TWI369765B - Package and semiconductor device - Google Patents

Package and semiconductor device

Info

Publication number
TWI369765B
TWI369765B TW097130230A TW97130230A TWI369765B TW I369765 B TWI369765 B TW I369765B TW 097130230 A TW097130230 A TW 097130230A TW 97130230 A TW97130230 A TW 97130230A TW I369765 B TWI369765 B TW I369765B
Authority
TW
Taiwan
Prior art keywords
package
semiconductor device
semiconductor
Prior art date
Application number
TW097130230A
Other languages
Chinese (zh)
Other versions
TW200939419A (en
Inventor
Inui Tsuyoshi
Kado Hideo
Kawamoto Yoshinobu
Original Assignee
Panasonic Electric Works Sunx
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Sunx filed Critical Panasonic Electric Works Sunx
Publication of TW200939419A publication Critical patent/TW200939419A/en
Application granted granted Critical
Publication of TWI369765B publication Critical patent/TWI369765B/en

Links

TW097130230A 2007-08-10 2008-08-08 Package and semiconductor device TWI369765B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007210064 2007-08-10
JP2008185349A JP4479839B2 (en) 2007-08-10 2008-07-16 Package and semiconductor device

Publications (2)

Publication Number Publication Date
TW200939419A TW200939419A (en) 2009-09-16
TWI369765B true TWI369765B (en) 2012-08-01

Family

ID=40390853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097130230A TWI369765B (en) 2007-08-10 2008-08-08 Package and semiconductor device

Country Status (3)

Country Link
JP (2) JP4479839B2 (en)
CN (1) CN101364580B (en)
TW (1) TWI369765B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
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CN102906497B (en) * 2010-01-27 2016-08-17 熔合Uv系统公司 The high heat load light-emitting device of microchannel cooling
CN102741608B (en) * 2010-02-02 2014-10-29 夏普株式会社 Lighting device, display device, and television reception device
JP2012074423A (en) * 2010-09-27 2012-04-12 Panasonic Electric Works Sunx Co Ltd Led module
CN102537697A (en) * 2010-12-21 2012-07-04 格拉维顿莱特有限公司 Illuminating device and assembling method
EP2756221B1 (en) * 2011-09-16 2016-08-10 Air Motion Systems, Inc. Assembly and interconnection method for high-power led devices
JP5949262B2 (en) * 2011-11-18 2016-07-06 岩崎電気株式会社 Light emitting element module and lighting apparatus
JP6208563B2 (en) * 2013-11-28 2017-10-04 国立大学法人 東京大学 UV irradiation equipment
US9664371B2 (en) * 2015-01-15 2017-05-30 Heraeus Noblelight America Llc Lamp head assemblies and methods of assembling the same
JP6411572B1 (en) * 2017-03-29 2018-10-24 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 Light emitting device and light irradiation device including the light emitting device
DE102019200478A1 (en) * 2019-01-16 2020-07-16 Heraeus Noblelight Gmbh LIGHT SOURCE WITH AT LEAST ONE FIRST LIGHT-EMITTING SEMICONDUCTOR COMPONENT, A FIRST CARRIER ELEMENT AND A DISTRIBUTION ELEMENT
CN111293205B (en) * 2020-02-24 2021-07-13 东南大学 Manufacturing method of detachable light source substrate

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CA1021047A (en) * 1973-06-25 1977-11-15 Niels J. Hansen Light emitting diode assembly
JPS54159B2 (en) * 1974-08-23 1979-01-06
JPS51101481A (en) * 1975-03-05 1976-09-07 Hitachi Ltd
JPS51101482A (en) * 1975-03-05 1976-09-07 Hitachi Ltd
JPS51101479A (en) * 1975-03-05 1976-09-07 Hitachi Ltd
JPS58114056U (en) * 1982-01-27 1983-08-04 和泉電気株式会社 light emitting diode
JPH02134260A (en) * 1988-11-15 1990-05-23 Seiko Epson Corp Optical printing head
JPH03145774A (en) * 1989-10-31 1991-06-20 Kyocera Corp Image forming device
JPH0997923A (en) * 1995-09-28 1997-04-08 Sanyo Electric Co Ltd Circuit unit
DE10061265A1 (en) * 2000-12-06 2002-06-27 Jenoptik Jena Gmbh The diode laser assembly
CN100547282C (en) * 2002-04-25 2009-10-07 林原 Flexiblel ight-emitting unit and manufacture method thereof
JP2004140098A (en) * 2002-10-16 2004-05-13 Hamamatsu Photonics Kk Method of fixing semiconductor laser bar
US7204615B2 (en) * 2003-03-31 2007-04-17 Lumination Llc LED light with active cooling
JP2005158957A (en) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd Light emitting device
JP4676335B2 (en) * 2003-09-19 2011-04-27 パナソニック株式会社 Lighting equipment
JP4934954B2 (en) * 2003-10-15 2012-05-23 日亜化学工業株式会社 Heat sink and semiconductor device provided with heat sink
EP1681728B1 (en) * 2003-10-15 2018-11-21 Nichia Corporation Light-emitting device
JP2007019265A (en) * 2005-07-07 2007-01-25 Sony Corp Light emitting device
JP4492486B2 (en) * 2005-08-24 2010-06-30 パナソニック電工株式会社 Lighting equipment using LED
JP4623730B2 (en) * 2005-10-11 2011-02-02 シチズン電子株式会社 Light emitting diode light source using light emitting diode light source unit
JP2007109879A (en) * 2005-10-13 2007-04-26 Toyoda Gosei Co Ltd Led module and led light emitting device
EP1780804A1 (en) * 2005-10-25 2007-05-02 L&C Lighting Technology Corp. LED device with an active heat-dissipation device
JP2007134376A (en) * 2005-11-08 2007-05-31 Akita Denshi Systems:Kk Light emitting diode, and method of manufacturing same
JP2009064986A (en) * 2007-09-06 2009-03-26 Panasonic Electric Works Co Ltd Light source device

Also Published As

Publication number Publication date
TW200939419A (en) 2009-09-16
JP2009065127A (en) 2009-03-26
JP4479839B2 (en) 2010-06-09
CN101364580B (en) 2011-07-13
JP2009296021A (en) 2009-12-17
JP4670985B2 (en) 2011-04-13
CN101364580A (en) 2009-02-11

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees