TWI361727B - Coating apparatus and coating method - Google Patents

Coating apparatus and coating method Download PDF

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Publication number
TWI361727B
TWI361727B TW097125898A TW97125898A TWI361727B TW I361727 B TWI361727 B TW I361727B TW 097125898 A TW097125898 A TW 097125898A TW 97125898 A TW97125898 A TW 97125898A TW I361727 B TWI361727 B TW I361727B
Authority
TW
Taiwan
Prior art keywords
substrate
nozzle
liquid
coating
pump
Prior art date
Application number
TW097125898A
Other languages
English (en)
Chinese (zh)
Other versions
TW200918175A (en
Inventor
Yoshiaki Masu
Akihiro Shimizu
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200918175A publication Critical patent/TW200918175A/zh
Application granted granted Critical
Publication of TWI361727B publication Critical patent/TWI361727B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW097125898A 2007-07-24 2008-07-09 Coating apparatus and coating method TWI361727B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007192259A JP5303125B2 (ja) 2007-07-24 2007-07-24 塗布装置及び塗布方法

Publications (2)

Publication Number Publication Date
TW200918175A TW200918175A (en) 2009-05-01
TWI361727B true TWI361727B (en) 2012-04-11

Family

ID=40399724

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097125898A TWI361727B (en) 2007-07-24 2008-07-09 Coating apparatus and coating method

Country Status (3)

Country Link
JP (1) JP5303125B2 (ko)
KR (1) KR100953850B1 (ko)
TW (1) TWI361727B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102115171B1 (ko) * 2013-02-01 2020-05-26 세메스 주식회사 기판 부상 유닛 및 기판 처리 장치
JP6709601B2 (ja) * 2015-10-06 2020-06-17 東京応化工業株式会社 塗布装置及び塗布方法
JP6655450B2 (ja) * 2016-03-31 2020-02-26 東京応化工業株式会社 塗布装置及び塗布方法
JP6725374B2 (ja) * 2016-09-13 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN108789791A (zh) * 2018-08-06 2018-11-13 江西佳宇陶瓷有限公司 一种具有烘干功能的直角瓦生产用染色装置
JP7274356B2 (ja) * 2019-06-11 2023-05-16 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3911454A1 (de) * 1989-04-07 1990-10-11 Behr Industrieanlagen Dachmaschine
JP3541467B2 (ja) * 1994-12-28 2004-07-14 東レ株式会社 枚葉塗工装置およびその方法
JP3245813B2 (ja) 1996-11-27 2002-01-15 東京エレクトロン株式会社 塗布膜形成装置
JP4614509B2 (ja) * 2000-07-31 2011-01-19 大日本印刷株式会社 塗布装置および塗布方法
JP2002244467A (ja) * 2001-02-19 2002-08-30 Sharp Corp 定着装置
JP4363046B2 (ja) * 2003-01-24 2009-11-11 東レ株式会社 塗布装置および塗布方法並びにディスプレイ用部材の製造方法
KR100937703B1 (ko) * 2003-03-06 2010-01-20 삼성전자주식회사 슬릿 코터 및 이를 이용한 포토레지스트 도포 장치
JP2004281645A (ja) * 2003-03-14 2004-10-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4490797B2 (ja) * 2004-01-23 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
JP4049751B2 (ja) * 2004-02-05 2008-02-20 東京エレクトロン株式会社 塗布膜形成装置
JP4040025B2 (ja) * 2004-02-20 2008-01-30 東京エレクトロン株式会社 塗布膜形成装置
JP2006159073A (ja) * 2004-12-06 2006-06-22 Seiko Epson Corp 機能液供給装置、およびこれを備えた液滴吐出装置、電気光学装置の製造方法、電気光学装置、および電子機器
JP2006281189A (ja) * 2005-04-04 2006-10-19 Mikuni Denshi Kk インクジェット塗布溶液と乾燥方法
JP4570545B2 (ja) * 2005-09-22 2010-10-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR100698926B1 (ko) 2005-11-22 2007-03-23 주식회사 케이씨텍 기판 코팅 장치

Also Published As

Publication number Publication date
JP5303125B2 (ja) 2013-10-02
TW200918175A (en) 2009-05-01
KR100953850B1 (ko) 2010-04-20
JP2009028577A (ja) 2009-02-12
KR20090010897A (ko) 2009-01-30

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