TWI326006B - - Google Patents

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Publication number
TWI326006B
TWI326006B TW092121521A TW92121521A TWI326006B TW I326006 B TWI326006 B TW I326006B TW 092121521 A TW092121521 A TW 092121521A TW 92121521 A TW92121521 A TW 92121521A TW I326006 B TWI326006 B TW I326006B
Authority
TW
Taiwan
Prior art keywords
group
photosensitive
photoresist layer
compound
image forming
Prior art date
Application number
TW092121521A
Other languages
English (en)
Chinese (zh)
Other versions
TW200416487A (en
Inventor
Urano Toshiyuki
Yasuhiro Kameyama
Takashi Miyazawa
Eriko Toshimitsu
Original Assignee
Nippon Synthetic Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Synthetic Chem Ind filed Critical Nippon Synthetic Chem Ind
Publication of TW200416487A publication Critical patent/TW200416487A/zh
Application granted granted Critical
Publication of TWI326006B publication Critical patent/TWI326006B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW092121521A 2002-08-07 2003-08-06 Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method thereof TW200416487A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002229416 2002-08-07
JP2002365470 2002-12-17
JP2003017559 2003-01-27
JP2003034161 2003-02-12
JP2003044649 2003-02-21

Publications (2)

Publication Number Publication Date
TW200416487A TW200416487A (en) 2004-09-01
TWI326006B true TWI326006B (https=) 2010-06-11

Family

ID=31721816

Family Applications (2)

Application Number Title Priority Date Filing Date
TW092121521A TW200416487A (en) 2002-08-07 2003-08-06 Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method thereof
TW096137263A TW200839443A (en) 2002-08-07 2003-08-06 Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method therefor

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW096137263A TW200839443A (en) 2002-08-07 2003-08-06 Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method therefor

Country Status (5)

Country Link
KR (2) KR20050047088A (https=)
CN (2) CN100573321C (https=)
AU (1) AU2003254812A1 (https=)
TW (2) TW200416487A (https=)
WO (1) WO2004015497A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100970357B1 (ko) * 2003-09-25 2010-07-16 니뽄 고오세이가가꾸 고오교오 가부시끼가이샤 네가티브형 청자색 레이저 감광성 조성물, 화상 형성 재료,화상 형성재, 및 화상 형성 방법
CN1950750B (zh) * 2004-05-12 2012-10-24 旭化成电子材料株式会社 图案形成材料、图案形成设备和图案形成方法
JP2006154740A (ja) * 2004-07-14 2006-06-15 Fuji Photo Film Co Ltd 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
KR20130042049A (ko) 2004-07-14 2013-04-25 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 조성물, 패턴형성재료, 감광성 적층체, 및 패턴형성장치 및 패턴형성방법
TW200622491A (en) * 2004-09-28 2006-07-01 Fuji Photo Film Co Ltd Pattern-forming material, pattern-forming device and pattern-forming method
TWI485064B (zh) * 2006-03-10 2015-05-21 羅門哈斯電子材料有限公司 用於光微影之組成物及製程
KR101313538B1 (ko) * 2006-04-06 2013-10-01 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물
JP4975579B2 (ja) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 組成物、ドライフィルム、硬化物及びプリント配線板
TWI491982B (zh) * 2009-10-28 2015-07-11 Sumitomo Chemical Co Coloring the photosensitive resin composition
JP5296828B2 (ja) * 2011-04-15 2013-09-25 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
KR102006993B1 (ko) * 2011-05-31 2019-08-02 덴카 주식회사 에너지선 경화성 수지 조성물
EP2682440A1 (en) * 2012-07-06 2014-01-08 Basf Se A chemical mechanical polishing (cmp) composition comprising a non-ionic surfactant and a carbonate salt
CN103298265B (zh) * 2013-04-09 2016-04-06 王俊生 一种电路板外层线路成型方法
KR102145934B1 (ko) * 2014-05-20 2020-08-19 동우 화인켐 주식회사 광경화 패턴의 형성 방법
CN105418674A (zh) * 2015-11-10 2016-03-23 中国乐凯集团有限公司 一种高折射率树脂及其应用
CN109563234B (zh) * 2016-08-08 2022-08-23 日产化学株式会社 光固化性组合物及半导体装置的制造方法
US10520813B2 (en) * 2016-12-15 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd Extreme ultraviolet photoresist with high-efficiency electron transfer
TWI816671B (zh) * 2017-04-25 2023-10-01 德商馬克專利公司 用於產生底切圖樣輪廓之負型光阻調配物以及使光阻組合物成像之方法和用於使基板上之圖樣化光阻劑金屬化之剝離方法
CN115917432A (zh) * 2020-07-01 2023-04-04 东京应化工业株式会社 感光性组合物、感光性干膜、带镀覆用铸模的基板的制造方法及镀覆造形物的制造方法
US20220067489A1 (en) 2020-08-28 2022-03-03 Illumina, Inc. Detecting and Filtering Clusters Based on Artificial Intelligence-Predicted Base Calls
AU2022248999A1 (en) 2021-03-31 2023-02-02 Illumina, Inc. Artificial intelligence-based base caller with contextual awareness
CN117631439B (zh) * 2022-08-31 2025-10-31 长春人造树脂厂股份有限公司 光阻膜及其应用

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09281698A (ja) 1996-04-11 1997-10-31 Mitsubishi Chem Corp カラーフィルター用光重合性組成物
EP0985683A1 (en) * 1998-09-09 2000-03-15 Fuji Photo Film Co., Ltd. Photosensitive composition and method for manufacturing lithographic printing plate
US6335144B1 (en) 1999-04-27 2002-01-01 Fuji Photo Film Co., Ltd. Photopolymerizable composition for short wavelength semiconductor laser exposure
DE06121351T1 (de) * 2000-04-19 2009-01-29 Agfa Graphics N.V. Lichtempfindliche lithografische Druckplatte und Verfahren zur Herstellung einer Druckplatte
JP2002072460A (ja) * 2000-09-05 2002-03-12 Mitsui Chemicals Inc ポジ型可視光感光性樹脂組成物及びその用途
JP2002148801A (ja) * 2000-11-14 2002-05-22 Mitsui Chemicals Inc ポジ型可視光感光性樹脂組成物及びその用途
JP2002169275A (ja) * 2000-12-04 2002-06-14 Mitsui Chemicals Inc 光酸発生剤及びそれを用いた可視光感光性樹脂組成物
JP2002202598A (ja) * 2000-12-28 2002-07-19 Fuji Photo Film Co Ltd 感光性組成物およびそれを用いた光重合方法
JP4152597B2 (ja) * 2001-02-16 2008-09-17 三菱製紙株式会社 感光性組成物
JP2003167329A (ja) * 2001-09-20 2003-06-13 Mitsubishi Chemicals Corp 平版印刷版の作製方法
JP2003195526A (ja) * 2001-12-27 2003-07-09 Mitsubishi Chemicals Corp 感光性平版印刷版の刷版方法

Also Published As

Publication number Publication date
CN100573321C (zh) 2009-12-23
TW200839443A (en) 2008-10-01
KR20080011351A (ko) 2008-02-01
AU2003254812A1 (en) 2004-02-25
CN101135850B (zh) 2011-02-16
TW200416487A (en) 2004-09-01
WO2004015497A1 (ja) 2004-02-19
KR20050047088A (ko) 2005-05-19
CN1675588A (zh) 2005-09-28
KR101003323B1 (ko) 2010-12-22
CN101135850A (zh) 2008-03-05

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