TWI290737B - Apparatus and method for treating a panel - Google Patents

Apparatus and method for treating a panel Download PDF

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Publication number
TWI290737B
TWI290737B TW094109329A TW94109329A TWI290737B TW I290737 B TWI290737 B TW I290737B TW 094109329 A TW094109329 A TW 094109329A TW 94109329 A TW94109329 A TW 94109329A TW I290737 B TWI290737 B TW I290737B
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TW
Taiwan
Prior art keywords
plate
flat
photoresist
suction
processing system
Prior art date
Application number
TW094109329A
Other languages
Chinese (zh)
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TW200537610A (en
Inventor
Yong-Seok Park
Original Assignee
Dms Co Ltd
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Publication of TW200537610A publication Critical patent/TW200537610A/en
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Publication of TWI290737B publication Critical patent/TWI290737B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning In General (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A panel treatment system including: a loader for loading a panel from a cassette to a process line; an I-type panel process line for (a) performing a stripping process for the panel, (b) cleaning the panel by spraying de-ionized water onto the stripped panel, and removing the water, and (c) drying the cleaning panel; and an unloader for unloading the panel from the panel process line.

Description

1290737 九、發明說明: 【發明所屬之技術領域】 本發明係有關於-種用於 別是有關於一猶用私, 卞㈣糸統和方法,特 有關方、種用於加工平板的系統和方法, 光阻設備具有改良的抽吸效 ^ 口去 的設備,r效咸少用於移除藥劑 心鈿紐生產線長度以及改良空間效率。 【先前技術】 1 通常塊平板(例如用於平板顯示器 液晶顯示器、光罩破殖望楚从τ 干导體曰曰囫、 制…士 罩玻璃專4的平面板子)係、經過一連串的 春:'線加工過’諸如光阻塗覆製程、曝光製程、顯影 4圖製程、去光阻製程、清潔製程、乾燥製程等等。 板力二一個用於執行去光阻製程之先前技術的平 載f且韓:圖中所顯示’ 一塊平板係從-個卡Ε1中卸 載並且轉移至一伽胜鲁σ»、〇 阻浴槽3。 〜。衣载器2係饋送平板至去光 去光阻至去光阻冷槽3的平板係經歷去光阻製程,在 、壬之後該平板被饋送至-個去光阻劑中和單元 該去光阻劑能夠藉由一種有機溶劑(例如異丙醇 光阻…、、二f亞硬(DMS〇)等等)中和。如果去 去二’又被中和’去光阻劑可能會與隨後清潔製程中的 ,, 夂應而扣壞平板之一薄膜表面。亦即是, 先阻劑的中和作用係防止平板的薄膜表面被損壞。 Η襄私之後,該平板係經由-個旋轉器5轉移至 5 (S) I290737 第 π〉糸單元β,以便使得殘留在平彡I 溶劑萨釣一丄 久运在干板表面上的有機 ^月b夠猎由去離子水移除。 亦即是,該平板係經由一個運送 清潔單 逆、凌置轉移至一個第一 行清潔製程。 鹿到千板的表面上以執 接著,該平板係進一步經由一個 個第二清、,簞开Q斗^ 疋轉时7而轉移至一 清清潔單元8係具有兩個與第一 /月办早凡6相同的淋浴槽。 1L^、弟 旋轉斋5和γ較佳地被安裳成一 state)以忐 絲 虛置狀態(dummy 空間使用。 万式轉移千板,從而提供有效的 已經經歷第二清嘹置—〇 1 及—:氣刀U時被的平板係在通過一個水刀9 個機械手臂轉多至-個卸载器11並且藉由- 主卞匣以破堆疊於1中。 然而,使用令和劑的中和作用係增加製 此外,雖然去光阻製程二 考量到大尺寸平板的㈣,針成為-種匚形狀, 制。 對於降低設備空間仍存有限 【發明内容】 因此,本發明已經 的問題。 於解決以上所描述之先前技術 因此,本發明之— 固目的為提供一種用於加工平板的 1290737 系統及方法,其係㈣有效地移除去光阻劑的需要,從而 降低製造成本。 本發明之另-個目的為提供—種用於加工平板的系統 及方法,其係能_由將—料光阻製㈣列成—種線性 形狀而使空間效率最大化。 為了達到上述之目的,本發明係提供一種平板加工系 統’包含.-裝載器用於從一卡匣裝載一平板到一製程生 產線;- ϊ型平板製程生產線用於(a)對該平板執行一 去光阻製程’(b)藉由錢去離子水至該去光阻的平板 上及移除去離子水來清潔該平板’以及(C )乾燥該清潔 的平板:以及一卸載器用於從該平板製程生產線中卸載該 平板G。 【實施方式】 現在將詳細地參照本發明之較佳實施例,這些例子4 說明在伴隨的®式中。只要有可能的話’相同的參考们 將被使用在所有的圖式中以參照相同或是相似之部件。 圖2係顯示一個根據本發明一 _施例之平板加工系衾 的視圖。 如圖所*,本發明之平板加工系統係形成在一個具巧 縮小長度的獨立型式生產绩卜f加 T t、 飞生座綠上(即,I型),其係被設i 成足以在一個縮小的長度中加工該平板。 該平板加卫系統係包含:_個卸載器用於從—個卡! 2 0處裝載-塊平板(圖3中之G )至一個製程生產線 1290737 .-個I型平板製程生產線2 i用於(a )在平板G上執行 -—個去光阻製程,(b )藉由噴灑去離子水至該去光阻之 平板G及移除該去離子水來清潔該平板,以及(c )乾燥 該清潔的平板,·以及-個卸载器用於從該平板製程生產線 2 1卸載該平板g。 ▲在以上所描述的平板加工系統之中,平板“系被堆疊 在设置於製程生產線之一側上的卡^ 2 〇中。一個例如是 •:械手臂的轉移裝置係從切20中將平板G-個—個地 轉移至裝載器2 2。 朴 w ΰ · 脚玄尤阻早兀2 衣精由塗敷一去光阻劑至由 w主由裝载斋2 2轉移來之平板 木執仃一個去光阻製程••一 — 個抽及早兀2 8用於噴灑去 千水至该去光阻平板G之一 # _ ^ , 表面上以及吸離該去離子水1290737 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a system for processing a flat plate, and a method and method for processing a flat plate. Method, the photoresist device has an improved suction effect device, and the r effect is less for removing the length of the drug heart and the production line and improving the space efficiency. [Prior Art] 1 Usually a flat plate (for example, a flat panel display for a flat panel display, a photomask, a slab, a slab, a slab, a slab, a slab), after a series of springs: 'Wire processing' such as photoresist coating process, exposure process, development process, photoresist process, cleaning process, drying process, etc. The plate force is used to perform the flat-loading of the prior art of the photoresist process and Han: The one shown in the figure is unloaded from the card 1 and transferred to a gamma sigma, and the bath is blocked. 3. ~. The clothes carrier 2 is a flat plate that feeds the flat plate to the light removing photoresist to the photoresist stop tank 3 and undergoes a photoresist removal process. After the crucible, the flat plate is fed to a photoresist removing unit and the light removing unit. The resist can be neutralized by an organic solvent such as isopropyl alcohol photo-resistance, di-f-hard (DMS, etc.). If you go to the second and then neutralized, the photoresist may be removed from the film surface with a subsequent cleaning process. That is, the neutralization of the first resist prevents the film surface of the flat plate from being damaged. After smuggling, the plate is transferred to the 5 (S) I290737 π>糸 unit β via a rotator 5, so that the organic residue remaining on the surface of the dry plate for a long time in the solvent I Month b is enough to be removed by deionized water. That is, the tablet is transferred to a first line cleaning process via a shipping cleaning unit. The deer goes to the surface of the Thousand Plates, and the plate is further transferred to the cleaning unit 8 through the second clearing, the opening of the Q bucket, and the cleaning unit 8 has two and the first/month office As early as 6 the same shower slot. 1L^, brother spins 5 and γ are preferably shackled into a state) in a sinuous state (dummy space is used. 10,000-type transfer of the thousand boards, thus providing effective already experienced second clearing - 〇 1 and —: The plate that was subjected to the air knife U was transferred to the unloader 11 by a hydraulic blade of 9 water jets and was broken into 1 by the main shovel. However, the neutralizing agent was used. In addition, although the photoresist removal process is considered to be a large-sized flat plate (four), the needle becomes a shape of the seed, and there is still a limitation in reducing the space of the device. [Invention] Therefore, the problem of the present invention has been solved. Prior Art as described above Accordingly, the present invention is directed to providing a 1290737 system and method for processing a flat panel that is capable of effectively removing photoresist removal, thereby reducing manufacturing costs. The purpose of the present invention is to provide a system and method for processing a flat panel, which is capable of maximizing space efficiency by arranging the photoresist (4) into a linear shape. To achieve the above object, the present invention is mention A flatbed processing system 'includes a loader for loading a flat plate from a cassette to a process line; - a flat type process line for (a) performing a photoresist removal process on the plate' (b) by money Deionized water is applied to the photoresist-removing plate and deionized water is removed to clean the plate' and (C) the cleaned plate is dried: and an unloader is used to unload the plate G from the flat-plate process line. Means will now be described in detail with reference to the preferred embodiments of the invention, which are illustrated in the accompanying <RTI ID=0.0>>> Figure 2 is a view showing a flat processing system according to an embodiment of the present invention. As shown in the figure, the flat processing system of the present invention is formed in a self-contained production type with a reduced length. T t, the constellation green (ie, type I), is set to be sufficient to process the plate in a reduced length. The flat-panel system includes: _ an unloader for the slave card! 2 0 Load-block plate (G in Figure 3) to a process line 1290737. An I-plate process line 2 i is used to (a) perform a photoresist process on the plate G, (b) by spraying Deionizing water to the photoresist plate G and removing the deionized water to clean the plate, and (c) drying the cleaned plate, and an unloader for unloading the plate from the flat process line 2 1 g. ▲In the flatbed processing system described above, the flat plate is “stacked in a card set on one side of the process line. One such as: • The transfer device of the arm is cut from the 20 Transfer the plates G-to-load to the loader 2 2 . 