JP5226087B2 - 基板を介してヒートスプレッダ及び補強材を接地する方法、装置及びフリップチップパッケージ - Google Patents

基板を介してヒートスプレッダ及び補強材を接地する方法、装置及びフリップチップパッケージ Download PDF

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Publication number
JP5226087B2
JP5226087B2 JP2010548652A JP2010548652A JP5226087B2 JP 5226087 B2 JP5226087 B2 JP 5226087B2 JP 2010548652 A JP2010548652 A JP 2010548652A JP 2010548652 A JP2010548652 A JP 2010548652A JP 5226087 B2 JP5226087 B2 JP 5226087B2
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Prior art keywords
substrate
ground terminal
heat spreader
holes
die
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2010548652A
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English (en)
Japanese (ja)
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JP2011513970A (ja
JP2011513970A5 (https=
Inventor
チェリッキ，ゼキ
クトゥル，ザフェル
シャー，ヴィシャール
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LSI Corp
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LSI Logic Corp
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Publication date
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2010548652A 2008-02-28 2008-11-20 基板を介してヒートスプレッダ及び補強材を接地する方法、装置及びフリップチップパッケージ Expired - Fee Related JP5226087B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/038,911 2008-02-28
US12/038,911 US7968999B2 (en) 2008-02-28 2008-02-28 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive
PCT/US2008/012957 WO2009108171A1 (en) 2008-02-28 2008-11-20 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive

Publications (3)

Publication Number Publication Date
JP2011513970A JP2011513970A (ja) 2011-04-28
JP2011513970A5 JP2011513970A5 (https=) 2012-03-08
JP5226087B2 true JP5226087B2 (ja) 2013-07-03

Family

ID=41012540

Family Applications (1)

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JP2010548652A Expired - Fee Related JP5226087B2 (ja) 2008-02-28 2008-11-20 基板を介してヒートスプレッダ及び補強材を接地する方法、装置及びフリップチップパッケージ

Country Status (7)

Country Link
US (1) US7968999B2 (https=)
EP (1) EP2248165B1 (https=)
JP (1) JP5226087B2 (https=)
KR (1) KR101177039B1 (https=)
CN (1) CN101960586B (https=)
TW (1) TWI379364B (https=)
WO (1) WO2009108171A1 (https=)

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US8247900B2 (en) * 2009-12-29 2012-08-21 Taiwan Semiconductor Manufacturing Company, Ltd. Flip chip package having enhanced thermal and mechanical performance
US9254532B2 (en) * 2009-12-30 2016-02-09 Intel Corporation Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
US20110292612A1 (en) * 2010-05-26 2011-12-01 Lsi Corporation Electronic device having electrically grounded heat sink and method of manufacturing the same
US8823407B2 (en) 2012-03-01 2014-09-02 Integrated Device Technology, Inc. Test assembly for verifying heat spreader grounding in a production test
US9041192B2 (en) * 2012-08-29 2015-05-26 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US8946871B2 (en) 2012-11-07 2015-02-03 Lsi Corporation Thermal improvement of integrated circuit packages
US9607951B2 (en) 2013-08-05 2017-03-28 Mediatek Singapore Pte. Ltd. Chip package
US9282649B2 (en) * 2013-10-08 2016-03-08 Cisco Technology, Inc. Stand-off block
US9735043B2 (en) 2013-12-20 2017-08-15 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packaging structure and process
CN105514080B (zh) * 2014-10-11 2018-12-04 意法半导体有限公司 具有再分布层和加强件的电子器件及相关方法
US9460980B2 (en) 2015-02-18 2016-10-04 Qualcomm Incorporated Systems, apparatus, and methods for heat dissipation
JP6569375B2 (ja) * 2015-08-11 2019-09-04 株式会社ソシオネクスト 半導体装置、半導体装置の製造方法及び電子装置
US20170053858A1 (en) * 2015-08-20 2017-02-23 Intel Corporation Substrate on substrate package
US20170170087A1 (en) 2015-12-14 2017-06-15 Intel Corporation Electronic package that includes multiple supports
US20170287799A1 (en) * 2016-04-01 2017-10-05 Steven A. Klein Removable ic package stiffener
CN107708328A (zh) * 2017-06-27 2018-02-16 安徽华东光电技术研究所 提高芯片充分接地和散热的焊接方法
JP6579396B2 (ja) * 2017-07-18 2019-09-25 株式会社ダイレクト・アール・エフ 半導体装置、及び基板
US20190206839A1 (en) * 2017-12-29 2019-07-04 Intel Corporation Electronic device package
US11081450B2 (en) 2019-09-27 2021-08-03 Intel Corporation Radiation shield around a component on a substrate
CN115116860B (zh) * 2022-06-17 2025-10-28 北京比特大陆科技有限公司 芯片封装方法及芯片

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US5736074A (en) * 1995-06-30 1998-04-07 Micro Fab Technologies, Inc. Manufacture of coated spheres
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Also Published As

Publication number Publication date
WO2009108171A1 (en) 2009-09-03
JP2011513970A (ja) 2011-04-28
TW200937539A (en) 2009-09-01
EP2248165A1 (en) 2010-11-10
KR20100126708A (ko) 2010-12-02
CN101960586B (zh) 2012-07-18
EP2248165B1 (en) 2017-01-18
CN101960586A (zh) 2011-01-26
TWI379364B (en) 2012-12-11
EP2248165A4 (en) 2012-04-18
US7968999B2 (en) 2011-06-28
US20090218680A1 (en) 2009-09-03
KR101177039B1 (ko) 2012-08-27

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