CN100483617C - 基板处理装置以及基板处理方法 - Google Patents
基板处理装置以及基板处理方法 Download PDFInfo
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- CN100483617C CN100483617C CNB200610132006XA CN200610132006A CN100483617C CN 100483617 C CN100483617 C CN 100483617C CN B200610132006X A CNB200610132006X A CN B200610132006XA CN 200610132006 A CN200610132006 A CN 200610132006A CN 100483617 C CN100483617 C CN 100483617C
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- 238000003672 processing method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 508
- 238000011282 treatment Methods 0.000 claims abstract description 266
- 241000220317 Rosa Species 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000012530 fluid Substances 0.000 claims description 239
- 230000008569 process Effects 0.000 claims description 30
- 230000033228 biological regulation Effects 0.000 claims description 23
- 239000007921 spray Substances 0.000 claims description 21
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 35
- 235000014347 soups Nutrition 0.000 description 130
- 230000008093 supporting effect Effects 0.000 description 20
- 239000000126 substance Substances 0.000 description 11
- 241000278713 Theora Species 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 7
- 239000003814 drug Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 229960002050 hydrofluoric acid Drugs 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000002153 concerted effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005374571 | 2005-12-27 | ||
JP2005374571A JP4476217B2 (ja) | 2005-12-27 | 2005-12-27 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1992153A CN1992153A (zh) | 2007-07-04 |
CN100483617C true CN100483617C (zh) | 2009-04-29 |
Family
ID=38214313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200610132006XA Expired - Fee Related CN100483617C (zh) | 2005-12-27 | 2006-10-19 | 基板处理装置以及基板处理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4476217B2 (zh) |
KR (1) | KR100816982B1 (zh) |
CN (1) | CN100483617C (zh) |
TW (1) | TWI313624B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5391014B2 (ja) * | 2009-09-28 | 2014-01-15 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP5671261B2 (ja) * | 2010-06-04 | 2015-02-18 | 東京応化工業株式会社 | 被処理体の処理方法 |
JP5743853B2 (ja) * | 2010-12-28 | 2015-07-01 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP5646354B2 (ja) * | 2011-01-25 | 2014-12-24 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP2014123590A (ja) * | 2012-12-20 | 2014-07-03 | Disco Abrasive Syst Ltd | 洗浄装置 |
JP6182347B2 (ja) | 2013-04-19 | 2017-08-16 | 株式会社荏原製作所 | 基板処理装置 |
CN104128292A (zh) * | 2013-04-30 | 2014-11-05 | 细美事有限公司 | 基板处理装置以及基板处理方法 |
JP5939204B2 (ja) * | 2013-06-12 | 2016-06-22 | 東京エレクトロン株式会社 | 液処理装置 |
JP6478692B2 (ja) * | 2015-02-18 | 2019-03-06 | 株式会社Screenホールディングス | 基板処理装置 |
US10332761B2 (en) | 2015-02-18 | 2019-06-25 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
CN107502893B (zh) * | 2017-08-07 | 2024-01-30 | 上海利正卫星应用技术有限公司 | 一种腐蚀机自旋转夹盘装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6025012A (en) * | 1995-09-20 | 2000-02-15 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for determining film thickness control conditions and discharging liquid to a rotating substrate |
JPH11165114A (ja) * | 1997-12-05 | 1999-06-22 | Dainippon Screen Mfg Co Ltd | 枚葉式基板処理装置 |
JP2002064079A (ja) * | 2000-08-22 | 2002-02-28 | Disco Abrasive Syst Ltd | エッチング装置 |
JP4372984B2 (ja) * | 2000-09-27 | 2009-11-25 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
KR100488753B1 (ko) * | 2001-07-23 | 2005-05-11 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리방법 및 그 장치 |
JP3958539B2 (ja) * | 2001-08-02 | 2007-08-15 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP2005116677A (ja) * | 2003-10-06 | 2005-04-28 | Sigma Meltec Ltd | 薬液供給ノズル、基板の薬液処理装置及び薬液処理方法 |
-
2005
- 2005-12-27 JP JP2005374571A patent/JP4476217B2/ja not_active Expired - Fee Related
-
2006
- 2006-09-07 TW TW095133071A patent/TWI313624B/zh not_active IP Right Cessation
- 2006-09-26 KR KR1020060093451A patent/KR100816982B1/ko not_active IP Right Cessation
- 2006-10-19 CN CNB200610132006XA patent/CN100483617C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI313624B (en) | 2009-08-21 |
TW200724247A (en) | 2007-07-01 |
KR100816982B1 (ko) | 2008-03-27 |
JP4476217B2 (ja) | 2010-06-09 |
KR20070068997A (ko) | 2007-07-02 |
JP2007180144A (ja) | 2007-07-12 |
CN1992153A (zh) | 2007-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090429 Termination date: 20151019 |
|
EXPY | Termination of patent right or utility model |