朴 w ΰ · 脚 尤 阻 阻 兀 由 由 由 由 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷 涂敷Wood is a process to go to the photoresist ••一—A pumping and early 兀2 8 is used to spray thousands of water to one of the photoresist plates G# _ ^ , on the surface and aspiring the deionized water

個清潔單元3 0用於在該平板G 清潔平板G ;以及一個乾焊 。 早兀 之 板G。 们乾知早凡3 Θ用於乾燥該清潔的, 更詳細而言,該去亦 _ 劑至竽;Τ # 早70 2 4是藉由塗敷一去光f 去光二二!移來的平板來執行去光阻製程- 便使得複數舶古 地由兩個浴槽2 5及2 6構成,t 數個南功率的唁《嘴 仍殘留在平杯r . 、 h夠破棱供來移除通過浴槽相 十板G之表面上的光阻。 於去中=板通過抽吸單元28時,使用 以及任何外來物f ;;二平板G之表面上的去光阻劑 勿貝犯夠糟由以去離子水噴灑平板以及在 1290737 抽吸單元2 8吸離去離子水而被移除。 如圖3中所顯示,該抽吸單元 個水喷灑部分以及一個去 8係較佳地包含有— 丨口云九阻劑抽吸部分。 ㈣是,該抽吸單元2δ係包含:_個 一 個氣簾48提供在浴槽中& 曰 , 呢H ^ + 4 〇中以防止清潔劑從浴槽4 0浪 漏出去’-對喷霧嘴5 〇和5 u洩Cleaning unit 30 is used to clean the flat plate G on the flat plate G; and a dry weld. Early board G. We know that 3 Θ is used to dry the cleaning, in more detail, it should be _ 剂 to 竽; Τ #早 70 2 4 is by applying a light to f to light two! The flat plate is used to perform the photoresist removal process - so that the complex ship is composed of two baths 2 5 and 26, and a number of south power 唁 "the mouth remains in the flat cup r. The photoresist on the surface of the ten-plate G through the bath phase. When going to the middle plate through the suction unit 28, use and any foreign matter f;; the photoresist on the surface of the two flat plates G is not bad enough to spray the plate with deionized water and at 1290737 suction unit 2 8 is removed by removing the deionized water. As shown in Fig. 3, the water spraying portion of the suction unit and a degassing unit preferably include a suction portion of the sputum cloud. (d) Yes, the suction unit 2δ system comprises: _ one air curtain 48 is provided in the bath & 曰, H ^ + 4 〇 to prevent the detergent from leaking out of the bath 40 '- to the spray nozzle 5 〇 And 5 u vent

上以移除附著在平板〇上的“ 月潔劑至平板G f隹十板G上的任何外來物質 組54設置在噴霧嘴5n 及抽及杈 ^ ^ , I務幫5 0與5 2之間以運用一壓 離清潔劑。 i刀左木及 在該抽吸單亓φ,i ^ p ^、 千板G係被裝载於運送裝置46上 m固形成在浴槽4〇中的入…而被導引入浴 在浴槽4 0中抽吸早凡中清潔過的平板G係經由-個形成 4 8 的出口 44而被排出浴槽4〇。 b 2係5又外成一種習知結構並且設置在 千板G上万以噴灑清潔劑至該平板的—個頂部表面上。 藉由喷灑清潔劑所產生的衝擊能量,附著在平板〇上 的外來物質及/或去光阻劑係從平板G移除以及由抽吸模 組5 4排出。 噴霧嘴5 〇和5 2係設置成面對彼此並且是傾斜的朝 向彼此。因此,從咱_ f趣 攸賀務噶5 0和5 2贺灑出的清潔劑係局 部地集中在平板卜,丨、;為处π + T t 以便使仔在平板上的流體能夠藉由抽 吸模組5 4有效地移除。 Λ抽吸模組5 4係較佳地設置成橫過該通過浴槽4 〇 運C農置4 6 ’以便使得清潔劑能夠從平板〇的整個地 ⑤ 1290737 區被抽吸。 亦即是’如圖4中所顯示,該抽吸模組5 4係包含: 一個本體5 9 ; —個流體通道6 〇藉由容許流體被壓縮及 流動而形成低壓:以及一個抽吸開口 6 2形成通過該本體 5 9之一底部以與流體通道6 〇連通以及使用由流體通道 6 0與抽吸開口 6 2之間的壓力差所產生之吸力來從平板 G抽吸清潔劑。 該本體5 9係形成如一個矩形的六面體,其中 通道6 0係例如藉由一壓模製程而形成縱向 形成在本體5 9之底部上的抽吸開口 6 2係形成縱 向。該抽吸開口 6 2係具有一個與流體通道6 〇相連通的 上部分以及一個開放至本體5 9之一外側的下部分。 因此,當流體通過該流體通道6 〇時,一個低壓狀態 係經由該流體流動而形成在流體通道6 〇的内部,以及抽 吸開口 6 2係具有一個相對地高M,藉此產生一個吸力以 從平板G抽吸清潔劑。 就此點而言,從噴霧嘴5 0和5 2到抽吸模組5 4之 :’的-段距離係能夠被適當地調整以便不會經由與 Θ及清潔劑的化學反應而損壞平板的薄膜。 被轉^照圖2,該已經通過抽吸單元28的平板G係 及轉移到清潔單元3 〇。 1糸 忒m潔單元3 〇可以由兩個清潔浴 成,每一個么心 僧3 2和3 4構 大個令槽係具有一個高功率的噴霧嘴(未顯示)。 因此’清潔製程能夠只使用兩個清潔浴槽及具有改良 10 1290737 機械功率的噴霧嘴來處理。 乾燥單元3 6係可以包含一氣 以高壓嘖屮r 、 亦「疋,該氣刀係 土贺出壓縮空氣來移除殘留在 來物質。 板上的水滴及/或外 如以上所描述,在乾燥罩开Q C山 藉由卸载哭3 8祜μ* 、 6中被乾燥的平板G係 丨秋為d 8被排出至一外側。 平板G係經歷一連串的製程 潔、以及乾燥製程。 ⑴去先阻、抽吸、清 該平板加工製程將描述於在下文中。 亦即是’如圖2至4以及 係包含以T步驟.楹# ^ a ”亥千板加工製程 00) I:""供―個具有-層薄膜的平板G(S1 u u ),猎由轉移平板G到一個本止π 丄 G與殘留光 先阻浴槽以及容許平板 CM . ^ , + 個去光阻製程(S 2 0 U ),猎由賀灑去離子水至 υ 移除殘留在平;fe G h i 以及吸離去離子水而 汊W隹干板G上的去光阻劑( G ( s 9 /1 π λ ^ b 2 2 0 ) ’·清潔平板 24〇);以及乾燥和卸載平板G (S3〇〇)。 在提供平板的步驟中(S 1 n n d姦括 υ ο ) ’平板係從設置在 生產線之一側上的卡匣2 〇中 AA、丁 t r出來。该從卡匣2 0中屮* 虼平板係藉由例如一個機械手 出末 飞』是被轉移至裝載器2 2。 在執行去光阻製程的步驟中 平板之表面上的光阻係藉由去光 ,忒殘留在 屯玄九阻製程而移除。 亦即是,該從裝載器22轉移至去光阻單元 板係通過在浴槽2 5和2 6中& g n & 的平 ^ 的弟一及第二去光阻製程。 就此點而言,去光阻劑係 紊光阻早凡中噴灑出以與 1290737 二I = 上的光阻起化學反應。結果,光阻係被脫層 板G,亚且容許一個預定圖案被保留在平板G上。 在步騾S 2 2 0中,去光阻劑係從平板中被移除。 於運tr,該在去光阻單元24中加工的平板係被裝载 I凌置4 6上並且經由形成在浴槽4 〇上的入口 而被導引入浴槽4 〇中。 接著,該平板G係通過該對噴霧嘴5 〇和5 2所設置 、们°卩分。就此點而言,該清潔劑係從噴霧嘴5 〇和5 Ή灑至平板G的頂部表面上。㈣光阻劑及任何外來 物質係藉由噴灑清潔劑所產生的衝擊能量而被移離該平板 就此點而言,該抽吸模組5 4係設置在該喷霧嘴5 〇 和5 2之間以快速地從平板G抽吸流體。 ^更洋細的描述,當流體通過形成在抽吸模組5 4之本 體5 9中的流體通道6 〇時,低壓係被形成在該抽吸開口 的周圍。 就此點而言,該抽吸開口 6 2係具有一個與流體通道 〇相連通的上部分以及以及一個開放至本體5 9之外側 的下部分。 一 口此,备流體通過流體通道Θ 0時,一個低壓狀態係 藉由Μ體流動而形成在該流體通道6 〇的内部,並且該抽 吸開口 6 2係具有一個相對地高壓,藉此產生一個吸力以 從平板G抽吸清潔劑。 六、^而° ’由於去離子水與去光阻劑的化學反應可 12 1290737 能會破壞平板之薄膜,從該喷霖峻口 貝務1和52到該抽吸模 組5 4之間的一段距離係能夠被適者 X ^田地调整以使得該流體 能夠快速地被吸起,從而提供一個 丨口%疋的平板加工。 然後’平板G係被轉移至清潔單元3 〇以經歷步驟$ 240 ’之後再執行步驟33〇〇以用於乾燥及卸載。亦 即是,在清潔步驟中被清潔過的平板Μ通過乾燥單元3 6的氣刀。就此點而言,任何殘留尤 戈邊在千板上的水及外來物 質係藉由氣刀所噴出的壓縮空氣而移除。 同時,圖5係顯示本發明的另—個較佳實施例。 如圖中所示,這個實施例的平板加工系統係與先前的 實施例相同,除了 一個轉移單元7 , 将秒早70 7 1被額外地提供在平板 製程生產線上。 亦即是’-個執道7 2係被設置在該平板製程生產線 上D亥轉移單疋7 1係以使得平板能夠被裝載於轉移單元 71上之狀態而可滑動地設置在執道72±。藉由轉移單 元7 1的往復滑移運動’該等平板係能夠被移動至一個預 定位置。 ,亦即是,該轉移單元7 i與該等平板係到達設置在平 板製程生產線2 1之側邊的卸載器7 3上方並且把平板取 帶至卸載器7 3。 該裝載至卸載器7 3上的平板G係被轉移至平板製程 生產線2 1的去光阻單元7 4以經歷去光阻製程,藉此該 殘留在平板G上的光阻係可被移除。 已、、二絰歷去光阻單元7 4的平板g係通過該抽吸單元 13 1290737 7 5以便使得去光阻劑能夠被主要地移除。接著,平板〇 最後是在清潔單元7 6中被清潔。 已經經歷清潔單元7 6的平板G係在通過乾燥單元7 7的氣刀時被乾燥。 然後’該平板係被轉移到卸載器7 9並且係藉由例如 一個機械手臂被堆疊在卡匣7 〇内。 以上所描述的平板加工系統可以被排列成如圖6中所 示。亦即是,卡ϋ 8 〇係被排列在平板製程生產線8 2的 —側部分或是排列在其上設置有轉移單元8 6的軌道8 4 上0 圖7係顯示本發明的另一個實施例。該具有改良抽吸 效率的平板加工系統係具有一個降低其安裝面積的優點。 使用此優點’該系統係能夠被安裝在一種直列型式中。 亦即是,平板製程生產線2 !係能夠被排列在一檢查 線9 8或是另外具有其他製程震置之製程生產線的一側 _上,以便使得平板能夠在一個直列型式製程生產線上被加 人同在刖述的μ &例巾,該平板製程生產線2 1係包 :有:個去光阻單元”、-個抽吸單元93、-個清潔 早凡94、以及一個乾燥單元95。 並且:平板係猎”置在一入口側上的裝載器9 1來轉移 π °又置在一出口側的卸载器θ Θ來轉移 核查線9 8的一個裝载器9 7。 該平板係被轉移到另—個製程生產線或是檢查線以通 14 1290737 過一個預定製程並且藉由卸載器9 9排出及堆疊於卡匣9 0中。 根據本發明之實施例,該平板加工系統及方法係具有 以下優點: 1 去光阻劑月b夠僅耩由使用去離子水而不需使用中 和劑來移除,從而降低加工成本。 2 ·由於去光阻線係被排列在一直列型式中,空間效 • 率係能夠相應於大尺寸平板而被最大化。 3 .平板生產線能夠被排列成不同的型式,例如一種 獨立型式或是一種直列型式,因此能夠改善設計自由度。 熟悉此項技術之人士應明瞭,可對本發明作各種修改 及雙化。因此,本發明係意欲包含在隨附申請專利範圍及 其均等物之範圍内所提供之本發明的修改及變化。 【圖式簡單說明】 隨附圖式係說明本發明之實施例,並且與本說明書一 _起用來解釋本發明的原理,這些圖式係被含括以供進一步 理解本發明而且被併入及構成本申請案之一部分。其中: 圖1為一個先前技術之平板加工系統的示意圖; 圖2為根據本發明一個實施例之平板加工系統的視 圖; 圖3為圖2中所描繪之抽吸單元的一内部結構之側剖 面圖; 圖4為圖3中所描繪之抽吸模組的立體圖; 圖5為根據本發明另一個實施例之平板加工系統的示 15 1290737 意圖; 圖6為根據本發明又一個實施例之平板加工系統的示 意圖; 圖7為根據本發明再一個實施例之平板加工系統的示 意圖,以及 圖8為說明根據本發明一個實施例之平板加工製程的 流程圖。Any foreign matter group 54 on the "great detergent to the flat plate G G ten plate G attached to the plate" is placed on the spray nozzle 5n and pumped and 杈 ^ ^ , I help 5 0 and 5 2 The use of a press-off cleaning agent. i knife left wood and in the suction unit φ, i ^ p ^, the Thousand G plate is loaded on the transport device 46 m solid formed in the bath 4 入 ... The plate G which has been introduced into the bath and sucked in the bath 40 is cleaned out through the outlet 44 which forms 4 8 and is discharged into the bath 4. The b 2 system 5 is externally formed into a conventional structure and set. Spraying the cleaning agent onto the top surface of the plate on the plate G. By the impact energy generated by spraying the cleaning agent, the foreign matter and/or the photoresist removed from the plate are from the plate. The G is removed and discharged by the suction module 54. The spray nozzles 5 and 5 are arranged to face each other and are inclined toward each other. Therefore, from 咱_f fun 攸 噶 5 0 and 5 2 The spilled detergent is locally concentrated on the plate, 丨,; π + T t so that the fluid on the plate can be effectively moved by the suction module 5 4 The Λ suction module 54 is preferably arranged to traverse the through tank 4 to transport the susceptor 4 6' so that the cleaning agent can be sucked from the entire area of the flat sill 5 1290737. As shown in Fig. 4, the suction module 54 includes: a body 59; a fluid passage 6? forms a low pressure by allowing the fluid to be compressed and flowed; and a suction opening 62 is formed through The bottom of one of the bodies 59 is in communication with the fluid passage 6 and the suction generated by the pressure difference between the fluid passage 60 and the suction opening 62 is used to draw the cleaning agent from the plate G. The body 5 9 Forming a rectangular hexahedron, wherein the passage 60 is formed into a longitudinal direction by, for example, a suction molding process formed on the bottom of the body 59 by a compression molding process. The suction opening 62 has An upper portion in communication with the fluid passage 6 以及 and a lower portion open to the outside of one of the bodies 59. Thus, when fluid passes through the fluid passage 6, a low pressure state is formed in the fluid passage via the fluid flow 6 内部 inside, and The suction opening 62 2 has a relatively high height M, thereby generating a suction force to suck the cleaning agent from the flat plate G. In this regard, from the spray nozzles 50 and 52 to the suction module 54: The length of the segment can be appropriately adjusted so as not to damage the film of the flat plate by chemical reaction with the crucible and the cleaning agent. Turned to Fig. 2, the plate G which has passed through the suction unit 28 and transferred to the cleaning unit 3 〇 1糸忒m cleaning unit 3 〇 can be made up of two cleaning baths, each of which has a high-powered spray nozzle (not shown). Therefore, the cleaning process can be handled using only two cleaning baths and a spray nozzle with improved mechanical power of 10 1290737. The drying unit 36 can contain a gas at a high pressure 啧屮r, and also "疋, the air knife system extracts compressed air to remove residual substances. Water droplets on the plate and/or as described above, in the drying The cover opened QC Mountain by unloading the crying 3 8祜μ*, and the dried flat G system was discharged to an outer side. The flat G system experienced a series of process cleaning and drying processes. (1) The pumping and cleaning process of the flat plate will be described below. That is, 'Figures 2 to 4 and include the T step. 楹# ^ a ”Haiqian board processing process 00) I:"" ― A plate G with a layer of film (S1 uu ), hunting from the transfer plate G to a stop π 丄 G and residual light first resist bath and allow the plate CM . ^ , + to the photoresist process (S 2 0 U ), hunting from the ionized water to the υ remove the residual in the flat; fe G hi and the desorbing deionized water and 汊W 隹 dry plate G to the photoresist (G ( s 9 /1 π λ ^ b 2 2 0 ) '·Cleaning the plate 24〇); and drying and unloading the plate G (S3〇〇). In the step of providing the flat plate (S 1 n n d 奸 υ ο ) ' the flat plate is taken out from the cassette 2 设置 2 设置 on the side of the production line. The 屮* 虼 tablet from the cassette 20 is transferred to the loader 22 by, for example, a robot. In the step of performing the photoresist removal process, the photoresist on the surface of the flat plate is removed by removing the light and leaving the film in the process. That is, the transfer from the loader 22 to the photoresist unit is passed through the baths of the < g n & g & g n & At this point, the photoresist photoresist is sprayed out early to chemically react with the photoresist at 1290737 II I = . As a result, the photoresist is delaminated G, and a predetermined pattern is allowed to remain on the flat plate G. In step S 2 2 0, the photoresist is removed from the plate. The plate is processed in the photoresist unit 24 and is loaded onto the bath 4 and introduced into the bath 4 via an inlet formed in the bath 4 . Next, the flat plate G is set by the pair of spray nozzles 5 〇 and 52. In this regard, the cleaning agent is sprayed from the spray nozzles 5 and 5 onto the top surface of the flat plate G. (4) The photoresist and any foreign matter are removed from the flat plate by the impact energy generated by spraying the cleaning agent. In this regard, the suction module 54 is disposed in the spray nozzles 5 and 5 To quickly draw fluid