TWI374523B - - Google Patents

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Publication number
TWI374523B
TWI374523B TW096133978A TW96133978A TWI374523B TW I374523 B TWI374523 B TW I374523B TW 096133978 A TW096133978 A TW 096133978A TW 96133978 A TW96133978 A TW 96133978A TW I374523 B TWI374523 B TW I374523B
Authority
TW
Taiwan
Prior art keywords
resin
core material
thickness
glass transition
resin composition
Prior art date
Application number
TW096133978A
Other languages
English (en)
Chinese (zh)
Other versions
TW200830486A (en
Inventor
Masahiro Wada
Hiroyuki Tanaka
Hiroshi Hirose
Teppei Itoh
Kenya Tachibana
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW200830486A publication Critical patent/TW200830486A/zh
Application granted granted Critical
Publication of TWI374523B publication Critical patent/TWI374523B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
TW096133978A 2006-09-13 2007-09-12 Semiconductor device TW200830486A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006248473 2006-09-13

Publications (2)

Publication Number Publication Date
TW200830486A TW200830486A (en) 2008-07-16
TWI374523B true TWI374523B (https=) 2012-10-11

Family

ID=39183681

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096133978A TW200830486A (en) 2006-09-13 2007-09-12 Semiconductor device

Country Status (9)

Country Link
US (1) US8008767B2 (https=)
EP (1) EP1956648A4 (https=)
JP (2) JP4802246B2 (https=)
KR (2) KR101195408B1 (https=)
CN (1) CN101356643B (https=)
CA (1) CA2630824C (https=)
SG (1) SG160403A1 (https=)
TW (1) TW200830486A (https=)
WO (1) WO2008032620A1 (https=)

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US9941245B2 (en) * 2007-09-25 2018-04-10 Intel Corporation Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate
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US8399773B2 (en) * 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8502399B2 (en) * 2009-06-22 2013-08-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor and semiconductor device
CN101735562B (zh) * 2009-12-11 2012-09-26 广东生益科技股份有限公司 环氧树脂组合物及其制备方法及采用其制作的层压材料及覆铜箔层压板
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JP5593897B2 (ja) * 2010-07-12 2014-09-24 住友ベークライト株式会社 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法
JP2012049423A (ja) * 2010-08-30 2012-03-08 Sumitomo Bakelite Co Ltd 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法
KR101455951B1 (ko) 2010-09-30 2014-10-28 히타치가세이가부시끼가이샤 접착제 조성물, 반도체 장치의 제조 방법 및 반도체 장치
KR101464454B1 (ko) * 2010-10-22 2014-11-21 히타치가세이가부시끼가이샤 접착제 조성물, 반도체 장치의 제조 방법 및 반도체 장치
US20120156474A1 (en) * 2010-12-20 2012-06-21 E. I. Du Pont De Nemours And Company Article having curable coating comprising imidazolium monocarboxylate salt
US8969732B2 (en) 2011-09-28 2015-03-03 Ibiden Co., Ltd. Printed wiring board
WO2013136722A1 (ja) * 2012-03-14 2013-09-19 住友ベークライト株式会社 金属張積層板、プリント配線基板、半導体パッケージ、および半導体装置
US9218875B2 (en) 2013-03-14 2015-12-22 Globalfoundries Singapore Pte. Ltd. Resistive non-volatile memory
US9196356B2 (en) * 2013-03-14 2015-11-24 Globalfoundries Singapore Pte. Ltd. Stackable non-volatile memory
KR102130547B1 (ko) * 2013-03-27 2020-07-07 삼성디스플레이 주식회사 가요성 기판 및 이를 포함하는 가요성 표시 장치
US9155191B2 (en) 2013-05-31 2015-10-06 Qualcomm Incorporated Substrate comprising inorganic material that lowers the coefficient of thermal expansion (CTE) and reduces warpage
KR102116962B1 (ko) 2013-06-25 2020-05-29 삼성전자주식회사 반도체 패키지
US9778510B2 (en) * 2013-10-08 2017-10-03 Samsung Electronics Co., Ltd. Nanocrystal polymer composites and production methods thereof
KR20160140605A (ko) * 2014-03-28 2016-12-07 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 섬유 강화된 에폭시 복합 물품의 제조 방법, 얻어진 복합 물품 및 그의 용도
JP6212011B2 (ja) * 2014-09-17 2017-10-11 東芝メモリ株式会社 半導体製造装置
TWI526129B (zh) 2014-11-05 2016-03-11 Elite Material Co Ltd Multilayer printed circuit boards with dimensional stability
US20170287838A1 (en) * 2016-04-02 2017-10-05 Intel Corporation Electrical interconnect bridge
JP6793517B2 (ja) * 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ
US20180130768A1 (en) * 2016-11-09 2018-05-10 Unisem (M) Berhad Substrate Based Fan-Out Wafer Level Packaging
US20190259731A1 (en) * 2016-11-09 2019-08-22 Unisem (M) Berhad Substrate based fan-out wafer level packaging
JP6991014B2 (ja) * 2017-08-29 2022-01-12 キオクシア株式会社 半導体装置
KR102397902B1 (ko) * 2018-01-29 2022-05-13 삼성전자주식회사 반도체 패키지
JP7135364B2 (ja) * 2018-03-23 2022-09-13 三菱マテリアル株式会社 絶縁回路基板、及び、絶縁回路基板の製造方法
JP7289108B2 (ja) * 2019-02-21 2023-06-09 パナソニックＩｐマネジメント株式会社 半導体封止材料及び半導体装置
WO2021019707A1 (ja) * 2019-07-31 2021-02-04 株式会社Ｆｕｊｉ ３次元積層造形による回路配線の製造方法
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Also Published As

Publication number Publication date
EP1956648A1 (en) 2008-08-13
JPWO2008032620A1 (ja) 2010-01-21
CA2630824A1 (en) 2008-03-20
SG160403A1 (en) 2010-04-29
JP4802246B2 (ja) 2011-10-26
WO2008032620A1 (en) 2008-03-20
CN101356643B (zh) 2012-04-25
TW200830486A (en) 2008-07-16
KR101195408B1 (ko) 2012-10-29
KR20080091086A (ko) 2008-10-09
US20090267212A1 (en) 2009-10-29
CA2630824C (en) 2013-01-08
US8008767B2 (en) 2011-08-30
JP2010004050A (ja) 2010-01-07
KR20110000761A (ko) 2011-01-05
EP1956648A4 (en) 2011-09-21
CN101356643A (zh) 2009-01-28

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MM4A Annulment or lapse of patent due to non-payment of fees