JP4476217B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP4476217B2 JP4476217B2 JP2005374571A JP2005374571A JP4476217B2 JP 4476217 B2 JP4476217 B2 JP 4476217B2 JP 2005374571 A JP2005374571 A JP 2005374571A JP 2005374571 A JP2005374571 A JP 2005374571A JP 4476217 B2 JP4476217 B2 JP 4476217B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid
- rotation
- processing liquid
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 531
- 239000007788 liquid Substances 0.000 claims description 323
- 238000000034 method Methods 0.000 claims description 25
- 230000008569 process Effects 0.000 claims description 24
- 238000007599 discharging Methods 0.000 claims description 16
- 230000008021 deposition Effects 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 description 146
- 239000000243 solution Substances 0.000 description 81
- 238000005530 etching Methods 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 9
- 238000000151 deposition Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000008155 medical solution Substances 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Cleaning By Liquid Or Steam (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005374571A JP4476217B2 (ja) | 2005-12-27 | 2005-12-27 | 基板処理装置 |
TW095133071A TWI313624B (en) | 2005-12-27 | 2006-09-07 | Substrate processing apparatus and substrate processing method |
KR1020060093451A KR100816982B1 (ko) | 2005-12-27 | 2006-09-26 | 기판 처리 장치 및 기판 처리 방법 |
CNB200610132006XA CN100483617C (zh) | 2005-12-27 | 2006-10-19 | 基板处理装置以及基板处理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005374571A JP4476217B2 (ja) | 2005-12-27 | 2005-12-27 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007180144A JP2007180144A (ja) | 2007-07-12 |
JP4476217B2 true JP4476217B2 (ja) | 2010-06-09 |
Family
ID=38214313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005374571A Expired - Fee Related JP4476217B2 (ja) | 2005-12-27 | 2005-12-27 | 基板処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4476217B2 (zh) |
KR (1) | KR100816982B1 (zh) |
CN (1) | CN100483617C (zh) |
TW (1) | TWI313624B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5391014B2 (ja) * | 2009-09-28 | 2014-01-15 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP5671261B2 (ja) * | 2010-06-04 | 2015-02-18 | 東京応化工業株式会社 | 被処理体の処理方法 |
JP5743853B2 (ja) * | 2010-12-28 | 2015-07-01 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP5646354B2 (ja) * | 2011-01-25 | 2014-12-24 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP2014123590A (ja) * | 2012-12-20 | 2014-07-03 | Disco Abrasive Syst Ltd | 洗浄装置 |
JP6182347B2 (ja) | 2013-04-19 | 2017-08-16 | 株式会社荏原製作所 | 基板処理装置 |
CN104128292A (zh) * | 2013-04-30 | 2014-11-05 | 细美事有限公司 | 基板处理装置以及基板处理方法 |
JP5939204B2 (ja) * | 2013-06-12 | 2016-06-22 | 東京エレクトロン株式会社 | 液処理装置 |
US10332761B2 (en) | 2015-02-18 | 2019-06-25 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
JP6478692B2 (ja) * | 2015-02-18 | 2019-03-06 | 株式会社Screenホールディングス | 基板処理装置 |
CN107502893B (zh) * | 2017-08-07 | 2024-01-30 | 上海利正卫星应用技术有限公司 | 一种腐蚀机自旋转夹盘装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6025012A (en) * | 1995-09-20 | 2000-02-15 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for determining film thickness control conditions and discharging liquid to a rotating substrate |
JPH11165114A (ja) * | 1997-12-05 | 1999-06-22 | Dainippon Screen Mfg Co Ltd | 枚葉式基板処理装置 |
JP2002064079A (ja) * | 2000-08-22 | 2002-02-28 | Disco Abrasive Syst Ltd | エッチング装置 |
JP4372984B2 (ja) * | 2000-09-27 | 2009-11-25 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
KR100488753B1 (ko) * | 2001-07-23 | 2005-05-11 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리방법 및 그 장치 |
JP3958539B2 (ja) * | 2001-08-02 | 2007-08-15 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP2005116677A (ja) * | 2003-10-06 | 2005-04-28 | Sigma Meltec Ltd | 薬液供給ノズル、基板の薬液処理装置及び薬液処理方法 |
-
2005
- 2005-12-27 JP JP2005374571A patent/JP4476217B2/ja not_active Expired - Fee Related
-
2006
- 2006-09-07 TW TW095133071A patent/TWI313624B/zh not_active IP Right Cessation
- 2006-09-26 KR KR1020060093451A patent/KR100816982B1/ko not_active IP Right Cessation
- 2006-10-19 CN CNB200610132006XA patent/CN100483617C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200724247A (en) | 2007-07-01 |
KR20070068997A (ko) | 2007-07-02 |
TWI313624B (en) | 2009-08-21 |
CN100483617C (zh) | 2009-04-29 |
KR100816982B1 (ko) | 2008-03-27 |
JP2007180144A (ja) | 2007-07-12 |
CN1992153A (zh) | 2007-07-04 |
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