KR20070101770A - 기판 처리장치 - Google Patents

기판 처리장치 Download PDF

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Publication number
KR20070101770A
KR20070101770A KR1020070032730A KR20070032730A KR20070101770A KR 20070101770 A KR20070101770 A KR 20070101770A KR 1020070032730 A KR1020070032730 A KR 1020070032730A KR 20070032730 A KR20070032730 A KR 20070032730A KR 20070101770 A KR20070101770 A KR 20070101770A
Authority
KR
South Korea
Prior art keywords
substrate
board
nozzle
processing
rinse liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020070032730A
Other languages
English (en)
Korean (ko)
Inventor
후토시 시마이
시게루 가와타
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20070101770A publication Critical patent/KR20070101770A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020070032730A 2006-04-12 2007-04-03 기판 처리장치 Ceased KR20070101770A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006110147A JP4878900B2 (ja) 2006-04-12 2006-04-12 基板処理装置
JPJP-P-2006-00110147 2006-04-12

Publications (1)

Publication Number Publication Date
KR20070101770A true KR20070101770A (ko) 2007-10-17

Family

ID=38603637

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070032730A Ceased KR20070101770A (ko) 2006-04-12 2007-04-03 기판 처리장치

Country Status (5)

Country Link
US (1) US20070240642A1 (enExample)
JP (1) JP4878900B2 (enExample)
KR (1) KR20070101770A (enExample)
CN (1) CN101055833A (enExample)
TW (1) TW200746255A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101281376B (zh) * 2008-01-31 2010-12-15 深超光电（深圳）有限公司 龙门式光罩清洁装置
KR101341013B1 (ko) * 2008-09-04 2013-12-13 엘지디스플레이 주식회사 세정 장치
CN102319699A (zh) * 2011-06-29 2012-01-18 彩虹（佛山）平板显示有限公司 一种tft基板的清洗装置
DE102012209902A1 (de) * 2012-06-13 2013-12-19 Singulus Stangl Solar Gmbh Verfahren und Vorrichtung zum Behandeln von Halbleiterstäben mit einer Flüssigkeit oder einem Gas
US8960123B2 (en) * 2013-02-08 2015-02-24 Enki Technology, Inc. Coating and curing apparatus and methods
CN104253023B (zh) * 2013-06-27 2017-05-17 细美事有限公司 基板处理装置
CN103712428B (zh) * 2013-12-16 2016-02-03 京东方科技集团股份有限公司 一种干燥装置
CN103752571B (zh) * 2013-12-27 2017-08-08 深圳市华星光电技术有限公司 基板清洗装置
CN104741333B (zh) * 2015-04-07 2017-04-05 合肥鑫晟光电科技有限公司 一种气流控制装置及其调节方法、基板清洗设备
JP2018065109A (ja) * 2016-10-20 2018-04-26 東京応化工業株式会社 洗浄装置および洗浄方法
CN111457692B (zh) * 2019-01-18 2021-08-24 弘塑科技股份有限公司 批次基板干燥设备及其基板干燥风刀装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5494529A (en) * 1994-02-22 1996-02-27 Atotech Usa, Inc. Treatment method for cleaning and drying printed circuit boards and the like
JP2004095926A (ja) * 2002-09-02 2004-03-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2005150266A (ja) * 2003-11-13 2005-06-09 Pioneer Plasma Display Corp プラズマディスプレイパネル製造方法，プラズマ表示装置製造方法，及び表示パネル処理装置
JP4426342B2 (ja) * 2004-03-08 2010-03-03 株式会社日立ハイテクノロジーズ 真空処理装置

Also Published As

Publication number Publication date
TWI344173B (enExample) 2011-06-21
US20070240642A1 (en) 2007-10-18
TW200746255A (en) 2007-12-16
JP2007287753A (ja) 2007-11-01
CN101055833A (zh) 2007-10-17
JP4878900B2 (ja) 2012-02-15

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