TWI351092B - Stack package utilizing through vias and re-distribution lines - Google Patents

Stack package utilizing through vias and re-distribution lines

Info

Publication number
TWI351092B
TWI351092B TW095149654A TW95149654A TWI351092B TW I351092 B TWI351092 B TW I351092B TW 095149654 A TW095149654 A TW 095149654A TW 95149654 A TW95149654 A TW 95149654A TW I351092 B TWI351092 B TW I351092B
Authority
TW
Taiwan
Prior art keywords
vias
distribution lines
stack package
package utilizing
utilizing
Prior art date
Application number
TW095149654A
Other languages
English (en)
Other versions
TW200737482A (en
Inventor
Seung Hyun Lee
Min Suk Suh
Original Assignee
Hynix Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of TW200737482A publication Critical patent/TW200737482A/zh
Application granted granted Critical
Publication of TWI351092B publication Critical patent/TWI351092B/zh

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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L25/0657—Stacked arrangements of devices
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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US7598617B2 (en) 2009-10-06
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