from the plate G. More compactly, when fluid passes through the fluid passage 6 形成 formed in the body 59 of the suction module 504, a low pressure system is formed around the suction opening. In this regard, the suction opening 62 has an upper portion in communication with the fluid passage port and a lower portion open to the outer side of the body 59. In one case, when the fluid is passed through the fluid passage Θ 0, a low pressure state is formed inside the fluid passage 6 藉 by the flow of the corpus callosum, and the suction opening 62 has a relatively high pressure, thereby generating a Suction to draw the detergent from the plate G. VI, ^ and ° 'Because of the chemical reaction between deionized water and photoresist, 12 1290737 can destroy the film of the flat plate, from the spray between the bladders 1 and 52 to the suction module 54 A distance can be adjusted by the fitter X ^ field to enable the fluid to be quickly aspirated, thereby providing a flat-panel finish of the cornice. The 'flat G system is then transferred to the cleaning unit 3 to undergo the step $240' followed by step 33 for drying and unloading. That is, the flat plate that has been cleaned in the cleaning step passes through the air knife of the drying unit 36. In this regard, any residual water and foreign matter on the Thousand Plates are removed by the compressed air ejected by the air knife. Meanwhile, Fig. 5 shows another preferred embodiment of the present invention. As shown in the figure, the flat plate processing system of this embodiment is the same as the previous embodiment except that a transfer unit 7 is additionally provided on the flat plate production line as early as 70 7 1 . That is, the '-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- . The plate train can be moved to a predetermined position by the reciprocating slip motion of the transfer unit 71. That is, the transfer unit 7 i and the flat plates reach the unloader 7 3 disposed on the side of the flat plate process line 21 and take the plate to the unloader 73. The plate G loaded onto the unloader 73 is transferred to the photoresist removal unit 74 of the flat process line 21 to undergo a photoresist removal process, whereby the photoresist system remaining on the plate G can be removed. . The plate g that has passed through the photoresist unit 74 has passed through the suction unit 13 1290737 7 5 so that the photoresist can be largely removed. Next, the plate 〇 is finally cleaned in the cleaning unit 76. The plate G that has undergone the cleaning unit 76 is dried while passing through the air knife of the drying unit 77. The plate is then transferred to the unloader 79 and stacked in the cassette 7 by, for example, a robotic arm. The flatbed processing systems described above can be arranged as shown in Fig. 6. That is, the cassette 8 is arranged on the side portion of the flat manufacturing line 8 2 or on the track 8 4 on which the transfer unit 86 is disposed. FIG. 7 shows another embodiment of the present invention. . The flatbed processing system with improved suction efficiency has the advantage of reducing its mounting area. Using this advantage' the system can be installed in an inline version. That is, the flat manufacturing process line 2 can be arranged on one side of the inspection line 9 8 or another process production line having other process shakes, so that the flat plate can be added on an in-line type process line. In the same example, the flat process line 2 1 package includes: a photoresist removal unit, a suction unit 93, a cleaning unit 94, and a drying unit 95. The loader 9 1 placed on an inlet side transfers the π ° and the unloader θ 置 placed on the outlet side to transfer a loader 9 of the check line 9 8 . The plate is transferred to another process line or inspection line for a predetermined process through 14 1290737 and discharged through the unloader 9 9 and stacked in the cassette 90. In accordance with an embodiment of the present invention, the plate processing system and method have the following advantages: 1 The photoresist removal month b is sufficient to remove only by using deionized water without the use of a neutralizing agent, thereby reducing processing costs. 2 • Since the photoresist lines are arranged in a continuous pattern, the space efficiency can be maximized corresponding to a large size flat panel. 3. Flat line production lines can be arranged in different types, such as a stand-alone type or an in-line type, thus improving design freedom. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention. Accordingly, the present invention is intended to embrace modifications and variations of the invention that are included within the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The embodiments of the present invention are described with reference to the drawings and are intended to explain the principles of the invention Form a part of this application. 1 is a schematic view of a prior art flatbed processing system; FIG. 2 is a view of a flatbed processing system according to an embodiment of the present invention; and FIG. 3 is a side cross-sectional view of an internal structure of the suction unit depicted in FIG. Figure 4 is a perspective view of the suction module depicted in Figure 3; Figure 5 is an illustration of a flat processing system 15 1290737 in accordance with another embodiment of the present invention; Figure 6 is a flat panel in accordance with yet another embodiment of the present invention BRIEF DESCRIPTION OF THE DRAWINGS FIG. 7 is a schematic diagram of a flatbed processing system in accordance with still another embodiment of the present invention, and FIG. 8 is a flow chart illustrating a flatbed processing process in accordance with one embodiment of the present invention.

【主要元件符號說明】 1 卡匣 2 裝載器 3 去光阻浴槽 4 去光阻劑中和單元 5 旋轉器 6 第一清潔單元 7 旋轉器 8 第二清潔單元 9 水刀 1 0 氣刀 1 1 卸載器 2 0 卡匣 2 1 平板製程生產線 2 2 裝載器 2 4 去光阻單元 2 5、; ^ 6 浴槽 16 1290737[Main component symbol description] 1 cassette 2 loader 3 to photoresist bath 4 to photoresist neutralizer unit 5 rotator 6 first cleaning unit 7 rotator 8 second cleaning unit 9 water knife 1 0 air knife 1 1 Unloader 2 0 cassette 2 1 flat process line 2 2 loader 2 4 to photoresist unit 2 5;; 6 6 bath 16 1290737

2 8 抽吸單元 3 0 清潔單元 3 2、 3 4 清潔浴槽 3 6 乾燥單元 3 8 卸載器 4 0 浴槽 4 2 入〇 4 6 運送裝置 4 8 氣簾 5 0、 5 2 噴霧嘴 5 4 抽吸模組 5 9 本體 6 0 流體通道 6 2 抽吸開口 7 0 卡匣 7 1 轉移單元 7 2 執道 7 3 卸載器 Η 4 去光阻單元 7 5 抽吸單元 7 6 清潔單元 7 7 乾燥單元 7 9 卸載器 8 0 卡匣 17 12907372 8 Suction unit 3 0 Cleaning unit 3 2, 3 4 Cleaning bath 3 6 Drying unit 3 8 Unloader 4 0 Bath 4 2 Inlet 4 6 Transport unit 4 8 Air curtain 5 0, 5 2 Spray nozzle 5 4 Suction mold Group 5 9 body 6 0 fluid channel 6 2 suction opening 7 0 cassette 7 1 transfer unit 7 2 way 7 3 unloader Η 4 to photoresist unit 7 5 suction unit 7 6 cleaning unit 7 7 drying unit 7 9 Unloader 8 0 cassette 17 1290737

8 2 平板製程生產線 8 4 軌道 8 6 轉移單元 9 0 卡匣 9 1 裝載器 9 2 去光阻單元 9 3 抽吸單元 9 4 清潔單元 9 5 乾燥單元 9 6 卸載器 9 7 裝載器 9 8 檢查線 9 9 卸載器 G 平板 S 1 0 0 步驟 S 2 0 0 步驟 S 2 2 0 步驟 S 2 4 0 步驟 S 3 0 0 步驟 188 2 Flat-panel production line 8 4 Track 8 6 Transfer unit 9 0 cassette 9 1 Loader 9 2 Light-resisting unit 9 3 Suction unit 9 4 Cleaning unit 9 5 Drying unit 9 6 Unloader 9 7 Loader 9 8 Check Line 9 9 Unloader G Plate S 1 0 0 Step S 2 0 0 Step S 2 2 0 Step S 2 4 0 Step S 3 0 0 Step 18

Claims (1)

1290737 申請專利範圍: 1 .一種平板加工系統,係包含: 一裴载器,用於從一卡匣裝載一平板到一製程生產線; 一 I型平板製程生產線用於(a )對該平板執行一去 光阻:耘,(b)藉由噴灑-去離子水至該去光阻的平板 上及移除存留在該平板上之殘留物來清潔該平板,以及 (c )乾燥該清潔的平板:以及 一卸載器,用於從該平板製程生產線中卸載該平板。 盆^ .根據申請專利範圍第工項所述之平板加工系統, 其中該I型平板製程生產線能夠被排列成一直列型式 (lnhne咖)’其中-檢查線或是其他製程生產線俜被 設置於其上。 度深你被 3 ·根據中請專利範圍第1項所述之平板加工系統, 更包含一轉移單元用於接收來自該卡E的該平板以及轉移 该平板至該裝载器,該轉移單元被設置在該I型平板製程 生產線上。 4 ·根據中請專利範圍第3項所述之平板加工系统, 其中該卡E係排列平行或是垂直於該平板轉移方向。 5 .根射請專利範圍第1項所述之平板加工系統, 其中該抽吸單元係包含一對將清潔劑噴灌至該平板上的噴 霧嘴以及-抽吸模組設置在該對喷霧嘴之間以從抽 吸流體。 6 · —種平板加工方法,係包含以下步驟: 提供一具有一薄膜之平板; 19 1290737 板上以容許::阻製程,其係藉由喷灑-去光阻劑至該平 反應; 光阻劑與該平板上之任何殘留光阻起化學 離子水至兮省S 4平板上的該去光阻劑,其係藉由喷灑去 〜平板上以及吸離存留在該平板上的殘留物; 清潔該平板;以及 乾燥和卸载平板。 >直φ 冑中明專利範圍第6項所述之平板加工方法, _ ^執仃去光阻製程之步驟中,該平板係通過第一 及弟二去光阻浴槽。 8 .根據申請專利範圍第6項所述之平板加工方法, 〆、中该移除去光阻劑的牛# 二 剮的V驟係猎由一對喷霧嘴噴灑清潔劑 至該平板上以及一拙哄ρ 及拉組仅置在該對喷霧嘴之間以從該 平板抽吸流體而執行。 9 .根據巾請專利範圍第8項所述之平板加工方法, _其中從該對喷霧嘴到該抽吸模組之間的該距離係能夠被適 田也调1以便不會經由與該去光阻劑及該清潔劑的化學反 應而損壞該平板的薄膜。 十一、圖式: 如次頁 201290737 Patent Application Range: 1. A flatbed processing system comprising: a loader for loading a plate from a cassette to a process line; an I-type flat process line for (a) performing a plate on the plate Deblocking: 耘, (b) cleaning the plate by spraying-deionized water onto the photoresist-removing plate and removing residue remaining on the plate, and (c) drying the cleaned plate: And an unloader for unloading the plate from the flat process line. The tablet processing system according to the application of the patent scope, wherein the I-type flat process production line can be arranged in a continuous type (lnhne coffee), wherein the inspection line or other process production line is disposed in the on. The tablet processing system according to the first aspect of the patent application, further comprising a transfer unit for receiving the plate from the card E and transferring the plate to the loader, the transfer unit being Set on the I-type flat process production line. 4. The flatbed processing system of claim 3, wherein the card E is arranged in parallel or perpendicular to the transfer direction of the plate. 5 . The flat processing system according to claim 1 , wherein the suction unit comprises a pair of spray nozzles for spraying a cleaning agent onto the flat plate and a suction module is disposed on the pair of spray nozzles. Between the suction fluid. 6 · A tablet processing method comprising the steps of: providing a flat plate having a film; 19 1290737 plate to allow:: a resisting process by spraying-de-resisting the photoresist to the flat reaction; And any residual photoresist on the plate from the chemical ionized water to the photoresist on the S 4 plate by spraying onto the plate and aspirating the residue remaining on the plate; Clean the plate; and dry and unload the plate. > Straight φ 胄 明 明 专利 专利 专利 专利 专利 专利 专利 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 平板 平板 平板 平板 平板 。 。 。 。 。 。 。 。 。 。 。 。 。 。 8. The tablet processing method according to claim 6, wherein the removing the photoresist from the photoresist is performed by spraying a cleaning agent onto the flat plate by a pair of spray nozzles and A 拙哄ρ and a pull group are placed only between the pair of spray nozzles to perform aspiration of fluid from the plate. 9. The flat plate processing method according to claim 8, wherein the distance from the pair of spray nozzles to the suction module can be adjusted by the adapted field so as not to pass through The film of the flat plate is damaged by the chemical reaction of the photoresist and the cleaning agent. XI. Schema: as the next page 20
TW094109329A 2004-04-28 2005-03-25 Apparatus and method for treating a panel TWI290737B (en)

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JP2009165968A (en) * 2008-01-16 2009-07-30 Kgk Engineering Corp Cleaning method and cleaning apparatus for belt-like cleaning object
CN102729667B (en) * 2012-06-14 2015-08-19 歌尔声学股份有限公司 The method and system of the bad light guide plate of a kind of heavy industry
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CN103171075A (en) * 2013-03-29 2013-06-26 扬州新天然橡塑制品有限公司 Method for cleaning aspirates of stripping roller
CN106269707A (en) * 2016-09-07 2017-01-04 京东方科技集团股份有限公司 The clean method of a kind of mask plate and cleaning device
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CN113634556A (en) * 2021-08-10 2021-11-12 叶建蓉 Silicon chip surface removes liquid clean-up equipment

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