TWI379364B - Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive - Google Patents

Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive Download PDF

Info

Publication number
TWI379364B
TWI379364B TW097143311A TW97143311A TWI379364B TW I379364 B TWI379364 B TW I379364B TW 097143311 A TW097143311 A TW 097143311A TW 97143311 A TW97143311 A TW 97143311A TW I379364 B TWI379364 B TW I379364B
Authority
TW
Taiwan
Prior art keywords
holes
heat sink
substrate
grounding
pads
Prior art date
Application number
TW097143311A
Other languages
English (en)
Chinese (zh)
Other versions
TW200937539A (en
Inventor
Zeki Z Celik
Zafer S Kutlu
Vishal Shah
Original Assignee
Lsi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lsi Corp filed Critical Lsi Corp
Publication of TW200937539A publication Critical patent/TW200937539A/zh
Application granted granted Critical
Publication of TWI379364B publication Critical patent/TWI379364B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW097143311A 2008-02-28 2008-11-10 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive TWI379364B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/038,911 US7968999B2 (en) 2008-02-28 2008-02-28 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive

Publications (2)

Publication Number Publication Date
TW200937539A TW200937539A (en) 2009-09-01
TWI379364B true TWI379364B (en) 2012-12-11

Family

ID=41012540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097143311A TWI379364B (en) 2008-02-28 2008-11-10 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive

Country Status (7)

Country Link
US (1) US7968999B2 (https=)
EP (1) EP2248165B1 (https=)
JP (1) JP5226087B2 (https=)
KR (1) KR101177039B1 (https=)
CN (1) CN101960586B (https=)
TW (1) TWI379364B (https=)
WO (1) WO2009108171A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090321925A1 (en) * 2008-06-30 2009-12-31 Gealer Charles A Injection molded metal ic package stiffener and package-to-package interconnect frame
US8247900B2 (en) * 2009-12-29 2012-08-21 Taiwan Semiconductor Manufacturing Company, Ltd. Flip chip package having enhanced thermal and mechanical performance
US9254532B2 (en) * 2009-12-30 2016-02-09 Intel Corporation Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
US20110292612A1 (en) * 2010-05-26 2011-12-01 Lsi Corporation Electronic device having electrically grounded heat sink and method of manufacturing the same
US8823407B2 (en) 2012-03-01 2014-09-02 Integrated Device Technology, Inc. Test assembly for verifying heat spreader grounding in a production test
US9041192B2 (en) * 2012-08-29 2015-05-26 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US8946871B2 (en) 2012-11-07 2015-02-03 Lsi Corporation Thermal improvement of integrated circuit packages
US9607951B2 (en) 2013-08-05 2017-03-28 Mediatek Singapore Pte. Ltd. Chip package
US9282649B2 (en) * 2013-10-08 2016-03-08 Cisco Technology, Inc. Stand-off block
US9735043B2 (en) 2013-12-20 2017-08-15 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packaging structure and process
CN105514080B (zh) * 2014-10-11 2018-12-04 意法半导体有限公司 具有再分布层和加强件的电子器件及相关方法
US9460980B2 (en) 2015-02-18 2016-10-04 Qualcomm Incorporated Systems, apparatus, and methods for heat dissipation
JP6569375B2 (ja) * 2015-08-11 2019-09-04 株式会社ソシオネクスト 半導体装置、半導体装置の製造方法及び電子装置
US20170053858A1 (en) * 2015-08-20 2017-02-23 Intel Corporation Substrate on substrate package
US20170170087A1 (en) 2015-12-14 2017-06-15 Intel Corporation Electronic package that includes multiple supports
US20170287799A1 (en) * 2016-04-01 2017-10-05 Steven A. Klein Removable ic package stiffener
CN107708328A (zh) * 2017-06-27 2018-02-16 安徽华东光电技术研究所 提高芯片充分接地和散热的焊接方法
JP6579396B2 (ja) * 2017-07-18 2019-09-25 株式会社ダイレクト・アール・エフ 半導体装置、及び基板
US20190206839A1 (en) * 2017-12-29 2019-07-04 Intel Corporation Electronic device package
US11081450B2 (en) 2019-09-27 2021-08-03 Intel Corporation Radiation shield around a component on a substrate
CN115116860B (zh) * 2022-06-17 2025-10-28 北京比特大陆科技有限公司 芯片封装方法及芯片

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5736074A (en) * 1995-06-30 1998-04-07 Micro Fab Technologies, Inc. Manufacture of coated spheres
JP3437369B2 (ja) 1996-03-19 2003-08-18 松下電器産業株式会社 チップキャリアおよびこれを用いた半導体装置
JP2770820B2 (ja) * 1996-07-01 1998-07-02 日本電気株式会社 半導体装置の実装構造
US6051888A (en) * 1997-04-07 2000-04-18 Texas Instruments Incorporated Semiconductor package and method for increased thermal dissipation of flip-chip semiconductor package
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
US6114761A (en) 1998-01-20 2000-09-05 Lsi Logic Corporation Thermally-enhanced flip chip IC package with extruded heatspreader
JP2000114413A (ja) * 1998-09-29 2000-04-21 Sony Corp 半導体装置、その製造方法および部品の実装方法
US6985363B2 (en) * 2000-10-02 2006-01-10 Matsushita Electric Industrial Co., Ltd. Card type recording medium and production method therefor
US6639321B1 (en) 2000-10-06 2003-10-28 Lsi Logic Corporation Balanced coefficient of thermal expansion for flip chip ball grid array
US6407334B1 (en) * 2000-11-30 2002-06-18 International Business Machines Corporation I/C chip assembly
US6528892B2 (en) 2001-06-05 2003-03-04 International Business Machines Corporation Land grid array stiffener use with flexible chip carriers
KR100394809B1 (ko) 2001-08-09 2003-08-14 삼성전자주식회사 반도체 패키지 및 그 제조 방법
US6472762B1 (en) 2001-08-31 2002-10-29 Lsi Logic Corporation Enhanced laminate flipchip package using a high CTE heatspreader
US6854633B1 (en) * 2002-02-05 2005-02-15 Micron Technology, Inc. System with polymer masking flux for fabricating external contacts on semiconductor components
US6987032B1 (en) * 2002-07-19 2006-01-17 Asat Ltd. Ball grid array package and process for manufacturing same
JP4639600B2 (ja) * 2004-02-04 2011-02-23 凸版印刷株式会社 半導体パッケージ
JP2006013029A (ja) * 2004-06-24 2006-01-12 Toppan Printing Co Ltd 半導体パッケージ
US7451432B2 (en) * 2004-10-01 2008-11-11 Microsoft Corporation Transformation of componentized and extensible workflow to a declarative format
JP4860994B2 (ja) * 2005-12-06 2012-01-25 ルネサスエレクトロニクス株式会社 半導体装置

Also Published As

Publication number Publication date
WO2009108171A1 (en) 2009-09-03
JP2011513970A (ja) 2011-04-28
TW200937539A (en) 2009-09-01
EP2248165A1 (en) 2010-11-10
KR20100126708A (ko) 2010-12-02
CN101960586B (zh) 2012-07-18
EP2248165B1 (en) 2017-01-18
CN101960586A (zh) 2011-01-26
EP2248165A4 (en) 2012-04-18
JP5226087B2 (ja) 2013-07-03
US7968999B2 (en) 2011-06-28
US20090218680A1 (en) 2009-09-03
KR101177039B1 (ko) 2012-08-27

Similar Documents

Publication Publication Date Title
TWI379364B (en) Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive
TWI529878B (zh) 集成電路封裝件及其裝配方法
TWI255532B (en) Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same
TWI549204B (zh) Manufacturing method of semiconductor device
TWI280641B (en) Chip structure
KR100442695B1 (ko) 열 방출판이 부착된 플립칩 패키지 제조 방법
US6756668B2 (en) Semiconductor package having thermal interface material (TIM)
KR20150094135A (ko) 반도체 패키지 및 이의 제조방법
TW200531232A (en) Semiconductor package with heatsink and method for fabricating the same and stiffner
JP2009004544A (ja) 電子装置の製造方法及び電子装置
JP2009218576A (ja) Ｍｃｍパッケージ
CN101582386A (zh) 在半导体元件形成金属凸块与密封的方法
TW200427016A (en) Flip chip package
JP5085932B2 (ja) 実装体及びその製造方法
CN102822965B (zh) 具有内嵌式裸片的集成电路封装中的热通孔
JP2000082722A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2001352021A (ja) 半導体パッケージ、半導体パッケージの実装構造及び半導体パッケージの製造方法
CN106463427A (zh) 半导体装置及其制造方法
CN215266272U (zh) 基于铜箔载板的高散热板级扇出封装结构
TWI375307B (en) Flip chip package structure and method for manufacturing the same
JP2002176135A (ja) 積層型の半導体装置とその製造方法
JP4494249B2 (ja) 半導体装置
CN107195554A (zh) 一种晶圆封装方法
JP2002158315A (ja) 半導体装置およびその製造方法
JP3770321B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees