TWI359273B - - Google Patents
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- Publication number
- TWI359273B TWI359273B TW096143670A TW96143670A TWI359273B TW I359273 B TWI359273 B TW I359273B TW 096143670 A TW096143670 A TW 096143670A TW 96143670 A TW96143670 A TW 96143670A TW I359273 B TWI359273 B TW I359273B
- Authority
- TW
- Taiwan
- Prior art keywords
- test
- bracket
- electronic component
- transport
- carrier
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/325542 WO2008075439A1 (ja) | 2006-12-21 | 2006-12-21 | 電子部品試験装置及び電子部品の試験方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200827726A TW200827726A (en) | 2008-07-01 |
TWI359273B true TWI359273B (de) | 2012-03-01 |
Family
ID=39536078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096143670A TW200827726A (en) | 2006-12-21 | 2007-11-19 | Electronic component testing equipment and method of testing electronic component |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5022381B2 (de) |
KR (1) | KR101158064B1 (de) |
CN (1) | CN101563620A (de) |
TW (1) | TW200827726A (de) |
WO (1) | WO2008075439A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5840403B2 (ja) * | 2011-07-11 | 2016-01-06 | オリオン機械株式会社 | 環境試験装置 |
JP2013053991A (ja) * | 2011-09-06 | 2013-03-21 | Seiko Epson Corp | ハンドラー及び部品検査装置 |
KR101644481B1 (ko) * | 2011-12-08 | 2016-08-02 | (주)테크윙 | 테스트핸들러 |
JP2013137284A (ja) * | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
CN103852710B (zh) * | 2012-11-29 | 2017-08-15 | 鸿劲科技股份有限公司 | 对置式电子组件作业设备 |
KR102254494B1 (ko) * | 2015-04-30 | 2021-05-24 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
KR102252638B1 (ko) * | 2015-05-04 | 2021-05-17 | (주)테크윙 | 테스트핸들러용 인서트 |
CN105548787B (zh) * | 2015-11-30 | 2018-12-28 | 东莞市冠佳电子设备有限公司 | 电源自动测试系统 |
KR102461321B1 (ko) * | 2017-08-18 | 2022-11-02 | (주)테크윙 | 전자부품 테스트용 핸들러 |
KR102663462B1 (ko) * | 2018-11-07 | 2024-05-09 | (주)테크윙 | 핸들러 |
JP2022021239A (ja) * | 2020-07-21 | 2022-02-02 | 株式会社アドバンテスト | 電子部品ハンドリング装置及び電子部品試験装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH079825U (ja) * | 1993-06-16 | 1995-02-10 | 村田機械株式会社 | リトライ機能付きコンベア装置 |
JPH1138083A (ja) * | 1997-07-14 | 1999-02-12 | Advantest Corp | Icテストハンドラ |
JP4164182B2 (ja) * | 1999-01-11 | 2008-10-08 | 株式会社アドバンテスト | トレイ移送装置 |
TW533317B (en) * | 1999-01-11 | 2003-05-21 | Advantest Corp | Testing device for electronic device substrate |
-
2006
- 2006-12-21 WO PCT/JP2006/325542 patent/WO2008075439A1/ja active Application Filing
- 2006-12-21 JP JP2008550028A patent/JP5022381B2/ja not_active Expired - Fee Related
- 2006-12-21 KR KR1020097013594A patent/KR101158064B1/ko active IP Right Grant
- 2006-12-21 CN CNA2006800567097A patent/CN101563620A/zh active Pending
-
2007
- 2007-11-19 TW TW096143670A patent/TW200827726A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2008075439A1 (ja) | 2008-06-26 |
KR101158064B1 (ko) | 2012-06-18 |
JPWO2008075439A1 (ja) | 2010-04-08 |
JP5022381B2 (ja) | 2012-09-12 |
TW200827726A (en) | 2008-07-01 |
CN101563620A (zh) | 2009-10-21 |
KR20090095617A (ko) | 2009-09-09 |
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