JP4878900B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP4878900B2
JP4878900B2 JP2006110147A JP2006110147A JP4878900B2 JP 4878900 B2 JP4878900 B2 JP 4878900B2 JP 2006110147 A JP2006110147 A JP 2006110147A JP 2006110147 A JP2006110147 A JP 2006110147A JP 4878900 B2 JP4878900 B2 JP 4878900B2
Authority
JP
Japan
Prior art keywords
substrate
processing
nozzle groups
nozzle
rows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006110147A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007287753A (ja
Inventor
太 島井
茂 河田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2006110147A priority Critical patent/JP4878900B2/ja
Priority to TW096111665A priority patent/TW200746255A/zh
Priority to KR1020070032730A priority patent/KR20070101770A/ko
Priority to CNA2007100958523A priority patent/CN101055833A/zh
Priority to US11/786,202 priority patent/US20070240642A1/en
Publication of JP2007287753A publication Critical patent/JP2007287753A/ja
Application granted granted Critical
Publication of JP4878900B2 publication Critical patent/JP4878900B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2006110147A 2006-04-12 2006-04-12 基板処理装置 Expired - Fee Related JP4878900B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006110147A JP4878900B2 (ja) 2006-04-12 2006-04-12 基板処理装置
TW096111665A TW200746255A (en) 2006-04-12 2007-04-02 Substrate processing apparatus
KR1020070032730A KR20070101770A (ko) 2006-04-12 2007-04-03 기판 처리장치
CNA2007100958523A CN101055833A (zh) 2006-04-12 2007-04-10 基板处理装置
US11/786,202 US20070240642A1 (en) 2006-04-12 2007-04-11 Substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006110147A JP4878900B2 (ja) 2006-04-12 2006-04-12 基板処理装置

Publications (2)

Publication Number Publication Date
JP2007287753A JP2007287753A (ja) 2007-11-01
JP4878900B2 true JP4878900B2 (ja) 2012-02-15

Family

ID=38603637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006110147A Expired - Fee Related JP4878900B2 (ja) 2006-04-12 2006-04-12 基板処理装置

Country Status (5)

Country Link
US (1) US20070240642A1 (enExample)
JP (1) JP4878900B2 (enExample)
KR (1) KR20070101770A (enExample)
CN (1) CN101055833A (enExample)
TW (1) TW200746255A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101281376B (zh) * 2008-01-31 2010-12-15 深超光电（深圳）有限公司 龙门式光罩清洁装置
KR101341013B1 (ko) * 2008-09-04 2013-12-13 엘지디스플레이 주식회사 세정 장치
CN102319699A (zh) * 2011-06-29 2012-01-18 彩虹（佛山）平板显示有限公司 一种tft基板的清洗装置
DE102012209902A1 (de) * 2012-06-13 2013-12-19 Singulus Stangl Solar Gmbh Verfahren und Vorrichtung zum Behandeln von Halbleiterstäben mit einer Flüssigkeit oder einem Gas
US8960123B2 (en) * 2013-02-08 2015-02-24 Enki Technology, Inc. Coating and curing apparatus and methods
CN104253023B (zh) * 2013-06-27 2017-05-17 细美事有限公司 基板处理装置
CN103712428B (zh) * 2013-12-16 2016-02-03 京东方科技集团股份有限公司 一种干燥装置
CN103752571B (zh) * 2013-12-27 2017-08-08 深圳市华星光电技术有限公司 基板清洗装置
CN104741333B (zh) * 2015-04-07 2017-04-05 合肥鑫晟光电科技有限公司 一种气流控制装置及其调节方法、基板清洗设备
JP2018065109A (ja) * 2016-10-20 2018-04-26 東京応化工業株式会社 洗浄装置および洗浄方法
CN111457692B (zh) * 2019-01-18 2021-08-24 弘塑科技股份有限公司 批次基板干燥设备及其基板干燥风刀装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5494529A (en) * 1994-02-22 1996-02-27 Atotech Usa, Inc. Treatment method for cleaning and drying printed circuit boards and the like
JP2004095926A (ja) * 2002-09-02 2004-03-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2005150266A (ja) * 2003-11-13 2005-06-09 Pioneer Plasma Display Corp プラズマディスプレイパネル製造方法，プラズマ表示装置製造方法，及び表示パネル処理装置
JP4426342B2 (ja) * 2004-03-08 2010-03-03 株式会社日立ハイテクノロジーズ 真空処理装置

Also Published As

Publication number Publication date
TWI344173B (enExample) 2011-06-21
US20070240642A1 (en) 2007-10-18
TW200746255A (en) 2007-12-16
JP2007287753A (ja) 2007-11-01
KR20070101770A (ko) 2007-10-17
CN101055833A (zh) 2007-10-17

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