TWI313624B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
TWI313624B
TWI313624B TW095133071A TW95133071A TWI313624B TW I313624 B TWI313624 B TW I313624B TW 095133071 A TW095133071 A TW 095133071A TW 95133071 A TW95133071 A TW 95133071A TW I313624 B TWI313624 B TW I313624B
Authority
TW
Taiwan
Prior art keywords
substrate
rotation
liquid
processing
center
Prior art date
Application number
TW095133071A
Other languages
English (en)
Chinese (zh)
Other versions
TW200724247A (en
Inventor
Kazuo Jyodai
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200724247A publication Critical patent/TW200724247A/zh
Application granted granted Critical
Publication of TWI313624B publication Critical patent/TWI313624B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW095133071A 2005-12-27 2006-09-07 Substrate processing apparatus and substrate processing method TWI313624B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005374571A JP4476217B2 (ja) 2005-12-27 2005-12-27 基板処理装置

Publications (2)

Publication Number Publication Date
TW200724247A TW200724247A (en) 2007-07-01
TWI313624B true TWI313624B (en) 2009-08-21

Family

ID=38214313

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133071A TWI313624B (en) 2005-12-27 2006-09-07 Substrate processing apparatus and substrate processing method

Country Status (4)

Country Link
JP (1) JP4476217B2 (ko)
KR (1) KR100816982B1 (ko)
CN (1) CN100483617C (ko)
TW (1) TWI313624B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5391014B2 (ja) * 2009-09-28 2014-01-15 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5671261B2 (ja) * 2010-06-04 2015-02-18 東京応化工業株式会社 被処理体の処理方法
JP5743853B2 (ja) * 2010-12-28 2015-07-01 東京エレクトロン株式会社 液処理装置および液処理方法
JP5646354B2 (ja) * 2011-01-25 2014-12-24 東京エレクトロン株式会社 液処理装置および液処理方法
JP2014123590A (ja) * 2012-12-20 2014-07-03 Disco Abrasive Syst Ltd 洗浄装置
JP6182347B2 (ja) * 2013-04-19 2017-08-16 株式会社荏原製作所 基板処理装置
CN104128292A (zh) * 2013-04-30 2014-11-05 细美事有限公司 基板处理装置以及基板处理方法
JP5939204B2 (ja) * 2013-06-12 2016-06-22 東京エレクトロン株式会社 液処理装置
JP6478692B2 (ja) * 2015-02-18 2019-03-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10332761B2 (en) 2015-02-18 2019-06-25 SCREEN Holdings Co., Ltd. Substrate processing apparatus
CN107502893B (zh) * 2017-08-07 2024-01-30 上海利正卫星应用技术有限公司 一种腐蚀机自旋转夹盘装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025012A (en) * 1995-09-20 2000-02-15 Matsushita Electric Industrial Co., Ltd. Method and apparatus for determining film thickness control conditions and discharging liquid to a rotating substrate
JPH11165114A (ja) * 1997-12-05 1999-06-22 Dainippon Screen Mfg Co Ltd 枚葉式基板処理装置
JP2002064079A (ja) * 2000-08-22 2002-02-28 Disco Abrasive Syst Ltd エッチング装置
JP4372984B2 (ja) * 2000-09-27 2009-11-25 東京エレクトロン株式会社 塗布装置及び塗布方法
KR100488753B1 (ko) * 2001-07-23 2005-05-11 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리방법 및 그 장치
JP3958539B2 (ja) * 2001-08-02 2007-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2005116677A (ja) * 2003-10-06 2005-04-28 Sigma Meltec Ltd 薬液供給ノズル、基板の薬液処理装置及び薬液処理方法

Also Published As

Publication number Publication date
KR20070068997A (ko) 2007-07-02
CN100483617C (zh) 2009-04-29
JP2007180144A (ja) 2007-07-12
TW200724247A (en) 2007-07-01
KR100816982B1 (ko) 2008-03-27
JP4476217B2 (ja) 2010-06-09
CN1992153A (zh) 2007-07-04

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