CN1690866A - Device and method for treating panel - Google Patents
Device and method for treating panel Download PDFInfo
- Publication number
- CN1690866A CN1690866A CNA2005100662510A CN200510066251A CN1690866A CN 1690866 A CN1690866 A CN 1690866A CN A2005100662510 A CNA2005100662510 A CN A2005100662510A CN 200510066251 A CN200510066251 A CN 200510066251A CN 1690866 A CN1690866 A CN 1690866A
- Authority
- CN
- China
- Prior art keywords
- panel
- production line
- remover
- processing system
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000008569 process Effects 0.000 claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000008367 deionised water Substances 0.000 claims abstract description 14
- 238000005507 spraying Methods 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims description 33
- 239000012530 fluid Substances 0.000 claims description 22
- 238000012545 processing Methods 0.000 claims description 20
- 229910021641 deionized water Inorganic materials 0.000 claims description 13
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 23
- 238000001035 drying Methods 0.000 abstract description 11
- 239000007921 spray Substances 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Liquid Crystal (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a panel treatment system including: a loader for loading a panel from a cassette to a process line; an I-type panel process line for (a) performing a stripping process for the panel, (b) cleaning the panel by spraying de-ionized water onto the stripped panel, and removing the water, and (c) drying the cleaning panel; and an unloader for unloading the panel from the panel process line.
Description
Technical field
The present invention relates to a kind of system and method that is used to handle panel, more specifically, relate to the system and method that is used to handle panel, wherein stripping off device has improved absorption efficient, can reduce the equipment that is used to remove detersive, thereby reduce production line length and improve space availability ratio.
Background technology
Usually, the panel such as the flat board that is used for flat-panel monitor, semiconductor wafer, LCD, photomask glass etc. can be handled by for example a series of production lines such as photoresist coating operation, exposure process, developing procedure, etching work procedure, stripping process, cleaning process, drying process.
Fig. 1 shows the existing panel production line that is used to carry out stripping process.As shown in the figure, panel unloads from box 1, and is sent to shovel loader 2.Shovel loader 2 supplies to peel groove 3 with panel.
The panel that supplies to peel groove 3 is carried out stripping process, then panel is supplied to remover neutralisation unit 4, make remover can pass through organic solution, neutralize such as isopropyl alcohol (IPA), dromisol (DMSO) etc.If remover is not neutralized, remover may react with the deionized water in subsequently the cleaning process, thereby destroys the film surface of panel.That is to say that the neutralization of remover can prevent that the film surface of panel is damaged.
After neutralisation treatment, by spinner 5 panel is sent to first cleaning unit 6, make the organic solution that remains in panel surface to dispose by deionized water.
That is to say, by travelling belt panel is sent to first cleaning unit 6, and deionized water is sprayed onto on the surface of panel, thereby carry out cleaning process.
Then, by spinner 7 panel is sent to second cleaning unit 8 again.Second cleaning unit 8 has two identical with first cleaning unit 6 grooves that drench.
Preferably, spinner 5 and 7 is mounted to empty state (dummy state), so that with
The shape delivery panel, thus effective space utilization is provided.
The panel by second cleaning unit 8 carries out drying process by water cutter 9 and air knife 10 time.
Then, panel is sent to unloader 11, and is sent to box, thereby be deposited in the there by robot.
But using neutralizing agent to neutralize has increased manufacturing cost.
And, form though peel off production line
Shape, but consideration is used for the trend of large-size panel, is reducing also there is limitation aspect the device space.
Summary of the invention
In view of this, the present invention is devoted to solve above-mentioned prior art problems.
Therefore, one object of the present invention is to provide a kind of system and method that is used to handle panel, and it can remove the demand to remover effectively, thereby reduces manufacturing cost.
Another object of the present invention is to provide a kind of system and method that is used to handle panel, it can be arranged to rectilinear form and make space availability ratio maximization by peeling off production line.
For achieving the above object, the invention provides a kind of panel processing system, comprising: be used for shovel loader from box-packed section plate to production line; I profile plate production line is used for (a) counter plate and carries out stripping process, (b) by spraying deionized water clean face plate to the panel of having peeled off, and removes water, (c) the dry panel that has cleaned; Be used for from the unloader of panel production line unloading panel G.
