TWI311158B - Process and device for positioning the mask - Google Patents
Process and device for positioning the mask Download PDFInfo
- Publication number
- TWI311158B TWI311158B TW095111672A TW95111672A TWI311158B TW I311158 B TWI311158 B TW I311158B TW 095111672 A TW095111672 A TW 095111672A TW 95111672 A TW95111672 A TW 95111672A TW I311158 B TWI311158 B TW I311158B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- mask
- support
- magnets
- electromagnets
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 19
- 230000008569 process Effects 0.000 title description 7
- 239000000758 substrate Substances 0.000 claims abstract description 154
- 238000000576 coating method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000001771 vacuum deposition Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000012544 monitoring process Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000012806 monitoring device Methods 0.000 claims description 4
- 230000000873 masking effect Effects 0.000 claims description 2
- 210000001217 buttock Anatomy 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
- 238000011068 loading method Methods 0.000 claims 1
- 238000013459 approach Methods 0.000 abstract 1
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 241000282320 Panthera leo Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05008663A EP1715076B1 (de) | 2005-04-20 | 2005-04-20 | Verfahren und Vorrichtung zur Maskenpositionierung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200706663A TW200706663A (en) | 2007-02-16 |
| TWI311158B true TWI311158B (en) | 2009-06-21 |
Family
ID=34935470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095111672A TWI311158B (en) | 2005-04-20 | 2006-03-31 | Process and device for positioning the mask |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070009671A1 (https=) |
| EP (1) | EP1715076B1 (https=) |
| JP (1) | JP5063925B2 (https=) |
| KR (1) | KR100800237B1 (https=) |
| CN (1) | CN1854909A (https=) |
| AT (1) | ATE437248T1 (https=) |
| DE (1) | DE502005007746D1 (https=) |
| TW (1) | TWI311158B (https=) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PL1715075T3 (pl) * | 2005-04-20 | 2008-10-31 | Applied Mat Gmbh & Co Kg | Magnetyczny uchwyt maski |
| JP2007062354A (ja) * | 2005-08-30 | 2007-03-15 | Samsung Sdi Co Ltd | レーザ熱転写ドナーフィルム、レーザ熱転写装置、レーザ熱転写法及び有機発光素子の製造方法 |
| US7817175B2 (en) | 2005-08-30 | 2010-10-19 | Samsung Mobile Display Co., Ltd. | Laser induced thermal imaging apparatus and fabricating method of organic light emitting diode using the same |
| KR100711878B1 (ko) * | 2005-08-30 | 2007-04-25 | 삼성에스디아이 주식회사 | 레이저 열 전사 장치 및 레이저 열 전사 방법 |
| JP2007128845A (ja) * | 2005-11-04 | 2007-05-24 | Samsung Sdi Co Ltd | レーザ熱転写装置及びレーザ熱転写方法 |
| JP2007128844A (ja) * | 2005-11-04 | 2007-05-24 | Samsung Sdi Co Ltd | レーザ熱転写装置及びレーザ熱転写方法そしてこれを利用した有機発光表示素子 |
| KR20100132517A (ko) * | 2008-03-05 | 2010-12-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 회전 모듈을 갖는 코팅 장치 |
| DE102008037387A1 (de) * | 2008-09-24 | 2010-03-25 | Aixtron Ag | Verfahren sowie Vorrichtung zum Abscheiden lateral strukturierter Schichten mittels einer magnetisch auf einem Substrathalter gehaltenen Schattenmaske |
| KR101569796B1 (ko) * | 2009-06-23 | 2015-11-20 | 주성엔지니어링(주) | 기판 정렬 장치, 이를 포함하는 기판 처리 장치 및 기판 정렬 방법 |
| US20110107964A1 (en) * | 2009-11-10 | 2011-05-12 | Molten Corporation | Object Holding Apparatus |
| CN102110787B (zh) * | 2010-11-05 | 2012-07-25 | 四川虹视显示技术有限公司 | Oled掩膜板对位方法 |
| CN103205703B (zh) * | 2012-01-16 | 2016-04-27 | 昆山允升吉光电科技有限公司 | 提高掩模板开口位置精度的方法及其装置 |
| US10679883B2 (en) * | 2012-04-19 | 2020-06-09 | Intevac, Inc. | Wafer plate and mask arrangement for substrate fabrication |
| CN104685095B (zh) * | 2012-04-19 | 2017-12-29 | 因特瓦克公司 | 用于制造太阳能电池的双掩模装置 |
| US10062600B2 (en) | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
| KR102072872B1 (ko) | 2012-04-26 | 2020-02-03 | 인테벡, 인코포레이티드 | 진공 처리용 시스템 아키텍처 |
| CN103676488B (zh) * | 2012-09-10 | 2016-02-03 | 上海微电子装备有限公司 | 掩模交接机构及具有该掩模交接机构的掩模台 |
| US20140166203A1 (en) * | 2012-12-14 | 2014-06-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Blocking device, sealant curing device, and sealant curing method |
| KR102081254B1 (ko) * | 2013-07-09 | 2020-04-16 | 삼성디스플레이 주식회사 | 금속 마스크 고정 장치 |
| JP6607923B2 (ja) | 2014-08-05 | 2019-11-20 | インテヴァック インコーポレイテッド | 注入マスク及びアライメント |
| WO2016109975A1 (en) * | 2015-01-09 | 2016-07-14 | Applied Materials,Inc. | Method for coating thin metal substrates using pulsed or combustion coating processes |
| KR102123335B1 (ko) * | 2015-01-12 | 2020-06-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 프로세싱 챔버에서 층 증착 동안에 기판 캐리어 및 마스크 캐리어를 지지하기 위한 홀딩 어레인지먼트, 기판 상에 층을 증착하기 위한 장치, 및 기판을 지지하는 기판 캐리어와 마스크 캐리어를 정렬시키기 위한 방법 |
| JP6650440B2 (ja) * | 2015-04-20 | 2020-02-19 | シャープ株式会社 | 成膜方法 |
| CN105428552B (zh) * | 2015-12-31 | 2017-06-09 | 昆山国显光电有限公司 | Oled器件发光层形成方法 |
| CN109563608A (zh) * | 2017-02-24 | 2019-04-02 | 应用材料公司 | 用于基板载体和掩模载体的定位配置、用于基板载体和掩模载体的传送系统及其方法 |
| DE102017105374A1 (de) * | 2017-03-14 | 2018-09-20 | Aixtron Se | Vorrichtung zum Abscheiden einer strukturierten Schicht auf einem Substrat sowie Verfahren zum Einrichten der Vorrichtung |
| DE102017105379A1 (de) * | 2017-03-14 | 2018-09-20 | Aixtron Se | Substrathalteranordnung mit Maskenträger |
| CN108198958B (zh) * | 2018-01-30 | 2020-06-30 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、制作设备、显示装置 |
| KR102591646B1 (ko) * | 2018-06-29 | 2023-10-20 | 삼성디스플레이 주식회사 | 증착 장치 및 증착 장치의 마그넷 플레이트 얼라인 방법 |
| WO2020242611A1 (en) | 2019-05-24 | 2020-12-03 | Applied Materials, Inc. | System and method for aligning a mask with a substrate |
| US11189516B2 (en) | 2019-05-24 | 2021-11-30 | Applied Materials, Inc. | Method for mask and substrate alignment |
| US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
| US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
| US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
| US10950441B1 (en) * | 2019-09-03 | 2021-03-16 | Kyoka Utsumi Mimura | Low energy e-beam contact printing lithography |
| JP7266555B2 (ja) * | 2020-06-16 | 2023-04-28 | キヤノン株式会社 | アライメント方法および蒸着方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5474611A (en) * | 1992-05-20 | 1995-12-12 | Yoichi Murayama, Shincron Co., Ltd. | Plasma vapor deposition apparatus |
| JP3885261B2 (ja) * | 1996-11-21 | 2007-02-21 | 東レ株式会社 | 基板支持具および基板の支持方法 |
| JP4058149B2 (ja) * | 1997-12-01 | 2008-03-05 | キヤノンアネルバ株式会社 | 真空成膜装置のマスク位置合わせ方法 |
| US6719516B2 (en) * | 1998-09-28 | 2004-04-13 | Applied Materials, Inc. | Single wafer load lock with internal wafer transport |
| JP2001049422A (ja) * | 1999-08-09 | 2001-02-20 | Hitachi Ltd | メタルマスクの基板への保持固定構造、保持固定治具、その補助具、及びトレイ |
| DE10132348A1 (de) * | 2001-07-04 | 2003-02-06 | Aixtron Ag | Masken- und Substrathalteranordnung |
| KR100422487B1 (ko) * | 2001-12-10 | 2004-03-11 | 에이엔 에스 주식회사 | 전자석을 이용한 유기전계발광소자 제작용 증착장치 및그를 이용한 증착방법 |
| US8808457B2 (en) * | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
| CN100464440C (zh) * | 2002-06-03 | 2009-02-25 | 三星移动显示器株式会社 | 用于有机电致发光装置的薄层真空蒸发的掩模框组件 |
| JP3592690B2 (ja) * | 2002-07-10 | 2004-11-24 | エイエヌエス インコーポレイテッド | 有機電界発光表示装置用製造設備のシャドーマスク着脱装置 |
| US20040026634A1 (en) * | 2002-08-08 | 2004-02-12 | Takao Utsumi | Electron beam proximity exposure apparatus |
| JP4257497B2 (ja) * | 2003-02-26 | 2009-04-22 | 株式会社日立ハイテクノロジーズ | 真空蒸着方法及び真空蒸着装置、並びにこの真空蒸着方法により製造したｅｌパネル |
| PL1715075T3 (pl) * | 2005-04-20 | 2008-10-31 | Applied Mat Gmbh & Co Kg | Magnetyczny uchwyt maski |
-
2005
- 2005-04-20 AT AT05008663T patent/ATE437248T1/de not_active IP Right Cessation
- 2005-04-20 EP EP05008663A patent/EP1715076B1/de not_active Expired - Lifetime
- 2005-04-20 DE DE502005007746T patent/DE502005007746D1/de not_active Expired - Lifetime
-
2006
- 2006-03-31 TW TW095111672A patent/TWI311158B/zh not_active IP Right Cessation
- 2006-04-19 KR KR1020060035449A patent/KR100800237B1/ko not_active Expired - Fee Related
- 2006-04-19 CN CNA2006100666802A patent/CN1854909A/zh active Pending
- 2006-04-19 US US11/407,343 patent/US20070009671A1/en not_active Abandoned
- 2006-04-20 JP JP2006116320A patent/JP5063925B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1715076A1 (de) | 2006-10-25 |
| JP2006302896A (ja) | 2006-11-02 |
| JP5063925B2 (ja) | 2012-10-31 |
| EP1715076B1 (de) | 2009-07-22 |
| ATE437248T1 (de) | 2009-08-15 |
| CN1854909A (zh) | 2006-11-01 |
| TW200706663A (en) | 2007-02-16 |
| KR100800237B1 (ko) | 2008-02-01 |
| US20070009671A1 (en) | 2007-01-11 |
| DE502005007746D1 (de) | 2009-09-03 |
| KR20060110804A (ko) | 2006-10-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |