TWI312105B - - Google Patents
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- Publication number
- TWI312105B TWI312105B TW091112934A TW91112934A TWI312105B TW I312105 B TWI312105 B TW I312105B TW 091112934 A TW091112934 A TW 091112934A TW 91112934 A TW91112934 A TW 91112934A TW I312105 B TWI312105 B TW I312105B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- water
- concentration
- photoresist
- stripping
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims description 180
- 229920002120 photoresistant polymer Polymers 0.000 claims description 162
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 116
- 239000000243 solution Substances 0.000 claims description 49
- 238000007726 management method Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 17
- 239000011550 stock solution Substances 0.000 claims description 16
- 238000011069 regeneration method Methods 0.000 claims description 12
- 230000008929 regeneration Effects 0.000 claims description 10
- KXDHJXZQYSOELW-UHFFFAOYSA-N carbonic acid monoamide Natural products NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 3
- KJAMZCVTJDTESW-UHFFFAOYSA-N tiracizine Chemical compound C1CC2=CC=CC=C2N(C(=O)CN(C)C)C2=CC(NC(=O)OCC)=CC=C21 KJAMZCVTJDTESW-UHFFFAOYSA-N 0.000 claims description 3
- 206010029412 Nightmare Diseases 0.000 claims 1
- 206010040844 Skin exfoliation Diseases 0.000 description 34
- 238000002835 absorbance Methods 0.000 description 31
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 26
- 230000006866 deterioration Effects 0.000 description 26
- 239000000758 substrate Substances 0.000 description 25
- 238000005259 measurement Methods 0.000 description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 15
- 239000001301 oxygen Substances 0.000 description 15
- 229910052760 oxygen Inorganic materials 0.000 description 15
- 229910002092 carbon dioxide Inorganic materials 0.000 description 12
- 239000001569 carbon dioxide Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000000470 constituent Substances 0.000 description 10
- QENMPTUFXWVPQZ-UHFFFAOYSA-N (2-hydroxyethylazaniumyl)formate Chemical compound OCCNC(O)=O QENMPTUFXWVPQZ-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 230000002079 cooperative effect Effects 0.000 description 7
- 239000011259 mixed solution Substances 0.000 description 7
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000001105 regulatory effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000013626 chemical specie Substances 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 235000011089 carbon dioxide Nutrition 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- BTDQXGUEVVTAMD-UHFFFAOYSA-N 2-hydroxyethyl carbamate Chemical compound NC(=O)OCCO BTDQXGUEVVTAMD-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 238000010129 solution processing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XXMBEHIWODXDTR-UHFFFAOYSA-N 1,2-diaminoethanol Chemical compound NCC(N)O XXMBEHIWODXDTR-UHFFFAOYSA-N 0.000 description 1
- IWSZDQRGNFLMJS-UHFFFAOYSA-N 2-(dibutylamino)ethanol Chemical compound CCCCN(CCO)CCCC IWSZDQRGNFLMJS-UHFFFAOYSA-N 0.000 description 1
- 201000004384 Alopecia Diseases 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 238000011481 absorbance measurement Methods 0.000 description 1
- 238000009933 burial Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 208000024963 hair loss Diseases 0.000 description 1
- 230000003676 hair loss Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- WHMQHKUIPUYTKP-UHFFFAOYSA-N propane-1,2,3-triol;propanoic acid Chemical compound CCC(O)=O.OCC(O)CO WHMQHKUIPUYTKP-UHFFFAOYSA-N 0.000 description 1
- 239000012492 regenerant Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000006257 total synthesis reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/12—Condition responsive control
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001191703A JP3914722B2 (ja) | 2001-06-25 | 2001-06-25 | 水系レジスト剥離液管理装置及び水系レジスト剥離液管理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI312105B true TWI312105B (enExample) | 2009-07-11 |
Family
ID=19030286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091112934A TWI312105B (enExample) | 2001-06-25 | 2002-06-13 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7109037B2 (enExample) |
| JP (1) | JP3914722B2 (enExample) |
| KR (1) | KR20030023456A (enExample) |
| CN (1) | CN1295568C (enExample) |
| TW (1) | TWI312105B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI495967B (zh) * | 2011-05-20 | 2015-08-11 | Panasonic Corp | Photoresist stripping solution, stripping liquid recovery system and operation method and stripping liquid recovery method |
| TWI691811B (zh) * | 2016-03-14 | 2020-04-21 | 日商平間理化硏究所股份有限公司 | 水系阻劑剝離液的調製裝置及非水系阻劑剝離液的調製裝置 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100652044B1 (ko) * | 2001-12-18 | 2006-11-30 | 엘지.필립스 엘시디 주식회사 | 스트립 장치 |
| US7867696B2 (en) * | 2004-04-15 | 2011-01-11 | The Boeing Company | Method and apparatus for monitoring saturation levels of solvents used during rapid prototyping processes |
| US20070289905A1 (en) * | 2006-06-20 | 2007-12-20 | Biofuels Automation, Inc. | System for managing solution for cleaning fermentation tanks |
| US8545636B2 (en) * | 2006-07-27 | 2013-10-01 | Atmel Corporation | Conductivity control of water content in solvent strip baths |
| US7935642B2 (en) * | 2007-11-16 | 2011-05-03 | General Electric Company | Replenishment method for an advanced coating removal stripping solution |
| JP5712051B2 (ja) * | 2011-05-20 | 2015-05-07 | パナソニック株式会社 | 剥離液リサイクルシステムと運転方法および剥離液のリサイクル方法 |
| JP2013183080A (ja) * | 2012-03-02 | 2013-09-12 | Mitsubishi Gas Chemical Co Inc | レジスト剥離液の劣化抑制方法、レジスト剥離方法及びシステム |
| US8877084B2 (en) | 2012-06-22 | 2014-11-04 | General Electric Company | Method for refreshing an acid bath solution |
| JP6041260B2 (ja) * | 2012-10-11 | 2016-12-07 | パナソニックＩｐマネジメント株式会社 | レジスト剥離液の調合槽からのサンプリング方法およびサンプリング装置 |
| JP6249217B2 (ja) * | 2013-12-27 | 2017-12-20 | パナソニックＩｐマネジメント株式会社 | レジスト剥離液の組成比維持装置およびレジスト剥離液の組成比維持方法 |
| JP7718815B2 (ja) | 2017-04-21 | 2025-08-05 | シルラゼン， インコーポレイテッド | 腫瘍溶解性ワクシニアウイルスおよびチェックポイント阻害剤の併用療法 |
| JP7770107B2 (ja) * | 2021-05-10 | 2025-11-14 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW256929B (enExample) * | 1993-12-29 | 1995-09-11 | Hirama Rika Kenkyusho Kk | |
| JP2602179B2 (ja) | 1993-12-29 | 1997-04-23 | 株式会社平間理化研究所 | レジスト剥離液管理装置 |
| JP3093975B2 (ja) | 1996-07-02 | 2000-10-03 | 株式会社平間理化研究所 | レジスト剥離液管理装置 |
| JPH1083946A (ja) * | 1996-09-06 | 1998-03-31 | Fujitsu Ltd | レジスト剥離液管理方法及びレジスト剥離装置 |
| JP3126690B2 (ja) | 1997-10-27 | 2001-01-22 | 株式会社平間理化研究所 | レジスト剥離液管理装置 |
| KR100306649B1 (ko) * | 1997-12-03 | 2001-11-14 | 주식회사 동진쎄미켐 | 레지스트박리액,이를이용한레지스트박리방법,레지스트박리액재생장치,및레지스트박리액관리장치 |
| JP3630543B2 (ja) * | 1998-02-05 | 2005-03-16 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US6235641B1 (en) * | 1998-10-30 | 2001-05-22 | Fsi International Inc. | Method and system to control the concentration of dissolved gas in a liquid |
| JP2000338684A (ja) * | 1999-05-26 | 2000-12-08 | Nagase & Co Ltd | 基板表面処理装置 |
| JP2001223153A (ja) * | 2000-02-10 | 2001-08-17 | Mitsubishi Electric Corp | レジスト剥離装置およびレジスト剥離液管理方法、並びに半導体装置およびその製造方法 |
-
2001
- 2001-06-25 JP JP2001191703A patent/JP3914722B2/ja not_active Expired - Fee Related
-
2002
- 2002-06-13 TW TW091112934A patent/TWI312105B/zh not_active IP Right Cessation
- 2002-06-24 KR KR1020020035235A patent/KR20030023456A/ko not_active Ceased
- 2002-06-25 US US10/183,833 patent/US7109037B2/en not_active Expired - Fee Related
- 2002-06-25 CN CNB021470391A patent/CN1295568C/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI495967B (zh) * | 2011-05-20 | 2015-08-11 | Panasonic Corp | Photoresist stripping solution, stripping liquid recovery system and operation method and stripping liquid recovery method |
| TWI691811B (zh) * | 2016-03-14 | 2020-04-21 | 日商平間理化硏究所股份有限公司 | 水系阻劑剝離液的調製裝置及非水系阻劑剝離液的調製裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7109037B2 (en) | 2006-09-19 |
| JP3914722B2 (ja) | 2007-05-16 |
| US20020197869A1 (en) | 2002-12-26 |
| KR20030023456A (ko) | 2003-03-19 |
| JP2003005387A (ja) | 2003-01-08 |
| CN1295568C (zh) | 2007-01-17 |
| CN1407411A (zh) | 2003-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |