CN1854909A - 用于定位掩模的方法和装置 - Google Patents

用于定位掩模的方法和装置 Download PDF

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Publication number
CN1854909A
CN1854909A CNA2006100666802A CN200610066680A CN1854909A CN 1854909 A CN1854909 A CN 1854909A CN A2006100666802 A CNA2006100666802 A CN A2006100666802A CN 200610066680 A CN200610066680 A CN 200610066680A CN 1854909 A CN1854909 A CN 1854909A
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CN
China
Prior art keywords
substrate
mask
toter
mobile device
assembly
Prior art date
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Pending
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CNA2006100666802A
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English (en)
Chinese (zh)
Inventor
迪特尔·曼茨
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Applied Materials GmbH and Co KG
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Applied Films GmbH and Co KG
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Filing date
Publication date
Application filed by Applied Films GmbH and Co KG filed Critical Applied Films GmbH and Co KG
Publication of CN1854909A publication Critical patent/CN1854909A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
CNA2006100666802A 2005-04-20 2006-04-19 用于定位掩模的方法和装置 Pending CN1854909A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05008663.6 2005-04-20
EP05008663A EP1715076B1 (de) 2005-04-20 2005-04-20 Verfahren und Vorrichtung zur Maskenpositionierung

Publications (1)

Publication Number Publication Date
CN1854909A true CN1854909A (zh) 2006-11-01

Family

ID=34935470

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006100666802A Pending CN1854909A (zh) 2005-04-20 2006-04-19 用于定位掩模的方法和装置

Country Status (8)

Country Link
US (1) US20070009671A1 (https=)
EP (1) EP1715076B1 (https=)
JP (1) JP5063925B2 (https=)
KR (1) KR100800237B1 (https=)
CN (1) CN1854909A (https=)
AT (1) ATE437248T1 (https=)
DE (1) DE502005007746D1 (https=)
TW (1) TWI311158B (https=)

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CN101928936A (zh) * 2009-06-23 2010-12-29 周星工程股份有限公司 基板对准装置、具有其的基板处理装置以及基板对准方法
CN102110787A (zh) * 2010-11-05 2011-06-29 四川虹视显示技术有限公司 Oled掩膜板对位方法
CN103205703A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 提高掩模板开口位置精度的方法及其装置
CN103676488A (zh) * 2012-09-10 2014-03-26 上海微电子装备有限公司 掩模交接机构及具有该掩模交接机构的掩模台
TWI463029B (zh) * 2008-03-05 2014-12-01 應用材料股份有限公司 具有旋轉模組之塗覆設備
WO2016109975A1 (en) * 2015-01-09 2016-07-14 Applied Materials,Inc. Method for coating thin metal substrates using pulsed or combustion coating processes
CN107109621A (zh) * 2015-01-12 2017-08-29 应用材料公司 用于在处理腔室中的层沉积期间支撑基板载体和掩模载体的固持布置、用于在基板上沉积层的设备、以及用于对准支撑基板的基板载体与掩模载体的方法
CN107532289A (zh) * 2015-04-20 2018-01-02 夏普株式会社 成膜方法
CN109563608A (zh) * 2017-02-24 2019-04-02 应用材料公司 用于基板载体和掩模载体的定位配置、用于基板载体和掩模载体的传送系统及其方法
CN113802091A (zh) * 2020-06-16 2021-12-17 佳能株式会社 对准方法和蒸镀方法

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PL1715075T3 (pl) * 2005-04-20 2008-10-31 Applied Mat Gmbh & Co Kg Magnetyczny uchwyt maski
JP2007062354A (ja) * 2005-08-30 2007-03-15 Samsung Sdi Co Ltd レーザ熱転写ドナーフィルム、レーザ熱転写装置、レーザ熱転写法及び有機発光素子の製造方法
US7817175B2 (en) 2005-08-30 2010-10-19 Samsung Mobile Display Co., Ltd. Laser induced thermal imaging apparatus and fabricating method of organic light emitting diode using the same
KR100711878B1 (ko) * 2005-08-30 2007-04-25 삼성에스디아이 주식회사 레이저 열 전사 장치 및 레이저 열 전사 방법
JP2007128845A (ja) * 2005-11-04 2007-05-24 Samsung Sdi Co Ltd レーザ熱転写装置及びレーザ熱転写方法
JP2007128844A (ja) * 2005-11-04 2007-05-24 Samsung Sdi Co Ltd レーザ熱転写装置及びレーザ熱転写方法そしてこれを利用した有機発光表示素子
DE102008037387A1 (de) * 2008-09-24 2010-03-25 Aixtron Ag Verfahren sowie Vorrichtung zum Abscheiden lateral strukturierter Schichten mittels einer magnetisch auf einem Substrathalter gehaltenen Schattenmaske
US20110107964A1 (en) * 2009-11-10 2011-05-12 Molten Corporation Object Holding Apparatus
US10679883B2 (en) * 2012-04-19 2020-06-09 Intevac, Inc. Wafer plate and mask arrangement for substrate fabrication
CN104685095B (zh) * 2012-04-19 2017-12-29 因特瓦克公司 用于制造太阳能电池的双掩模装置
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
KR102072872B1 (ko) 2012-04-26 2020-02-03 인테벡, 인코포레이티드 진공 처리용 시스템 아키텍처
US20140166203A1 (en) * 2012-12-14 2014-06-19 Shenzhen China Star Optoelectronics Technology Co., Ltd Blocking device, sealant curing device, and sealant curing method
KR102081254B1 (ko) * 2013-07-09 2020-04-16 삼성디스플레이 주식회사 금속 마스크 고정 장치
JP6607923B2 (ja) 2014-08-05 2019-11-20 インテヴァック インコーポレイテッド 注入マスク及びアライメント
CN105428552B (zh) * 2015-12-31 2017-06-09 昆山国显光电有限公司 Oled器件发光层形成方法
DE102017105374A1 (de) * 2017-03-14 2018-09-20 Aixtron Se Vorrichtung zum Abscheiden einer strukturierten Schicht auf einem Substrat sowie Verfahren zum Einrichten der Vorrichtung
DE102017105379A1 (de) * 2017-03-14 2018-09-20 Aixtron Se Substrathalteranordnung mit Maskenträger
CN108198958B (zh) * 2018-01-30 2020-06-30 京东方科技集团股份有限公司 显示基板及其制作方法、制作设备、显示装置
KR102591646B1 (ko) * 2018-06-29 2023-10-20 삼성디스플레이 주식회사 증착 장치 및 증착 장치의 마그넷 플레이트 얼라인 방법
WO2020242611A1 (en) 2019-05-24 2020-12-03 Applied Materials, Inc. System and method for aligning a mask with a substrate
US11189516B2 (en) 2019-05-24 2021-11-30 Applied Materials, Inc. Method for mask and substrate alignment
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US11196360B2 (en) 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
US10950441B1 (en) * 2019-09-03 2021-03-16 Kyoka Utsumi Mimura Low energy e-beam contact printing lithography

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US5474611A (en) * 1992-05-20 1995-12-12 Yoichi Murayama, Shincron Co., Ltd. Plasma vapor deposition apparatus
JP3885261B2 (ja) * 1996-11-21 2007-02-21 東レ株式会社 基板支持具および基板の支持方法
JP4058149B2 (ja) * 1997-12-01 2008-03-05 キヤノンアネルバ株式会社 真空成膜装置のマスク位置合わせ方法
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
JP2001049422A (ja) * 1999-08-09 2001-02-20 Hitachi Ltd メタルマスクの基板への保持固定構造、保持固定治具、その補助具、及びトレイ
DE10132348A1 (de) * 2001-07-04 2003-02-06 Aixtron Ag Masken- und Substrathalteranordnung
KR100422487B1 (ko) * 2001-12-10 2004-03-11 에이엔 에스 주식회사 전자석을 이용한 유기전계발광소자 제작용 증착장치 및그를 이용한 증착방법
US8808457B2 (en) * 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
CN100464440C (zh) * 2002-06-03 2009-02-25 三星移动显示器株式会社 用于有机电致发光装置的薄层真空蒸发的掩模框组件
JP3592690B2 (ja) * 2002-07-10 2004-11-24 エイエヌエス インコーポレイテッド 有機電界発光表示装置用製造設備のシャドーマスク着脱装置
US20040026634A1 (en) * 2002-08-08 2004-02-12 Takao Utsumi Electron beam proximity exposure apparatus
JP4257497B2 (ja) * 2003-02-26 2009-04-22 株式会社日立ハイテクノロジーズ 真空蒸着方法及び真空蒸着装置、並びにこの真空蒸着方法により製造したｅｌパネル
PL1715075T3 (pl) * 2005-04-20 2008-10-31 Applied Mat Gmbh & Co Kg Magnetyczny uchwyt maski

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463029B (zh) * 2008-03-05 2014-12-01 應用材料股份有限公司 具有旋轉模組之塗覆設備
CN101928936A (zh) * 2009-06-23 2010-12-29 周星工程股份有限公司 基板对准装置、具有其的基板处理装置以及基板对准方法
CN102110787A (zh) * 2010-11-05 2011-06-29 四川虹视显示技术有限公司 Oled掩膜板对位方法
CN102110787B (zh) * 2010-11-05 2012-07-25 四川虹视显示技术有限公司 Oled掩膜板对位方法
CN103205703A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 提高掩模板开口位置精度的方法及其装置
CN103205703B (zh) * 2012-01-16 2016-04-27 昆山允升吉光电科技有限公司 提高掩模板开口位置精度的方法及其装置
CN103676488B (zh) * 2012-09-10 2016-02-03 上海微电子装备有限公司 掩模交接机构及具有该掩模交接机构的掩模台
CN103676488A (zh) * 2012-09-10 2014-03-26 上海微电子装备有限公司 掩模交接机构及具有该掩模交接机构的掩模台
WO2016109975A1 (en) * 2015-01-09 2016-07-14 Applied Materials,Inc. Method for coating thin metal substrates using pulsed or combustion coating processes
CN107109621A (zh) * 2015-01-12 2017-08-29 应用材料公司 用于在处理腔室中的层沉积期间支撑基板载体和掩模载体的固持布置、用于在基板上沉积层的设备、以及用于对准支撑基板的基板载体与掩模载体的方法
CN107532289A (zh) * 2015-04-20 2018-01-02 夏普株式会社 成膜方法
CN107532289B (zh) * 2015-04-20 2020-06-23 夏普株式会社 成膜方法
CN109563608A (zh) * 2017-02-24 2019-04-02 应用材料公司 用于基板载体和掩模载体的定位配置、用于基板载体和掩模载体的传送系统及其方法
CN113802091A (zh) * 2020-06-16 2021-12-17 佳能株式会社 对准方法和蒸镀方法

Also Published As

Publication number Publication date
EP1715076A1 (de) 2006-10-25
JP2006302896A (ja) 2006-11-02
JP5063925B2 (ja) 2012-10-31
EP1715076B1 (de) 2009-07-22
ATE437248T1 (de) 2009-08-15
TW200706663A (en) 2007-02-16
TWI311158B (en) 2009-06-21
KR100800237B1 (ko) 2008-02-01
US20070009671A1 (en) 2007-01-11
DE502005007746D1 (de) 2009-09-03
KR20060110804A (ko) 2006-10-25

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