Description of drawings
The accompanying drawing that is comprised is used for further understanding the present invention, and constitutes the application's a part.These accompanying drawings are used to illustrate embodiments of the invention, and are used from explanation principle of the present invention with instructions one.Wherein:
Fig. 1 is the synoptic diagram of existing panel processing system;
Fig. 2 is the figure of panel processing system according to an embodiment of the invention;
Fig. 3 is the side sectional view of the inner structure of suction unit shown in Figure 2;
Fig. 4 is the skeleton view of absorption module shown in Figure 3;
Fig. 5 is the synoptic diagram of panel processing system according to another embodiment of the present invention;
Fig. 6 is the synoptic diagram according to the panel processing system of further embodiment of this invention;
Fig. 7 is the synoptic diagram of panel processing system according to yet another embodiment of the invention;
Fig. 8 is the process flow diagram of panel treatment process according to an embodiment of the invention.
Embodiment
Now will be in detail with reference to the preferred embodiments of the present invention, example promptly shown in the drawings.Institute's drawings attached will make as far as possible and be denoted by like references identical or similar parts.
Fig. 2 shows the figure of panel processing system according to an embodiment of the invention.
As shown in the drawing, panel processing system of the present invention forms has self (the being the I type) line that has reduced length, and this line is designed to be enough to handle panel in the length that reduces.
This panel processing system comprises: be used for loading the shovel loader of panel (G of Fig. 3) to production line from box 20; I profile plate production line 21 is used for (a) counter plate G and carries out stripping process, (b) by spraying deionized water clean face plate to the panel G that has peeled off, and removes water, (c) the dry panel that has cleaned; Be used for from the unloader of panel production line 21 unloading panel G.
In above-mentioned panel processing system, panel G is deposited in the box 20 that is arranged on production line one side.Transfer equipment such as robot one by one is sent to shovel loader 22 with panel G from box 20.
Panel production line 21 comprises: be used for by remover is applied to carry out stripping process on the panel G that transmits by shovel loader 22 peel off unit 24; Be used to spray deionized water to the surface of the panel G that peeled off and blot the suction unit 28 of water; Be used to clean the cleaning unit 30 that passes through the panel G of suction unit 28; With being used for the panel G after the cleaning is carried out dry drying unit 36.
More specifically, peel off unit 24 and carry out stripping process by remover being applied to the panel that transmits from shovel loader 22.Preferably, peel off unit 24 and form two grooves 25 and 26, so that can provide a plurality of strong nozzles to remove to remain in the lip-deep photoresist of the panel G that passes these grooves.
As mentioned above, when panel passes suction unit 28, can by spray deionized water to panel and in suction unit 28, blot deionized water, remove peel off use in the unit 24 and remain in the lip-deep remover of panel G, and remove any impurity.
As shown in Figure 3, preferably, suction unit 28 comprises that water sprays part and remover is drawn part.
Just, suction unit 28 comprises: groove 40; Be arranged on the air curtain 48 in the groove 40, from groove 40, leak to prevent detersive; A pair of nozzle 50 and 52 is used to spray detersive and removes attached to any impurity on the panel G to panel G; Place the absorption module 54 between nozzle 50 and 52, be used for the detersive on the working pressure difference absorption panel.
In suction unit, panel G is loaded on the travelling belt 46, is incorporated in the groove 40 by the inlet 42 that is formed on the groove 40.Leave groove 40 at the panel G that suction unit cleaned by the outlet that is formed on the groove 40.
Nozzle 50 and 52 is designed to habitual structure, and is arranged on the panel G, so that detersive is sprayed onto on the upper surface of panel G.
Rely on by spraying the impact energy that detersive produces, can remove attached to impurity on the panel G and/or remover from panel G, and by drawing module 54 drainings.
Preferably, draw module 54 and cross travelling belt 46 settings of passing groove 40, thereby can draw detersive from the whole zone of panel G.
Just, as shown in Figure 4, draw module 54 and comprise: main body 59; By allowing fluid compression and circulation to form the fluid passage 60 of low pressure; Suction inlet 62, this suction inlet 62 is formed on the bottom of main body 59, thereby is communicated with fluid passage 60, and the inhalation power that utilizes the pressure reduction between fluid passage 60 and the suction inlet 62 to produce is drawn detersive from panel G.
Main body 59 forms rectangular hexahedron, and wherein fluid passage 60 is by forming along the longitudinal direction such as moulding technology.
The suction inlet 62 that is formed on the bottom of main body 59 forms along the longitudinal direction.Suction inlet 62 has the top that is connected with fluid passage 60 and the opening bottom towards main body 59 outsides.
Therefore, when fluid passed fluid passage 60,60 is inner because fluid flows through the formation low-pressure state in the fluid passage, and suction inlet 62 has quite high pressure, thereby produce inhalation power, to draw detersive from panel G.
In this, can suitably adjust to the distance of drawing module 54, thereby can not destroy the film of panel owing to the reaction between remover and the detersive from nozzle 50 and 52.
Refer again to Fig. 2, the panel G that passes suction unit 28 is sent to cleaning unit 30.
Therefore, cleaning process only uses two cleaning slots with nozzle just can handle, and wherein nozzle has improved mechanical output.
As mentioned above, dry panel G is discharged to the outside by unloader 38 in drying unit 36.
Panel G is through such as peeling off, draw, clean and series of processes such as drying.
The panel treatment process is described below.
Just, shown in Fig. 2 to 4 and 8, the panel treatment process comprises the steps: to provide the panel G with film (S100); Carry out stripping process by delivery panel G to peel groove, and make panel G and residual photoresist react (S200); To panel G, remove the remover that remains on the panel G by spraying deionized water, and absorb water (S220); Clean face plate G (S240); Drying and unloading panel G (S300).
In the step of panel (S100) was provided, panel came out from the box 20 of placing an online side.The panel that comes out from box 20 is sent to shovel loader 22 by for example robot.
In the step of carrying out stripping process (S200), remove the photoresist that remains in panel surface by stripping process.
Just, be sent to first and second stripping processs that the panel of peeling off unit 24 passes through groove 25 and 26 from shovel loader 22.
In this, remover sprays out from peeling off the unit, thereby reacts with the photoresist that remains on the panel G.As a result, can separate photoresist, thereby allow on panel G, to keep predetermined pattern from panel G.
At step S220, remove remover from panel.
Just, the panel that will handle in peeling off unit 24 is loaded on the travelling belt 46, imports in the groove 40 by the inlet 42 that is formed on the groove 40 then.
Then, panel G passes a pair of nozzle 50 and 52 parts that are provided with.In this, detersive is sprayed onto on the upper surface of panel G from nozzle 50 and 52.Remover and any impurity are by being removed from panel G by the impact energy of spraying the detersive generation.
In this, draw module 54 and be arranged between nozzle 50 and 52, thus can be apace from panel G draw fluid.
In more detail, because fluid flows through the fluid passage 60 that is formed in the main body 59 of drawing module 54, around suction inlet 62, form low pressure.
In this, suction inlet 62 has the top that is communicated with fluid passage 60 and the opening bottom towards main body 59 outsides.
Therefore, when fluid passed fluid passage 60,60 inner formed low-pressure state owing to fluid flows through in the fluid passage, and suction inlet 62 has quite high pressure, thereby produced inhalation power with from panel G absorption detersive.
In this, because the reaction between deionized water and the remover may destroy the film of panel, therefore can suitably adjust to the distance of drawing module 54 from nozzle 50 and 52, make fluid to be blotted apace, thereby can provide stable panel to handle.
Then, panel G is sent to cleaning unit 30, through step S240, execution is used for dry and step of unloading S300 then.That is the panel G that, cleans in the cleaning passes the air knife of drying unit 36.In this, any water and impurity that remains on the panel can be removed by the pressurized air that sprays from air knife.
Simultaneously, Fig. 5 shows another preferred embodiment of the present invention.
