Family

ID=34697339

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93139354A TW200531084A (en) 2003-12-19 2004-12-17 Insulating film, method for forming same and composition for forming same

Country Status (6)

Country Link
US (1) US20060210812A1 (https=)
EP (1) EP1696478A4 (https=)
JP (1) JP4737361B2 (https=)
KR (1) KR101095746B1 (https=)
TW (1) TW200531084A (https=)
WO (1) WO2005059987A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
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WO2005068538A1 (ja) * 2004-01-16 2005-07-28 Jsr Corporation ポリマーの製造方法、ポリマー、絶縁膜形成用組成物、絶縁膜の製造方法、および絶縁膜
EP1705208B1 (en) * 2004-01-16 2013-03-20 JSR Corporation Composition for forming insulating film, method for producing same, silica insulating film, and method for forming same
EP1719793A4 (en) * 2004-02-26 2009-05-20 Jsr Corp POLYMER AND MANUFACTURING METHOD THEREFOR, COMPOSITION FOR FORMING AN INSULATING FILM AND PRODUCTION METHOD THEREFOR
EP1746123A4 (en) * 2004-05-11 2012-03-21 Jsr Corp METHOD FOR FORMING A FILM FROM ORGANIC SILICON OXIDE, ORGANIC SILICON OXIDE FILM, WIRE STRUCTURE, SEMICONDUCTOR DEVICE AND COMPOSITION FOR FILMING
JP5110239B2 (ja) 2004-05-11 2012-12-26 Ｊｓｒ株式会社 有機シリカ系膜の形成方法、膜形成用組成物
JP5110238B2 (ja) * 2004-05-11 2012-12-26 Ｊｓｒ株式会社 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法
EP1981074B1 (en) * 2006-02-02 2011-06-22 JSR Corporation Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device
JP2007273494A (ja) * 2006-03-30 2007-10-18 Fujitsu Ltd 絶縁膜形成用組成物及び半導体装置の製造方法
JP2007324350A (ja) 2006-05-31 2007-12-13 Tokyo Electron Ltd 熱処理方法および熱処理装置、ならびに基板処理装置
JP5212591B2 (ja) * 2006-12-28 2013-06-19 Ｊｓｒ株式会社 積層体、絶縁膜、および半導体装置
KR20090119903A (ko) * 2007-02-14 2009-11-20 제이에스알 가부시끼가이샤 규소 함유 막 형성용 재료, 및 규소 함유 절연막 및 그의 형성 방법
JP2008243907A (ja) * 2007-03-26 2008-10-09 Jsr Corp 導電層間の空洞形成用組成物、導電層間の空洞形成用犠牲膜および導電層間の空洞形成方法
KR101530321B1 (ko) * 2007-08-08 2015-06-19 아라까와 가가꾸 고교 가부시끼가이샤 무연 땜납 플럭스 제거용 세정제 조성물 및 무연 땜납 플럭스의 제거 방법
JP5365785B2 (ja) * 2008-05-30 2013-12-11 Ｊｓｒ株式会社 有機ケイ素化合物の製造方法
WO2010064306A1 (ja) 2008-12-03 2010-06-10 富士通株式会社 半導体装置の製造方法
JP4379637B1 (ja) 2009-03-30 2009-12-09 Ｊｓｒ株式会社 有機ケイ素化合物の製造方法
JP2011114163A (ja) * 2009-11-26 2011-06-09 Ube Nitto Kasei Co Ltd 素子分離材料用塗布液、素子分離材料用塗布液の作製方法、素子分離層用薄膜、素子分離層用薄膜の形成方法、基板、及び、基板の形成方法
WO2016089635A1 (en) * 2014-12-01 2016-06-09 Honeywell International Inc. Carbosilane polymers
KR101810892B1 (ko) * 2016-09-13 2017-12-20 동우 화인켐 주식회사 터치 센서 및 이를 포함하는 터치 스크린 패널

Family Cites Families (21)

* Cited by examiner, † Cited by third party
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US288629A (en) * 1883-11-20 Housing and insulation of electrical wires underground
US274948A (en) * 1883-04-03 la farge
US288634A (en) * 1883-11-20 Spring-vehicle
US259404A (en) * 1882-06-13 Electro-magnetic motor
US275544A (en) * 1883-04-10 tetamoee
JP3813268B2 (ja) * 1996-03-25 2006-08-23 触媒化成工業株式会社 低誘電率シリカ系被膜形成用塗布液および低誘電率被膜付基材
JP3997494B2 (ja) * 1996-09-17 2007-10-24 ソニー株式会社 半導体装置
US6318124B1 (en) * 1999-08-23 2001-11-20 Alliedsignal Inc. Nanoporous silica treated with siloxane polymers for ULSI applications
US6472076B1 (en) * 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
US6761975B1 (en) * 1999-12-23 2004-07-13 Honeywell International Inc. Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
JP3604007B2 (ja) * 2000-03-29 2004-12-22 富士通株式会社 低誘電率被膜形成材料、及びそれを用いた被膜と半導体装置の製造方法
JP2001287910A (ja) * 2000-04-04 2001-10-16 Asahi Kasei Corp 多孔質ケイ素酸化物塗膜の製造方法
TW524883B (en) * 2000-05-22 2003-03-21 Jsr Corp Composition for film formation, process for producing composition for film formation, method of film formation, and silica-based film
JP2003100738A (ja) * 2001-09-25 2003-04-04 Jsr Corp 積層体、積層体の形成方法、絶縁膜ならびに半導体用基板
JP3886779B2 (ja) * 2001-11-02 2007-02-28 富士通株式会社 絶縁膜形成用材料及び絶縁膜の形成方法
JP2003273100A (ja) * 2002-03-18 2003-09-26 Fujitsu Ltd 半導体装置及びその製造方法
US6809041B2 (en) * 2002-07-01 2004-10-26 Rensselaer Polytechnic Institute Low dielectric constant films derived by sol-gel processing of a hyperbranched polycarbosilane
JP2004158606A (ja) * 2002-11-06 2004-06-03 Fujitsu Ltd 半導体装置および半導体装置の製造方法
US7462678B2 (en) * 2003-09-25 2008-12-09 Jsr Corporation Film forming composition, process for producing film forming composition, insulating film forming material, process for forming film, and silica-based film
EP1615260A3 (en) * 2004-07-09 2009-09-16 JSR Corporation Organic silicon-oxide-based film, composition and method for forming the same, and semiconductor device
JP4355939B2 (ja) * 2004-07-23 2009-11-04 Ｊｓｒ株式会社 半導体装置の絶縁膜形成用組成物およびシリカ系膜の形成方法

Also Published As

Publication number Publication date
JP4737361B2 (ja) 2011-07-27
EP1696478A1 (en) 2006-08-30
JP2005183697A (ja) 2005-07-07
KR20060127058A (ko) 2006-12-11
KR101095746B1 (ko) 2011-12-21
EP1696478A4 (en) 2014-08-27
WO2005059987A1 (ja) 2005-06-30
US20060210812A1 (en) 2006-09-21
TW200531084A (en) 2005-09-16

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MM4A Annulment or lapse of patent due to non-payment of fees