TWI344173B - - Google Patents

Download PDF

Info

Publication number
TWI344173B
TWI344173B TW096111665A TW96111665A TWI344173B TW I344173 B TWI344173 B TW I344173B TW 096111665 A TW096111665 A TW 096111665A TW 96111665 A TW96111665 A TW 96111665A TW I344173 B TWI344173 B TW I344173B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning
nozzles
processing
nozzle
Prior art date
Application number
TW096111665A
Other languages
English (en)
Chinese (zh)
Other versions
TW200746255A (en
Inventor
Futoshi Shimai
Shigeru Kawata
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200746255A publication Critical patent/TW200746255A/zh
Application granted granted Critical
Publication of TWI344173B publication Critical patent/TWI344173B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW096111665A 2006-04-12 2007-04-02 Substrate processing apparatus TW200746255A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006110147A JP4878900B2 (ja) 2006-04-12 2006-04-12 基板処理装置

Publications (2)

Publication Number Publication Date
TW200746255A TW200746255A (en) 2007-12-16
TWI344173B true TWI344173B (enExample) 2011-06-21

Family

ID=38603637

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096111665A TW200746255A (en) 2006-04-12 2007-04-02 Substrate processing apparatus

Country Status (5)

Country Link
US (1) US20070240642A1 (enExample)
JP (1) JP4878900B2 (enExample)
KR (1) KR20070101770A (enExample)
CN (1) CN101055833A (enExample)
TW (1) TW200746255A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101281376B (zh) * 2008-01-31 2010-12-15 深超光电（深圳）有限公司 龙门式光罩清洁装置
KR101341013B1 (ko) * 2008-09-04 2013-12-13 엘지디스플레이 주식회사 세정 장치
CN102319699A (zh) * 2011-06-29 2012-01-18 彩虹（佛山）平板显示有限公司 一种tft基板的清洗装置
DE102012209902A1 (de) * 2012-06-13 2013-12-19 Singulus Stangl Solar Gmbh Verfahren und Vorrichtung zum Behandeln von Halbleiterstäben mit einer Flüssigkeit oder einem Gas
US8960123B2 (en) * 2013-02-08 2015-02-24 Enki Technology, Inc. Coating and curing apparatus and methods
CN104253023B (zh) * 2013-06-27 2017-05-17 细美事有限公司 基板处理装置
CN103712428B (zh) * 2013-12-16 2016-02-03 京东方科技集团股份有限公司 一种干燥装置
CN103752571B (zh) * 2013-12-27 2017-08-08 深圳市华星光电技术有限公司 基板清洗装置
CN104741333B (zh) * 2015-04-07 2017-04-05 合肥鑫晟光电科技有限公司 一种气流控制装置及其调节方法、基板清洗设备
JP2018065109A (ja) * 2016-10-20 2018-04-26 東京応化工業株式会社 洗浄装置および洗浄方法
CN111457692B (zh) * 2019-01-18 2021-08-24 弘塑科技股份有限公司 批次基板干燥设备及其基板干燥风刀装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5494529A (en) * 1994-02-22 1996-02-27 Atotech Usa, Inc. Treatment method for cleaning and drying printed circuit boards and the like
JP2004095926A (ja) * 2002-09-02 2004-03-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2005150266A (ja) * 2003-11-13 2005-06-09 Pioneer Plasma Display Corp プラズマディスプレイパネル製造方法，プラズマ表示装置製造方法，及び表示パネル処理装置
JP4426342B2 (ja) * 2004-03-08 2010-03-03 株式会社日立ハイテクノロジーズ 真空処理装置

Also Published As

Publication number Publication date
US20070240642A1 (en) 2007-10-18
TW200746255A (en) 2007-12-16
JP2007287753A (ja) 2007-11-01
KR20070101770A (ko) 2007-10-17
CN101055833A (zh) 2007-10-17
JP4878900B2 (ja) 2012-02-15

Similar Documents

Publication Publication Date Title
TWI344173B (enExample)
TWI360836B (en) Substrate processing apparatus
CN101114578B (zh) 基板处理方法及基板处理装置
TWI449098B (zh) 基板處理裝置
CN101733258B (zh) 清洗装置
KR100671251B1 (ko) 기판 처리 장치
US6365531B1 (en) Cleaning and drying method and apparatus for manufacturing semiconductor devices
JP2020533789A (ja) 半導体ウェハの洗浄方法及び洗浄装置
JP3628919B2 (ja) 基板処理装置および基板処理方法
JP5593233B2 (ja) 片面式高スループットの湿式エッチングおよび湿式処理装置および方法
TWI290737B (en) Apparatus and method for treating a panel
KR20110077045A (ko) 로봇 세정 모듈 및 이를 포함하는 기판 세정 장치
KR101293394B1 (ko) 기판 처리 장치, 기판 처리 방법, 및 기판 처리 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
JP3863086B2 (ja) 基板処理装置
KR100864262B1 (ko) 반도체 웨이퍼 세정장치
KR100691473B1 (ko) 기판건조용 에어나이프 모듈 및 이를 이용한 기판건조장치
JP2004006631A (ja) 基板処理装置
JPH0758070A (ja) 洗浄装置
JP2019162748A (ja) 版洗浄装置および版洗浄方法
TW200843868A (en) Liquid treatment device
KR20110080335A (ko) 세정 장치
KR20220002012A (ko) 인라인 타입의 초박형 기판 세정 장치
JP2002179245A (ja) 搬送式基板処理装置
JP5906035B2 (ja) 塗布装置
KR100837628B1 (ko) 기판 처리 장치 및 이를 이용한 기판 처리 방법

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees