JP2006527278A - 硬化性難燃性エポキシ樹脂組成物 - Google Patents

硬化性難燃性エポキシ樹脂組成物 Download PDF

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Publication number
JP2006527278A
JP2006527278A JP2006514904A JP2006514904A JP2006527278A JP 2006527278 A JP2006527278 A JP 2006527278A JP 2006514904 A JP2006514904 A JP 2006514904A JP 2006514904 A JP2006514904 A JP 2006514904A JP 2006527278 A JP2006527278 A JP 2006527278A
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Japan
Prior art keywords
epoxy resin
block copolymer
curable
flame retardant
epoxy
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Japanese (ja)
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JP2006527278A5 (https=
Inventor
エス． バーテス，フランク
エム． ディーン，ジェニファー
キュー． ファム，ハ
イー． バーゲース，ニキル
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ダウ グローバル テクノロジーズ インコーポレイティド
ユニバーシティ オブ ミネソタ
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Publication of JP2006527278A publication Critical patent/JP2006527278A/ja
Publication of JP2006527278A5 publication Critical patent/JP2006527278A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y99/00—Subject matter not provided for in other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/58—Ethylene oxide or propylene oxide copolymers, e.g. pluronics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/2971—Impregnation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP2006514904A 2003-06-06 2004-05-20 硬化性難燃性エポキシ樹脂組成物 Withdrawn JP2006527278A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/456,128 US6887574B2 (en) 2003-06-06 2003-06-06 Curable flame retardant epoxy compositions
PCT/US2004/015773 WO2004108826A2 (en) 2003-06-06 2004-05-20 Curable flame retardant epoxy resin compositions

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012073543A Division JP5763576B2 (ja) 2003-06-06 2012-03-28 硬化性難燃性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JP2006527278A true JP2006527278A (ja) 2006-11-30
JP2006527278A5 JP2006527278A5 (https=) 2007-07-05

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ID=33490093

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Application Number Title Priority Date Filing Date
JP2006514904A Withdrawn JP2006527278A (ja) 2003-06-06 2004-05-20 硬化性難燃性エポキシ樹脂組成物
JP2012073543A Expired - Fee Related JP5763576B2 (ja) 2003-06-06 2012-03-28 硬化性難燃性エポキシ樹脂組成物

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Country Status (8)

Country Link
US (1) US6887574B2 (https=)
EP (1) EP1639043A2 (https=)
JP (2) JP2006527278A (https=)
KR (2) KR20060028399A (https=)
CN (1) CN100368475C (https=)
SG (1) SG174631A1 (https=)
TW (1) TWI337614B (https=)
WO (1) WO2004108826A2 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008519886A (ja) * 2004-11-10 2008-06-12 ダウ グローバル テクノロジーズ インコーポレイティド 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造された電気用積層板
JP2008519888A (ja) * 2004-11-10 2008-06-12 ダウ グローバル テクノロジーズ インコーポレイティド 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂
JP2011528399A (ja) * 2008-07-17 2011-11-17 ダウ グローバル テクノロジーズ エルエルシー 改善された靭性を有する構造用複合材料
JP2012519761A (ja) * 2009-03-09 2012-08-30 ダウ グローバル テクノロジーズ エルエルシー 両親媒性ブロックコポリマー及びポリオールの組合せを含む熱硬化性組成物並びにそれからの熱硬化生成物
JP2013057074A (ja) * 2004-11-10 2013-03-28 Dow Global Technologies Llc 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造される室温硬化型ハイソリッドコーティング
JP2013523945A (ja) * 2010-03-31 2013-06-17 ダウ グローバル テクノロジーズ エルエルシー 硬化性組成物
JP2014025068A (ja) * 2004-04-02 2014-02-06 Dow Global Technologies Llc 両親媒性ブロックコポリマー強化熱硬化樹脂
JP2014111774A (ja) * 2007-03-14 2014-06-19 Three D Syst Inc 硬化性組成物

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KR101226377B1 (ko) * 2004-11-10 2013-01-24 다우 글로벌 테크놀로지스 엘엘씨 양친매성 블록 공중합체-강인화된 에폭시 수지 및 그로부터제조된 분말 코팅
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JP5336485B2 (ja) * 2007-08-02 2013-11-06 ダウ グローバル テクノロジーズ エルエルシー 熱硬化性ポリマーの性能を向上させるための両親媒性ブロックコポリマーおよび無機ナノフィラー
US7926697B2 (en) * 2007-09-19 2011-04-19 Intel Corporation Underfill formulation and method of increasing an adhesion property of same
JP2011505461A (ja) * 2007-11-29 2011-02-24 ダウ グローバル テクノロジーズ インコーポレイティド 熱硬化性エポキシ樹脂用硬化剤としてジシアンジアミドを使用するジメチルホルムアミドを含まない配合物
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WO2009101961A1 (ja) * 2008-02-15 2009-08-20 Kuraray Co., Ltd. 硬化性樹脂組成物および樹脂硬化物
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KR20160007668A (ko) 2008-04-14 2016-01-20 블루 큐브 아이피 엘엘씨 분말 피복 분야에 유용한 에폭시-이미다졸 촉매
FR2930244B1 (fr) * 2008-04-18 2011-06-24 Commissariat Energie Atomique Procede de preparation d'un film polymerique presentant en surface des motifs nanometriques et microstructure dans son epaisseur sur tout ou partie de celui-ci selon un systeme particulier
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JP2012518707A (ja) 2009-02-24 2012-08-16 ダウ グローバル テクノロジーズ エルエルシー 硬化性エポキシ樹脂組成物及びその硬化体生成物
CN105131525A (zh) * 2009-03-09 2015-12-09 陶氏环球技术有限责任公司 含有两亲型嵌段共聚物和多元醇的组合的可热固化组合物及其热固产品
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