TWI337614B - Curable flame retardant epoxy resin compositions - Google Patents
Curable flame retardant epoxy resin compositions Download PDFInfo
- Publication number
- TWI337614B TWI337614B TW93116078A TW93116078A TWI337614B TW I337614 B TWI337614 B TW I337614B TW 93116078 A TW93116078 A TW 93116078A TW 93116078 A TW93116078 A TW 93116078A TW I337614 B TWI337614 B TW I337614B
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- epoxy
- epoxy resin
- curable
- resin
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims description 138
- 229920000647 polyepoxide Polymers 0.000 title claims description 106
- 239000003822 epoxy resin Substances 0.000 title claims description 95
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims description 22
- 239000003063 flame retardant Substances 0.000 title claims description 20
- 229920001400 block copolymer Polymers 0.000 claims description 73
- 229920005989 resin Polymers 0.000 claims description 54
- 239000011347 resin Substances 0.000 claims description 54
- 239000004593 Epoxy Substances 0.000 claims description 41
- 150000001875 compounds Chemical class 0.000 claims description 37
- 239000007787 solid Substances 0.000 claims description 31
- 239000002904 solvent Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 29
- 239000003795 chemical substances by application Substances 0.000 claims description 26
- 239000003054 catalyst Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 13
- 229920001577 copolymer Polymers 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 6
- 230000002968 anti-fracture Effects 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 6
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 5
- 229920000469 amphiphilic block copolymer Polymers 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000008187 granular material Substances 0.000 claims description 5
- 239000011342 resin composition Substances 0.000 claims description 5
- 241000282320 Panthera leo Species 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 4
- 239000011152 fibreglass Substances 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 238000000265 homogenisation Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 239000012779 reinforcing material Substances 0.000 claims description 3
- 239000000839 emulsion Substances 0.000 claims description 2
- 239000000052 vinegar Substances 0.000 claims description 2
- 235000021419 vinegar Nutrition 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 230000000717 retained effect Effects 0.000 claims 2
- 238000007711 solidification Methods 0.000 claims 2
- 230000008023 solidification Effects 0.000 claims 2
- CVKMFSAVYPAZTQ-UHFFFAOYSA-N 2-methylhexanoic acid Chemical compound CCCCC(C)C(O)=O CVKMFSAVYPAZTQ-UHFFFAOYSA-N 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- 230000004992 fission Effects 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 claims 1
- 125000002883 imidazolyl group Chemical group 0.000 claims 1
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 238000009958 sewing Methods 0.000 claims 1
- 239000000523 sample Substances 0.000 description 80
- 238000012360 testing method Methods 0.000 description 80
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 64
- -1 bisphenol A epoxide Chemical class 0.000 description 52
- 150000002924 oxiranes Chemical class 0.000 description 41
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 17
- 239000000047 product Substances 0.000 description 16
- 239000002253 acid Substances 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- 150000002430 hydrocarbons Chemical class 0.000 description 13
- 239000007788 liquid Substances 0.000 description 12
- 238000005452 bending Methods 0.000 description 11
- 238000005336 cracking Methods 0.000 description 11
- 239000006260 foam Substances 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 239000002245 particle Substances 0.000 description 10
- 239000007921 spray Substances 0.000 description 10
- 238000009778 extrusion testing Methods 0.000 description 9
- 229930195733 hydrocarbon Natural products 0.000 description 9
- 229920001568 phenolic resin Polymers 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000003112 inhibitor Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000004848 polyfunctional curative Substances 0.000 description 6
- 238000009864 tensile test Methods 0.000 description 6
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 5
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 229920005546 furfural resin Polymers 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000002689 soil Substances 0.000 description 4
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 3
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- 239000004971 Cross linker Substances 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 239000002841 Lewis acid Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 238000004043 dyeing Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 150000007517 lewis acids Chemical class 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- RCHKEJKUUXXBSM-UHFFFAOYSA-N n-benzyl-2-(3-formylindol-1-yl)acetamide Chemical compound C12=CC=CC=C2C(C=O)=CN1CC(=O)NCC1=CC=CC=C1 RCHKEJKUUXXBSM-UHFFFAOYSA-N 0.000 description 3
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 3
- 238000013001 point bending Methods 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004970 Chain extender Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N Furaldehyde Natural products O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 108010068370 Glutens Proteins 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 235000021312 gluten Nutrition 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002683 reaction inhibitor Substances 0.000 description 2
- 238000010107 reaction injection moulding Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000009331 sowing Methods 0.000 description 2
- 238000004611 spectroscopical analysis Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 229910021653 sulphate ion Inorganic materials 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- MGSRCZKZVOBKFT-UHFFFAOYSA-N thymol Chemical compound CC(C)C1=CC=C(C)C=C1O MGSRCZKZVOBKFT-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LNOLJFCCYQZFBQ-BUHFOSPRSA-N (ne)-n-[(4-nitrophenyl)-phenylmethylidene]hydroxylamine Chemical compound C=1C=C([N+]([O-])=O)C=CC=1C(=N/O)/C1=CC=CC=C1 LNOLJFCCYQZFBQ-BUHFOSPRSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- OHVLMTFVQDZYHP-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CN1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O OHVLMTFVQDZYHP-UHFFFAOYSA-N 0.000 description 1
- KZEVSDGEBAJOTK-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[5-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CC=1OC(=NN=1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O KZEVSDGEBAJOTK-UHFFFAOYSA-N 0.000 description 1
- YCYWDRLQTZAYFU-UHFFFAOYSA-N 2,3-diethyl-1,4-dioxine Chemical compound CCC1=C(CC)OC=CO1 YCYWDRLQTZAYFU-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- RAWZOXRFHKUFPX-UHFFFAOYSA-N 2-butyl-3-methyloxirane Chemical class CCCCC1OC1C RAWZOXRFHKUFPX-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- NHOSOKTUOFENLY-UHFFFAOYSA-N 2-methyl-3-(2-methylpropyl)oxirane Chemical compound CC(C)CC1OC1C NHOSOKTUOFENLY-UHFFFAOYSA-N 0.000 description 1