As shown in the drawing, the panel processing system of present embodiment is similar to previous embodiment, except also having delivery unit 71 on this panel production line.
Just, the panel production line is provided with track 72.Delivery unit 71 is slidably disposed on the track 72, and panel is loaded in the delivery unit 71.By reciprocatingly sliding of delivery unit 71, panel can move to the precalculated position.
Just, the delivery unit 71 that has panel arrives on the shovel loader 73 of the side that is arranged on panel production line 21, and sends panel to shovel loader 73.
What be loaded in that panel G on the shovel loader 73 is sent to panel production line 21 peels off unit 74, so that remove the photoresist that remains on the panel G through stripping process.
Pass suction unit 75 through the panel G that peels off unit 74, thereby tentatively remove remover.Then panel G is cleaned in cleaning unit 76 at last.
Panel G through cleaning unit 76 is dried when passing the air knife of drying unit 77.
Then, panel is sent to unloader 79, and is deposited in the box 70 by for example robot.
Above-mentioned panel processing system can be arranged to as shown in Figure 6.That is, box 80 be arranged on the sidepiece of panel production line 82 or the track 84 that is provided with delivery unit 86 disposed thereon on.
Fig. 7 shows yet another embodiment of the invention.Panel processing system with improved absorption efficient has the advantage of minimizing system erection space.Utilize this advantage, this system can be installed as type in upright arrangement.
Just, panel production line 21 can be arranged in the side checking line 98 or have another production line of other treatment facility, make panel on type production line in upright arrangement, to handle.
As front embodiment, panel production line 21 comprises peels off unit 92, suction unit 93, cleaning unit 94 and drying unit 95.
Panel transmits by the shovel loader 91 that is arranged on the entrance side, and further is sent to the shovel loader 97 of check line 98 by the unloader 96 that is arranged on outlet side.
Panel is sent to another production line or check line, be scheduled to operation, and unloads, be deposited in the box 90 by unloader 99.
According to the present invention, this panel processing system and method have following advantage:
1, can only use deionized water to remove remover, and without neutralizing agent, thereby processing cost reduced.
Therefore 2,, can be adapted to large size panel and maximize space availability ratio because stripper wire is arranged to type in upright arrangement.
3, the panel production line can be arranged to all kinds, such as self or type in upright arrangement, has therefore improved the degree of freedom of design.
Obviously, those skilled in the art can carry out various modifications and change to the present invention.Therefore, this invention is intended to contain modifications and variations of the present invention, as long as these modifications and variations are within subsidiary claim and scope of replacing of equal value.
Claims (9)
1, a kind of panel processing system comprises:
Be used for panel from the box-packed shovel loader that is downloaded to production line;
I profile plate production line is used for (a) counter plate and carries out stripping process, (b) by spraying deionized water clean face plate to the panel of having peeled off, and removes the residue that exists on the panel, (c) the dry panel that has cleaned; With
Be used for from the unloader of panel production line unloading panel.
2, panel processing system as claimed in claim 1, wherein this I profile plate production line is arranged to type in upright arrangement, and arranges check line or another production line on this array type production line.
3, panel processing system as claimed in claim 1 comprises further being used for receiving panel and panel being sent to the delivery unit of shovel loader from box that described delivery unit is arranged on the I profile plate production line.
4, panel processing system as claimed in claim 3, wherein box is arranged as parallel or perpendicular to the panel direction of transfer.
5, panel processing system as claimed in claim 1, wherein suction unit comprises and a pair of detersive is sprayed onto nozzle on the panel, and is arranged on the absorption module that is used between the described nozzle from the panel draw fluid.
6, a kind of panel treatment process may further comprise the steps:
Panel with film is provided;
To panel, carry out stripping process by spraying remover, so that remover reacts with the photoresist that remains on the panel;
To panel, remove the remover that remains on the panel by spraying deionized water, and draw the residue that exists on the panel;
Clean this panel; With
Dry and unload this panel.
7, panel treatment process as claimed in claim 6, wherein in the step of carrying out stripping process, panel passes first and second peel groove.
8, panel treatment process as claimed in claim 6, the step of wherein removing remover be by a pair of detersive to be sprayed onto nozzle on the panel, and be arranged on and be used between the described nozzle carrying out from the absorption module of panel draw fluid.
9, panel treatment process as claimed in claim 8 wherein can suitably be adjusted to the distance of drawing module from nozzle, makes the film that instead would not destroy panel between remover and the detersive.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2004-0029567 | 2004-04-28 | ||
| KR1020040029567 | 2004-04-28 | ||
| KR1020040029567A KR100591476B1 (en) | 2004-04-28 | 2004-04-28 | Apparatus for treatment works and method of the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1690866A true CN1690866A (en) | 2005-11-02 |
| CN1690866B CN1690866B (en) | 2011-08-17 |
Family
ID=35346374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005100662510A Active CN1690866B (en) | 2004-04-28 | 2005-04-25 | Device and method for treating panel |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2005313169A (en) |
| KR (1) | KR100591476B1 (en) |
| CN (1) | CN1690866B (en) |
| TW (1) | TWI290737B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102729667A (en) * | 2012-06-14 | 2012-10-17 | 歌尔声学股份有限公司 | Method and system for reworking bad light guide plate |
| CN106269707A (en) * | 2016-09-07 | 2017-01-04 | 京东方科技集团股份有限公司 | The clean method of a kind of mask plate and cleaning device |
| CN113634556A (en) * | 2021-08-10 | 2021-11-12 | 叶建蓉 | Silicon chip surface removes liquid clean-up equipment |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009165968A (en) * | 2008-01-16 | 2009-07-30 | Kgk Engineering Corp | Cleaning method and cleaning apparatus for belt-like cleaning object |
| CN102755977B (en) * | 2012-07-09 | 2014-07-09 | 广州创维平面显示科技有限公司 | Heavy industry technique of light guide plate |
| CN103171075A (en) * | 2013-03-29 | 2013-06-26 | 扬州新天然橡塑制品有限公司 | Method for cleaning aspirates of stripping roller |
| KR102177641B1 (en) * | 2018-10-31 | 2020-11-12 | 주식회사 뉴파워 프라즈마 | Spray apparatus and method |
| KR102176672B1 (en) * | 2020-08-04 | 2020-11-09 | 주식회사 뉴파워 프라즈마 | Spray apparatus and method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327888A (en) * | 2000-06-09 | 2001-12-26 | 株式会社平间理化研究所 | Treater for substrate surface |
| KR20020093578A (en) * | 2001-06-08 | 2002-12-16 | 수미도모 프리시젼 프로덕츠 캄파니 리미티드 | Substrate processing device |
| KR20020093577A (en) * | 2001-06-08 | 2002-12-16 | 수미도모 프리시젼 프로덕츠 캄파니 리미티드 | Substrate processing device |
-
2004
- 2004-04-28 KR KR1020040029567A patent/KR100591476B1/en active IP Right Grant
-
2005
- 2005-03-25 TW TW094109329A patent/TWI290737B/en active
- 2005-04-25 CN CN2005100662510A patent/CN1690866B/en active Active
- 2005-04-27 JP JP2005130418A patent/JP2005313169A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102729667A (en) * | 2012-06-14 | 2012-10-17 | 歌尔声学股份有限公司 | Method and system for reworking bad light guide plate |
| CN102729667B (en) * | 2012-06-14 | 2015-08-19 | 歌尔声学股份有限公司 | The method and system of the bad light guide plate of a kind of heavy industry |
| CN106269707A (en) * | 2016-09-07 | 2017-01-04 | 京东方科技集团股份有限公司 | The clean method of a kind of mask plate and cleaning device |
| CN113634556A (en) * | 2021-08-10 | 2021-11-12 | 叶建蓉 | Silicon chip surface removes liquid clean-up equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI290737B (en) | 2007-12-01 |
| TW200537610A (en) | 2005-11-16 |
| CN1690866B (en) | 2011-08-17 |
| KR100591476B1 (en) | 2006-06-20 |
| JP2005313169A (en) | 2005-11-10 |
| KR20050104203A (en) | 2005-11-02 |
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