CN101960586A - 使用焊料和膜粘合剂将倒装片封装的散热片/加强片接地的方法 - Google Patents

使用焊料和膜粘合剂将倒装片封装的散热片/加强片接地的方法 Download PDF

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CN101960586A
CN101960586A CN2008801275042A CN200880127504A CN101960586A CN 101960586 A CN101960586 A CN 101960586A CN 2008801275042 A CN2008801275042 A CN 2008801275042A CN 200880127504 A CN200880127504 A CN 200880127504A CN 101960586 A CN101960586 A CN 101960586A
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CN101960586B (zh
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泽基·切利克
扎菲尔·库特卢
维萨·山
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Avago Technologies General IP Singapore Pte Ltd
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Abstract

本发明公开了一种将倒装片封装的散热片/加强片接地的方法，该方法包括将粘合膜粘附至基板并将加强片粘附至粘合膜的步骤。粘合膜可以具有与基板上的多个接地焊盘相对应的多个第一孔。接地焊盘可以配置为提供电接地。加强片可以具有与粘合膜的多个第一孔和基板的多个接地焊盘相对应的多个第二孔。接地焊盘通常通过第一孔和第二孔而暴露。

Description

使用焊料和膜粘合剂将倒装片封装的散热片/加强片接地的方法
技术领域
本发明总体上涉及一种半导体芯片组件，更具体地，涉及一种使用焊料和膜粘合剂将倒装片封装的散热片/加强片接地的方法和/或结构。
背景技术
用于电磁屏蔽的传统封装接地经由散热板(heat sink)和/或散热片来完成。散热板和/或散热片通过使用夹具、导线或一些其他连接装置而连接至印刷电路板(PCB)。传统技术价格昂贵，涉及用于PCB的附加制造步骤，而且具有处理问题。
发明内容
本发明涉及一种用于将倒装片封装的散热片/加强片接地的方法，该方法包括将粘合膜粘附至基板并且将加强片粘附至粘合膜的步骤。粘合膜可以具有许多与基板上的许多接地焊盘相对应的第一孔。接地焊盘可以配置为提供电接地。加强片可以具有许多与粘合膜的许多第一孔和基板的许多接地焊盘相对应的第二孔。接地焊盘通常通过第一孔和第二孔而暴露。
本发明的目的、特征以及优点包括提供了一种使用焊料和膜粘合剂将倒装片封装的散热片/加强片接地的方法和/或结构，其可以：(i)提供对最终用户透明的屏蔽；(ii)降低成本；(iii)减少或者削减用于印刷电路板的制造步骤；(iv)减少或者削减处理问题；(v)将电磁屏蔽集中在集成电路封装中；和/或(vi)提供比环氧树脂粘附更高的可靠性。
附图说明
从以下的详细描述和所附权利要求及附图中，本发明的这些以及其他的目的、特征和优点将变得显而易见，附图中：
图1是示出了根据本发明将两片散热片/加强片粘附至基板的示图；
图2是示出了根据本发明的优选实施方式集成两片散热片/加强片后的截面图的示图；以及
图3是示出了根据本发明的方法的流程图。
具体实施方式
本发明总体上提供一种用于将倒装片封装的散热片/加强片接地的方法和结构。倒装片封装可通过使用诸如FPBGA、FCPBGA、FCBGA等的标号来被制造商识别。本发明总体上提供了一种通过经由封装基板将散热片/加强片接地来将电磁屏蔽集中在封装中的方法。在一个实例中，可以使用膜粘合剂和焊料的组合来将散热片/加强片以机械和电的方式连接至封装基板。由本发明提供的屏蔽对消费者(或者最终用户)可以是透明的。本发明总体上消除了传统方法的缺陷。
参考图1，示出了用于说明根据本发明将散热片/加强片粘附至封装基板的示图。在一个实例中，基板100可设置有多个焊盘(或者走线(trace))102。焊盘102可以配置为提供电气接地连接。焊盘102可以涂覆有金属(例如，焊料、锡(Sn)、镍(Ni)、金(Au)等)。在一个实例中，基板100可以为倒装片封装的一部分。焊盘102可以在基板100的上表面上(例如，封装的内部)。在一个实例中，基板100的下表面可以包括球栅阵列。
粘合膜104可以施加、粘附、粘合至基板100的上表面。粘合膜104可以具有可被定位成与基板100的焊盘102相对应的多个孔106。在一个实例中，孔106可以包含焊料。在一个实例中，粘合膜104可以被图案化为环孔，以安装在芯片(die)(未示出)的周围。在一个实例中，粘合膜104可被图案化为与加强片108的形状相匹配。
加强片108可以由导电材料制成。在一个实例中，加强片108可以为金属(例如，铜等)。加强片108可以具有可被定位成与基板100的焊盘102以及粘合膜104的孔106相对应(如，搭配)的多个孔110。焊盘102通常通过孔106和110被暴露(可接近的)。在一个实例中，孔106和110可以为圆形。然而，为了满足特定实施方式的设计标准，可以相应地实施其他形状的孔。
制备加强片108的孔110和粘合膜104的孔106以通过焊盘102将加强片以机械和电的方式连接至基板100。加强片108可以经由粘合膜104粘附或粘合至基板100。例如，可以使用粘合膜104将加强片108粘附至基板。然后固化粘合膜104。在一个实例中，孔106和孔110可以印制(stencil)有焊膏。在另一实例中，在加强片108粘附至粘合膜104之后，可将焊料散布在孔106和110中。在又一实例中，可将助焊剂散布在孔106和110中，并且在助焊剂之后滴入焊球。在又一实例中，可将浸有助焊剂的焊球滴入孔110中。然而，为了满足特定实施方式的设计标准，可以相应地实施制备用于将加强片108电连接至焊盘102的孔106和110的其他方法。
散热片112可粘附至加强片108，以使散热片112电连接至加强片108和基板100。在一个实例中，可通过使用导电环氧树脂将散热片112粘附至加强片108。在另一实例中，进一步地，可以通过孔106和110中的焊料将散热片112粘附至加强片108。然而，为了满足特定实施方式的设计标准，可以相应地实施将散热片112以机械和电的方式粘附至加强片108的其他方法。
参考图2，示出了用于说明根据本发明实施方式的封装150的截面图的示图。封装150可实施为倒装片封装。封装150可以实施根据本发明的散热片/加强片接地方案。封装150可以包括使用例如倒装片焊料凸块156而粘附至基板154的芯片152。芯片152与基板154之间的间隙可以填充有底层填料158。可以使用粘合膜162和焊料(或者焊球)164将加强片160粘附至基板154。焊料164可以形成与基板154上的接地焊盘166的机械连接和电连接。在一个实例中，焊料164(例如，由焊球164a所示)可以被配置为将加强片160粘附至基板154的焊盘166。
可以使用导热材料170将散热片168粘附至(i)芯片152，并且使用导电材料172将散热片168粘附至(ii)加强片160。在一个实例中，焊料164(例如，由焊球164b所示)可以被配置为将加强片160和散热片168这两者电连接至基板154上的焊盘166。在一个实例中，导热材料170可以包括诸如热脂的低模量材料。然而，为了满足特定实施方式的设计标准，可以相应地实施其他导热材料。在一个实例中，导电材料172可以包括诸如导电环氧树脂、导电环氧树脂膜等的高模量材料。然而，可以使用其他的导电材料来将散热片168和加强片160接合。在一个实例中，可以使用适合于材料170的导电材料将芯片152的顶侧(或背侧)(例如，面向散热片168的一侧)接地。在一个实例中，基板154可以在与芯片152相反的一侧上具有焊球174。
参考图3，示出了用于说明根据本发明优选实施方式的方法200的流程图。在一个实例中，方法200可以包括步骤(或处理)202、步骤(或处理)204、步骤(或处理)206、步骤(或处理)208、以及步骤(或处理)210。在一个实例中，步骤202通常包括使用粘合膜将加强片粘附至基板。加强片和粘合膜可以具有对应于基板上的接地焊盘的孔。步骤204通常包括将粘合膜固化。步骤206通常包括将焊料、助焊剂和/或焊球中的一种或多种散布在加强片的孔中。在一个实例中，步骤208通常包括使用导电环氧树脂将散热片粘附至加强片。步骤210通常包括回流处理，在此期间，加强片的孔中的焊料(或者焊球)形成固体焊料-焊盘和焊料-加强片(或焊料-加强片-散热片)界面。在一个实例中，如果有的话，在粘附加强片之前，可以使用传统技术将芯片和电容器粘附至基板。
尽管已经参考本发明的优选实施方式具体示出并描述了本发明，但本领域的技术人员应当理解，在不背离本发明的范围的前提下，可以进行形式和细节的各种改变。

Claims (20)

1.一种将倒装片封装的散热片/加强片接地的方法，包括以下步骤：
将粘合膜粘附至基板，其中，所述粘合膜具有与所述基板上的多个接地焊盘相对应的多个第一孔，所述接地焊盘被配置为提供电接地；以及
将加强片粘附至所述粘合膜，所述加强片具有与所述粘合膜的多个所述第一孔和所述基板的所述接地焊盘相对应的多个第二孔，其中，所述接地焊盘通过所述第一孔和所述第二孔而暴露。
2.根据权利要求1所述的方法，进一步包括：
在所述第二孔内印制焊膏。
3.根据权利要求1所述的方法，进一步包括：
在所述第二孔内散布焊膏。
4.根据权利要求1所述的方法，进一步包括：
在所述第二孔内散布助焊剂；以及
在所述第二孔内滴加焊球。
5.根据权利要求1所述的方法，进一步包括：
将涂覆有助焊剂的焊球滴入所述第二孔中
6.根据权利要求1所述的方法，进一步包括：
将包含集成电路的芯片粘附至所述基板；以及
将所述散热片粘附至所述芯片和所述加强片，使得所述散热片电连接至所述基板的所述接地焊盘。
7.根据权利要求6所述的方法，其中，所述芯片粘附至所述散热片，使得所述芯片电连接至所述接地焊盘。
8.一种装置，包括：
基板，具有被配置为提供电接地的多个接地焊盘；
加强片，具有与所述基板的多个所述接地焊盘相对应的多个第一孔；以及
粘合膜，具有与多个所述接地焊盘和多个所述第一孔相对应的多个第二孔，其中，所述粘合膜被配置为将所述加强片以机械方式粘附至所述基板，使得所述接地焊盘通过所述第一孔和所述第二孔而暴露。
9.根据权利要求8所述的装置，其中，所述接地焊盘涂覆有金属。
10.根据权利要求8所述的装置，进一步包括：
所述第一孔和所述第二孔内的焊膏。
11.根据权利要求8所述的装置，进一步包括：
所述第一孔和所述第二孔内的助焊剂和焊球。
12.根据权利要求8所述的装置，其中，焊料经由所述第一孔和所述第二孔而将所述加强片电连接至所述接地焊盘。
13.根据权利要求8所述的装置，其中，焊料经由所述第一孔和所述第二孔而将所述加强片和散热片电连接至所述接地焊盘。
14.根据权利要求8所述的装置，进一步包括：
芯片，被配置为电粘附至所述基板；以及
焊料凸块的面积阵列互连，被配置为将所述芯片以机械和电的方式连接至所述基板。
15.根据权利要求14所述的装置，其中，所述芯片热粘附至散热片，并且所述散热片电连接至所述加强片。
16.根据权利要求14所述的装置，其中，所述芯片与所述基板相反的一侧通过包括散热片、所述加强片和所述接地焊盘的导电路径电接地。
17.一种倒装片封装集成电路，包括：
基板，具有被配置为提供电接地的多个接地焊盘；
加强片，具有与所述基板的多个所述接地焊盘相对应的多个第一孔；以及
粘合膜，具有与多个所述接地焊盘和多个所述第一孔相对应的多个第二孔，其中，所述粘合膜被配置为将所述加强片以机械方式粘附至所述基板，使得所述接地焊盘通过所述第一孔和所述第二孔而暴露。
18.根据权利要求17所述的倒装片封装集成电路，进一步包括：
所述第一孔和所述第二孔内的焊膏。
19.根据权利要求17所述的倒装片封装集成电路，进一步包括：
所述第一孔和所述第二孔内的助焊剂和焊球。
20.根据权利要求17所述的倒装片封装集成电路，进一步包括：
芯片，电连接至所述基板；以及
散热片，热连接至所述芯片，并且经由所述加强片而电连接至所述接地焊盘。
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