- UHXMPWNOJMTYCV-UHFFFAOYSA-N 2-methyloxirane;2-methylprop-2-enoic acid Chemical compound CC1CO1.CC(=C)C(O)=O UHXMPWNOJMTYCV-UHFFFAOYSA-N 0.000 description 1
- DAWJJMYZJQJLPZ-UHFFFAOYSA-N 2-sulfanylprop-2-enoic acid Chemical compound OC(=O)C(S)=C DAWJJMYZJQJLPZ-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- PGBVLOMZZHYJFP-UHFFFAOYSA-N 3-methyldithietane Chemical compound CC1CSS1 PGBVLOMZZHYJFP-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 1
- 241000208140 Acer Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- FMMWHPNWAFZXNH-UHFFFAOYSA-N Benz[a]pyrene Chemical compound C1=C2C3=CC=CC=C3C=C(C=C3)C2=C2C3=CC=CC2=C1 FMMWHPNWAFZXNH-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- MLZGOXKPLYRFBZ-UHFFFAOYSA-N CC=C.O[PH2]=O Chemical compound CC=C.O[PH2]=O MLZGOXKPLYRFBZ-UHFFFAOYSA-N 0.000 description 1
- 206010011906 Death Diseases 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 206010017711 Gangrene Diseases 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002879 Lewis base Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- KBFUVFCLUSJBCH-UHFFFAOYSA-N OC1=CC=C(C=C1)P(C1=CC=C(C=C1)O)(C1=CC=C(C=C1)O)C1=CC=C(C=C1)O Chemical compound OC1=CC=C(C=C1)P(C1=CC=C(C=C1)O)(C1=CC=C(C=C1)O)C1=CC=C(C=C1)O KBFUVFCLUSJBCH-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005844 Thymol Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- QVMHUALAQYRRBM-UHFFFAOYSA-N [P].[P] Chemical compound [P].[P] QVMHUALAQYRRBM-UHFFFAOYSA-N 0.000 description 1
- CDOMXXVCZQOOMT-UHFFFAOYSA-N [phenoxy(phenyl)phosphoryl]oxybenzene Chemical compound C=1C=CC=CC=1OP(C=1C=CC=CC=1)(=O)OC1=CC=CC=C1 CDOMXXVCZQOOMT-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- VUEDNLCYHKSELL-UHFFFAOYSA-N arsonium Chemical compound [AsH4+] VUEDNLCYHKSELL-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012661 block copolymerization Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 229940125810 compound 20 Drugs 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920000359 diblock copolymer Polymers 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PRAKJMSDJKAYCZ-UHFFFAOYSA-N dodecahydrosqualene Natural products CC(C)CCCC(C)CCCC(C)CCCCC(C)CCCC(C)CCCC(C)C PRAKJMSDJKAYCZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N ethyl trimethyl methane Natural products CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- WOLATMHLPFJRGC-UHFFFAOYSA-N furan-2,5-dione;styrene Chemical compound O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 WOLATMHLPFJRGC-UHFFFAOYSA-N 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000008202 granule composition Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- JAXFJECJQZDFJS-XHEPKHHKSA-N gtpl8555 Chemical compound OC(=O)C[C@H](N)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1CCC[C@@H]1C(=O)N[C@H](B1O[C@@]2(C)[C@H]3C[C@H](C3(C)C)C[C@H]2O1)CCC1=CC=C(F)C=C1 JAXFJECJQZDFJS-XHEPKHHKSA-N 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 150000007527 lewis bases Chemical class 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000693 micelle Substances 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- FFHWMHGKLRCGEN-UHFFFAOYSA-N phenylsulfanylbenzene sulfuric acid Chemical compound S(=O)(=O)(O)O.C1(=CC=CC=C1)SC1=CC=CC=C1 FFHWMHGKLRCGEN-UHFFFAOYSA-N 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- YSZUKWLZJXGOTF-UHFFFAOYSA-N propane Chemical group CCC.CCC YSZUKWLZJXGOTF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NNOBHPBYUHDMQF-UHFFFAOYSA-N propylphosphine Chemical compound CCCP NNOBHPBYUHDMQF-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical group 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229960000790 thymol Drugs 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- UDPNXBJIEIPLER-UHFFFAOYSA-N trimethoxysulfanium Chemical compound CO[S+](OC)OC UDPNXBJIEIPLER-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 235000013618 yogurt Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y99/00—Subject matter not provided for in other groups of this subclass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/58—Ethylene oxide or propylene oxide copolymers, e.g. pluronics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2971—Impregnation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/456,128 US6887574B2 (en) | 2003-06-06 | 2003-06-06 | Curable flame retardant epoxy compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200502310A TW200502310A (en) | 2005-01-16 |
| TWI337614B true TWI337614B (en) | 2011-02-21 |
Family
ID=33490093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93116078A TWI337614B (en) | 2003-06-06 | 2004-06-04 | Curable flame retardant epoxy resin compositions |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6887574B2 (https=) |
| EP (1) | EP1639043A2 (https=) |
| JP (2) | JP2006527278A (https=) |
| KR (2) | KR101354756B1 (https=) |
| CN (1) | CN100368475C (https=) |
| SG (1) | SG174631A1 (https=) |
| TW (1) | TWI337614B (https=) |
| WO (1) | WO2004108826A2 (https=) |
Families Citing this family (90)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2006138618A (ru) * | 2004-04-02 | 2008-05-10 | Дау Глобал Текнолоджиз Инк. (Us) | Модифицированные амфифильным блок-сополимером термоотверждающиеся смолы с повышенной ударной вязкостью |
| CN102936445A (zh) * | 2004-11-10 | 2013-02-20 | 陶氏环球技术有限责任公司 | 两性嵌段共聚物增韧的环氧树脂以及由此制造的环境固化的高固含量的涂料 |
| RU2389743C2 (ru) * | 2004-11-10 | 2010-05-20 | Дау Глобал Текнолоджиз Инк. | Эпоксидные смолы, упрочненные амфифильными блок-сополимерами, и порошковые покрытия, выполненные на их основе |
| MX2007005597A (es) * | 2004-11-10 | 2007-05-23 | Dow Global Technologies Inc | Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas. |
| ATE454426T1 (de) * | 2004-11-10 | 2010-01-15 | Dow Global Technologies Inc | Mit einem amphiphilen blockcopolymer gehärteter epoxy-vinylester und ungesättigte polyesterharze |
| EP1814947B1 (en) * | 2004-11-10 | 2009-12-30 | Dow Global Technologies Inc. | Amphiphilic block copolymer-toughened epoxy resins |
| US7896190B2 (en) * | 2006-07-17 | 2011-03-01 | GM Global Technology Operations LLC | Composites having an improved resistance to fatigue |
| CN101511900B (zh) * | 2006-09-14 | 2011-11-23 | 松下电工株式会社 | 印刷电路板用环氧树脂组合物、树脂组合物清漆、预成型料、覆金属层压体、印刷电路板以及多层印刷电路板 |
| BRPI0715994A2 (pt) * | 2006-10-19 | 2013-08-06 | Dow Global Technologies Inc | composiÇço termofxÁvel tendo aderÊncia melhorada a subtratos metÁlicos quando curada, processo para confeccionar um artigo revestido, processo para confeccionar um artigo compàsito reforÇado com fibra, processo para confeccionar um laminado e artigo |
| CN101563436A (zh) * | 2006-12-19 | 2009-10-21 | 陶氏环球技术公司 | 用于支撑剂的新包覆组合物及其制备方法 |
| WO2008110564A1 (en) * | 2007-03-14 | 2008-09-18 | Huntsman Advanced Materials (Switzerland) Gmbh | Curable composition |
| US20080274343A1 (en) * | 2007-05-01 | 2008-11-06 | The Diller Corporation | Thick solid surface laminate product and method of making same |
| EP1987933B1 (en) * | 2007-05-01 | 2014-12-10 | The Diller Corporation | Method of manufacturing thick solid surface product |
| KR20150063590A (ko) * | 2007-08-02 | 2015-06-09 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제 |
| US7926697B2 (en) * | 2007-09-19 | 2011-04-19 | Intel Corporation | Underfill formulation and method of increasing an adhesion property of same |
| KR101150311B1 (ko) * | 2007-11-29 | 2012-06-11 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 에폭시 수지의 경화제로서 디시안디아미드를 사용한 디메틸포름아미드가 없는 제형 |
| US8492482B2 (en) * | 2007-12-10 | 2013-07-23 | Arkema Inc. | Acrylic-based rubber modified thermoset composition |
| EP2229416B1 (en) * | 2008-01-08 | 2018-04-04 | Dow Global Technologies LLC | High tg epoxy systems for composite application |
| KR101538193B1 (ko) * | 2008-02-15 | 2015-07-20 | 가부시키가이샤 구라레 | 경화성 수지 조성물 및 수지 경화물 |
| US20110009527A1 (en) * | 2008-02-15 | 2011-01-13 | Bernd Hoevel | Thermosetting compositions comprising silicone polyethers, their manufacture, and uses |
| EP2268697B1 (en) | 2008-04-14 | 2014-01-29 | Dow Global Technologies LLC | Epoxy-imidazole catalysts useful for powder coating applications |
| FR2930244B1 (fr) * | 2008-04-18 | 2011-06-24 | Commissariat Energie Atomique | Procede de preparation d'un film polymerique presentant en surface des motifs nanometriques et microstructure dans son epaisseur sur tout ou partie de celui-ci selon un systeme particulier |
| EP2303953A1 (en) * | 2008-07-17 | 2011-04-06 | Dow Global Technologies Inc. | Structural composites with improved toughness |
| KR20110059726A (ko) * | 2008-08-28 | 2011-06-03 | 다우 글로벌 테크놀로지스 엘엘씨 | 인-함유 화합물 및 이를 포함하는 중합체 조성물 |
| CA2750703A1 (en) | 2009-02-24 | 2010-09-02 | Gary A. Hunter | Curable epoxy resin compositions and cured products therefrom |
| CN105131525A (zh) * | 2009-03-09 | 2015-12-09 | 陶氏环球技术有限责任公司 | 含有两亲型嵌段共聚物和多元醇的组合的可热固化组合物及其热固产品 |
| PL2406316T3 (pl) | 2009-03-09 | 2018-04-30 | Dow Global Technologies Llc | Termoutwardzalna kompozycja zawierająca kombinację amfifilowego kopolimeru blokowego i poliolu oraz utwardzony termicznie produkt z niej wytworzony |
| US20120046425A1 (en) | 2009-05-27 | 2012-02-23 | Schroetz Markus | Polymeric glycidyl ethers reactive diluents |
| GB2472423B (en) * | 2009-08-05 | 2012-01-11 | Gurit Uk Ltd | Fire-retardant composite materials |
| EP2480586B1 (en) | 2009-09-22 | 2014-11-12 | Dow Global Technologies LLC | Process for preparing episulfide resins |
| KR20120094163A (ko) | 2009-09-25 | 2012-08-23 | 다우 글로벌 테크놀로지스 엘엘씨 | 경화성 에폭시 수지 조성물 및 이로부터 제조된 복합체 |
| JP5584301B2 (ja) | 2009-09-30 | 2014-09-03 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ樹脂組成物 |
| US8871892B2 (en) | 2009-11-12 | 2014-10-28 | Dow Global Technologies Llc | Polyoxazolidone resins |
| EP2507325B1 (en) | 2009-12-02 | 2014-05-21 | Dow Global Technologies LLC | Coating compositions |
| EP2507285A2 (en) | 2009-12-02 | 2012-10-10 | Dow Global Technologies LLC | Composite compositions |
| CN102648227B (zh) | 2009-12-02 | 2015-08-26 | 陶氏环球技术有限责任公司 | 环氧树脂组合物 |
| US20120245306A1 (en) | 2009-12-03 | 2012-09-27 | Marks Maurice J | Adducts based on divinylarene oxides |
| BR112012013135A8 (pt) | 2009-12-08 | 2017-10-24 | Dow Global Technologies Inc | Composição de resina, processo para preparar um resina de poliésyer com funcionalidade hidroxila e processo para preparar uma composição de resina de poliéster com funcionalidade hidroxila curável |
| KR20120114295A (ko) | 2009-12-09 | 2012-10-16 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시 수지 조성물 |
| WO2011071961A2 (en) | 2009-12-09 | 2011-06-16 | Dow Global Technologies Llc | Divinylarene dioxide presins |
| WO2011097009A2 (en) | 2010-02-02 | 2011-08-11 | Dow Global Technologies Llc | Curable epoxy resin compositions |
| KR20130062915A (ko) | 2010-03-24 | 2013-06-13 | 다우 글로벌 테크놀로지스 엘엘씨 | 강인화제로서 폴리(프로필렌 옥사이드) 폴리올을 포함하는 에폭시 수지 조성물 |
| EP2552991A1 (en) * | 2010-03-31 | 2013-02-06 | Dow Global Technologies LLC | Curable compositions |
| US8865917B2 (en) | 2010-05-21 | 2014-10-21 | Dow Global Technologies Llc | Hardeners for thermosettable resin compositions |
| EP2585512A2 (en) | 2010-06-25 | 2013-05-01 | Dow Global Technologies LLC | Curable epoxy resin compositions and composites made therefrom |
| WO2011163154A2 (en) | 2010-06-25 | 2011-12-29 | Dow Global Technologies Llc | Polymer concrete composition |
| CN101906239A (zh) * | 2010-07-23 | 2010-12-08 | 广东汕头超声电子股份有限公司覆铜板厂 | 一种无卤阻燃树脂组合物及其在制备覆铜板中的应用 |
| KR20140027171A (ko) | 2011-04-26 | 2014-03-06 | 다우 글로벌 테크놀로지스 엘엘씨 | 경화성 조성물 |
| BR112014003754A2 (pt) | 2011-08-18 | 2017-03-07 | Dow Global Technologies Llc | composição de resina epóxil curável e processo |
| BR112014003757A2 (pt) | 2011-08-18 | 2017-03-01 | Dow Global Technologies Llc | composição de resina epóxi curável sem solvente, artigo e processo |
| TWI423749B (zh) * | 2011-09-26 | 2014-01-11 | Uniplus Electronics Co Ltd | 用於印刷電路板之鑚孔輔助板 |
| WO2013070478A1 (en) | 2011-11-08 | 2013-05-16 | Dow Global Technologies Llc | Bimodal toughening agents for thermosettable epoxy resin compositions |
| WO2013074265A1 (en) | 2011-11-14 | 2013-05-23 | Henkel Corporation | Adhesive compositions |
| EP2785762A2 (en) | 2011-12-01 | 2014-10-08 | Dow Global Technologies LLC | Liquid accelerator composition for hardeners |
| WO2013095908A2 (en) | 2011-12-20 | 2013-06-27 | Dow Global Technologies Llc | Epoxy resin composites |
| CA2861797A1 (en) | 2011-12-30 | 2013-07-04 | Dow Global Technologies Llc | Low temperature curable epoxy system |
| US9263360B2 (en) | 2012-07-06 | 2016-02-16 | Henkel IP & Holding GmbH | Liquid compression molding encapsulants |
| KR102173954B1 (ko) | 2012-08-13 | 2020-11-04 | 헨켈 아이피 앤드 홀딩 게엠베하 | 액체 압축 성형 캡슐화제 |
| US20150329738A1 (en) | 2012-12-14 | 2015-11-19 | Blue Cube Ip Llc | Modified epoxy resins |
| WO2014093116A2 (en) | 2012-12-14 | 2014-06-19 | Dow Global Technologies Llc | Curable compositions |
| EP2945994B1 (en) | 2013-01-18 | 2018-07-11 | Basf Se | Acrylic dispersion-based coating compositions |
| KR102251170B1 (ko) | 2013-07-22 | 2021-05-13 | 헨켈 아이피 앤드 홀딩 게엠베하 | 웨이퍼의 압축 성형시의 웨이퍼 휨을 제어하는 방법 및 그에 유용한 물품 |
| ES2976164T3 (es) | 2013-09-12 | 2024-07-24 | Bromine Compounds Ltd | Polímeros epoxi bromados como formulaciones ignífugas de acabado textil |
| US10626289B2 (en) | 2013-09-12 | 2020-04-21 | Bromine Compounds Ltd. | Brominated epoxy polymers as wood coating flame retardant formulations |
| US11359128B2 (en) | 2014-02-21 | 2022-06-14 | Halliburton Energy Services, Inc. | Cementing compositions and methods |
| US10208157B2 (en) | 2014-09-11 | 2019-02-19 | Blue Cube Ip Llc | Ester resins |
| WO2016053641A1 (en) | 2014-09-29 | 2016-04-07 | Blue Cube Ip Llc | Adduct composition |
| KR102391148B1 (ko) | 2014-10-10 | 2022-04-26 | 다우 글로벌 테크놀로지스 엘엘씨 | 계면활성제 조성물 |
| TW201641531A (zh) | 2015-04-30 | 2016-12-01 | 藍色立方體有限責任公司 | 硬化劑組成物 |
| CN105175994B (zh) * | 2015-08-03 | 2018-05-04 | 广东生益科技股份有限公司 | 一种覆铜板用环氧树脂组合物及其应用 |
| CN105175995B (zh) * | 2015-08-03 | 2018-05-04 | 广东生益科技股份有限公司 | 一种覆铜板用环氧树脂组合物及其应用 |
| CN105419231B (zh) * | 2015-11-27 | 2017-11-03 | 广东生益科技股份有限公司 | 一种树脂组合物及其制作的覆铜板和pcb板 |
| US20190001593A1 (en) | 2016-01-04 | 2019-01-03 | Dow Global Technologies Llc | Fiber composites with reduced surface roughness and methods for making them |
| CN106398590A (zh) * | 2016-09-13 | 2017-02-15 | 深圳市海纳泰兴电子有限公司 | 无卤覆盖膜粘结剂 |
| US20200094517A1 (en) | 2017-02-26 | 2020-03-26 | Dow Global Technologies Llc | Fiber composites with reduced surface roughness and methods for making them |
| AU2018202595B2 (en) * | 2017-04-20 | 2020-01-30 | Otis Elevator Company | Fire-resistant synthetic tension members |
| EP3612609B1 (en) | 2017-04-21 | 2022-12-28 | Henkel AG & Co. KGaA | Adhesive compositions |
| TWI768032B (zh) | 2017-04-21 | 2022-06-21 | 德商漢高智慧財產控股公司 | 黏著劑組合物 |
| WO2019036189A1 (en) | 2017-08-15 | 2019-02-21 | Covestro Llc | ADDITIVE FOR ENOUGHING EPOXY-BASED RESINS FOR USE IN OIL FIELD APPLICATIONS |
| KR102125544B1 (ko) * | 2018-06-08 | 2020-06-22 | 김종창 | 난연성 세라믹 패널 |
| US20190390065A1 (en) | 2018-06-22 | 2019-12-26 | Covestro Llc | Waterborne compositions containing organic ion-exchangers to improve corrosion resistance |
| US20190390066A1 (en) | 2018-06-22 | 2019-12-26 | Covestro Llc | Waterborne compositions containing inorganic ion-exchangers to improve corrosion resistance |
| US20190390063A1 (en) | 2018-06-22 | 2019-12-26 | Covestro Llc | Solventborne compositions containing organic ion-exchangers to improve corrosion resistance |
| US20190390064A1 (en) | 2018-06-22 | 2019-12-26 | Covestro Llc | Solventborne compositions containing inorganic ion-exchangers to improve corrosion resistance |
| MX2019007512A (es) | 2018-06-22 | 2020-07-29 | Ennis Flint Inc | Composiciones de epoxi y metodos de uso. |
| WO2020005393A1 (en) | 2018-06-26 | 2020-01-02 | Dow Global Technologies Llc | Fibre-reinforced composite and process of making this composite |
| WO2020197561A1 (en) * | 2019-03-28 | 2020-10-01 | Safran Cabin Inc. | Fire retardant epoxy resin |
| CN111892695B (zh) * | 2020-07-13 | 2022-12-30 | 四川省玻纤集团有限公司 | 耐γ辐照的改性树脂及其制备方法、层压板及其制备工艺与应用 |
| WO2022040633A1 (en) * | 2020-08-21 | 2022-02-24 | The University Of Southern Mississippi | Phenylphosphine oxide and oxygen stable epoxy polymers and methods of synthesis |
| CN112194882A (zh) * | 2020-10-12 | 2021-01-08 | 福建师范大学 | 一种本质型阻燃增强环氧树脂及其制备方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3686359A (en) | 1969-12-19 | 1972-08-22 | Union Carbide Corp | Curable polyepoxide compositions |
| GB1380108A (en) * | 1971-03-19 | 1975-01-08 | Unisearch Ltd | Aqueous emulsions of epoxy resins |
| US4066628A (en) | 1976-08-02 | 1978-01-03 | Mitsubishi Chemical Industries Ltd. | Oxazolidone catalyst |
| US4594291A (en) | 1984-07-17 | 1986-06-10 | The Dow Chemical Company | Curable, partially advanced epoxy resins |
| US4902732A (en) | 1985-09-30 | 1990-02-20 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin-based curable compositions |
| US4925901A (en) | 1988-02-12 | 1990-05-15 | The Dow Chemical Company | Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds |
| JP2643518B2 (ja) | 1989-02-10 | 1997-08-20 | 東レ株式会社 | プリプレグ |
| EP0384940B1 (de) | 1989-03-03 | 1994-06-22 | Siemens Aktiengesellschaft | Epoxidharzmischungen |
| JP2738104B2 (ja) * | 1990-01-31 | 1998-04-08 | 大日本インキ化学工業株式会社 | 難燃剤マスターバッチ |
| JP3017562B2 (ja) * | 1991-05-21 | 2000-03-13 | 株式会社巴川製紙所 | 配線基板用エポキシ樹脂組成物 |
| JPH04306224A (ja) * | 1991-04-03 | 1992-10-29 | Toray Ind Inc | エポキシ樹脂組成物 |
| JP2506006B2 (ja) * | 1991-07-25 | 1996-06-12 | 株式会社巴川製紙所 | エポキシ樹脂組成物およびその製造方法 |
| JP2653601B2 (ja) | 1992-05-14 | 1997-09-17 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物 |
| JPH08157669A (ja) * | 1994-12-07 | 1996-06-18 | Asahi Chem Ind Co Ltd | 高温成形時の衝撃特性に優れた樹脂組成物 |
| US6613839B1 (en) | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
| JPH10298406A (ja) * | 1997-04-22 | 1998-11-10 | Matsushita Electric Works Ltd | 金属箔張り積層板用エポキシ樹脂組成物及び金属箔張り積層板用プリプレグ |
| GB9713526D0 (en) | 1997-06-26 | 1997-09-03 | Dow Deutschland Inc | Flame retardant laminating formulations |
| US6153721A (en) * | 1998-02-26 | 2000-11-28 | Honeywell International Inc. | Preparation of polyindanebisphenols and polymers derived therefrom |
| JP3479598B2 (ja) * | 1998-03-23 | 2003-12-15 | 株式会社巴川製紙所 | エポキシ樹脂組成物およびその硬化体 |
| MY124060A (en) * | 1999-01-11 | 2006-06-30 | Ciba Holding Inc | Synthetic polymers comprising additive blends with enhanced effect |
| WO2001042359A1 (en) | 1999-12-13 | 2001-06-14 | Dow Global Technologies Inc. | Flame retardant phosphorus element-containing epoxy resin compositions |
| US6403220B1 (en) | 1999-12-13 | 2002-06-11 | The Dow Chemical Company | Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
| FR2809741B1 (fr) | 2000-05-31 | 2002-08-16 | Atofina | Materiaux thermodurs a tenue au choc amelioree |
| JP2002003699A (ja) * | 2000-06-16 | 2002-01-09 | Nof Corp | エポキシ樹脂組成物、その製造方法及びエポキシ樹脂硬化物 |
| JP2002012740A (ja) * | 2000-06-29 | 2002-01-15 | Nippon Kayaku Co Ltd | 難燃性エポキシ樹脂組成物及びその用途 |
| EP1355965B1 (en) * | 2000-10-19 | 2012-09-19 | Ecole Polytechnique Fédérale de Lausanne (EPFL) | Method of synthesizing block copolymers for multifunctional self-assembled systems |
| US7022777B2 (en) * | 2001-06-28 | 2006-04-04 | General Electric | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
-
2003
- 2003-06-06 US US10/456,128 patent/US6887574B2/en not_active Expired - Lifetime
-
2004
- 2004-05-20 WO PCT/US2004/015773 patent/WO2004108826A2/en not_active Ceased
- 2004-05-20 EP EP20040776054 patent/EP1639043A2/en not_active Withdrawn
- 2004-05-20 JP JP2006514904A patent/JP2006527278A/ja not_active Withdrawn
- 2004-05-20 KR KR1020127011441A patent/KR101354756B1/ko not_active Expired - Fee Related
- 2004-05-20 SG SG2007184112A patent/SG174631A1/en unknown
- 2004-05-20 KR KR1020057023325A patent/KR20060028399A/ko not_active Ceased
- 2004-05-20 CN CNB2004800156419A patent/CN100368475C/zh not_active Expired - Fee Related
- 2004-06-04 TW TW93116078A patent/TWI337614B/zh not_active IP Right Cessation
-
2012
- 2012-03-28 JP JP2012073543A patent/JP5763576B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20040247881A1 (en) | 2004-12-09 |
| KR20060028399A (ko) | 2006-03-29 |
| TW200502310A (en) | 2005-01-16 |
| KR20120064718A (ko) | 2012-06-19 |
| JP2006527278A (ja) | 2006-11-30 |
| KR101354756B1 (ko) | 2014-01-22 |
| EP1639043A2 (en) | 2006-03-29 |
| JP2012158760A (ja) | 2012-08-23 |
| CN100368475C (zh) | 2008-02-13 |
| CN1833001A (zh) | 2006-09-13 |
| WO2004108826A3 (en) | 2005-02-10 |
| WO2004108826A2 (en) | 2004-12-16 |
| SG174631A1 (en) | 2011-10-28 |
| US6887574B2 (en) | 2005-05-03 |
| JP5763576B2 (ja) | 2015-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI337614B (en) | Curable flame retardant epoxy resin compositions | |
| JP4643272B2 (ja) | エポキシ樹脂用硬化剤組成物 | |
| CN101056933B (zh) | 两亲嵌段共聚物增韧的环氧树脂和由其制成的电层压材料 | |
| TWI548698B (zh) | 韌性增加的熱固性樹脂組合物 | |
| TWI667281B (zh) | Thermosetting resin composition | |
| TWI540146B (zh) | 絕緣調配物 | |
| TW201136971A (en) | Epoxy resin compositions | |
| JPS632967B2 (https=) | ||
| TW201100458A (en) | Hardener composition for epoxy resins | |
| JP2009521566A (ja) | 硬化性エポキシ樹脂組成物およびそれから作られた積層体 | |
| CN106661200B (zh) | 环氧树脂组合物、树脂片、预浸料及覆金属层叠板、印刷布线基板、半导体装置 | |
| CN107001584A (zh) | 用于高密度印刷线路板的低热膨胀无卤素阻燃剂组合物 | |
| JPS6015420A (ja) | オリゴマ−性ジアミン硬化剤を含有するエポキシ組成物 | |
| TWI623566B (zh) | 多羥基聚醚樹脂之製造方法，多羥基聚醚樹脂，其樹脂組成物及其硬化物 | |
| JP2017082213A (ja) | エポキシ樹脂組成物、硬化物、半導体素子、樹脂シート、プリプレグ及び炭素繊維強化複合材料 | |
| JP2015209492A (ja) | 液状硬化剤、硬化性樹脂組成物、ファイン化学品及び組成物 | |
| JP7594711B1 (ja) | 硬化性樹脂組成物およびその硬化物 | |
| JP6636599B2 (ja) | エポキシ樹脂組成物、プリプレグ及び金属張積層板、プリント配線基板 | |
| JPWO2020116467A1 (ja) | 熱硬化性樹脂組成物及びシート | |
| WO2024203145A1 (ja) | 硬化性樹脂組成物およびその硬化物 | |
| WO2024203144A1 (ja) | 硬化性樹脂組成物およびその硬化物 | |
| WO2019188291A1 (ja) | エポキシ樹脂組成物及びその硬化物 | |
| TW200906961A (en) | Polymer composition | |
| HK1094509A (en) | Curable flame retardant epoxy resin compositions |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |