KR100800237B1 - 마스크 포지셔닝 장치 및 방법 - Google Patents

마스크 포지셔닝 장치 및 방법 Download PDF

Info

Publication number
KR100800237B1
KR100800237B1 KR1020060035449A KR20060035449A KR100800237B1 KR 100800237 B1 KR100800237 B1 KR 100800237B1 KR 1020060035449 A KR1020060035449 A KR 1020060035449A KR 20060035449 A KR20060035449 A KR 20060035449A KR 100800237 B1 KR100800237 B1 KR 100800237B1
Authority
KR
South Korea
Prior art keywords
substrate
mask
holding
substrate carrier
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060035449A
Other languages
English (en)
Korean (ko)
Other versions
KR20060110804A (ko
Inventor
디테어 만쯔
Original Assignee
어플라이드 매터리얼스 게엠베하 운트 컴퍼니 카게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 매터리얼스 게엠베하 운트 컴퍼니 카게 filed Critical 어플라이드 매터리얼스 게엠베하 운트 컴퍼니 카게
Publication of KR20060110804A publication Critical patent/KR20060110804A/ko
Application granted granted Critical
Publication of KR100800237B1 publication Critical patent/KR100800237B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
KR1020060035449A 2005-04-20 2006-04-19 마스크 포지셔닝 장치 및 방법 Expired - Fee Related KR100800237B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05008663A EP1715076B1 (de) 2005-04-20 2005-04-20 Verfahren und Vorrichtung zur Maskenpositionierung
EPEP05008663 2005-04-20

Publications (2)

Publication Number Publication Date
KR20060110804A KR20060110804A (ko) 2006-10-25
KR100800237B1 true KR100800237B1 (ko) 2008-02-01

Family

ID=34935470

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060035449A Expired - Fee Related KR100800237B1 (ko) 2005-04-20 2006-04-19 마스크 포지셔닝 장치 및 방법

Country Status (8)

Country Link
US (1) US20070009671A1 (https=)
EP (1) EP1715076B1 (https=)
JP (1) JP5063925B2 (https=)
KR (1) KR100800237B1 (https=)
CN (1) CN1854909A (https=)
AT (1) ATE437248T1 (https=)
DE (1) DE502005007746D1 (https=)
TW (1) TWI311158B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180114888A (ko) * 2017-02-24 2018-10-19 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 및 마스크 캐리어를 위한 포지셔닝 어레인지먼트, 기판 캐리어 및 마스크 캐리어를 위한 이송 시스템, 및 이를 위한 방법들

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL1715075T3 (pl) * 2005-04-20 2008-10-31 Applied Mat Gmbh & Co Kg Magnetyczny uchwyt maski
JP2007062354A (ja) * 2005-08-30 2007-03-15 Samsung Sdi Co Ltd レーザ熱転写ドナーフィルム、レーザ熱転写装置、レーザ熱転写法及び有機発光素子の製造方法
US7817175B2 (en) 2005-08-30 2010-10-19 Samsung Mobile Display Co., Ltd. Laser induced thermal imaging apparatus and fabricating method of organic light emitting diode using the same
KR100711878B1 (ko) * 2005-08-30 2007-04-25 삼성에스디아이 주식회사 레이저 열 전사 장치 및 레이저 열 전사 방법
JP2007128845A (ja) * 2005-11-04 2007-05-24 Samsung Sdi Co Ltd レーザ熱転写装置及びレーザ熱転写方法
JP2007128844A (ja) * 2005-11-04 2007-05-24 Samsung Sdi Co Ltd レーザ熱転写装置及びレーザ熱転写方法そしてこれを利用した有機発光表示素子
KR20100132517A (ko) * 2008-03-05 2010-12-17 어플라이드 머티어리얼스, 인코포레이티드 회전 모듈을 갖는 코팅 장치
DE102008037387A1 (de) * 2008-09-24 2010-03-25 Aixtron Ag Verfahren sowie Vorrichtung zum Abscheiden lateral strukturierter Schichten mittels einer magnetisch auf einem Substrathalter gehaltenen Schattenmaske
KR101569796B1 (ko) * 2009-06-23 2015-11-20 주성엔지니어링(주) 기판 정렬 장치, 이를 포함하는 기판 처리 장치 및 기판 정렬 방법
US20110107964A1 (en) * 2009-11-10 2011-05-12 Molten Corporation Object Holding Apparatus
CN102110787B (zh) * 2010-11-05 2012-07-25 四川虹视显示技术有限公司 Oled掩膜板对位方法
CN103205703B (zh) * 2012-01-16 2016-04-27 昆山允升吉光电科技有限公司 提高掩模板开口位置精度的方法及其装置
US10679883B2 (en) * 2012-04-19 2020-06-09 Intevac, Inc. Wafer plate and mask arrangement for substrate fabrication
CN104685095B (zh) * 2012-04-19 2017-12-29 因特瓦克公司 用于制造太阳能电池的双掩模装置
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
KR102072872B1 (ko) 2012-04-26 2020-02-03 인테벡, 인코포레이티드 진공 처리용 시스템 아키텍처
CN103676488B (zh) * 2012-09-10 2016-02-03 上海微电子装备有限公司 掩模交接机构及具有该掩模交接机构的掩模台
US20140166203A1 (en) * 2012-12-14 2014-06-19 Shenzhen China Star Optoelectronics Technology Co., Ltd Blocking device, sealant curing device, and sealant curing method
KR102081254B1 (ko) * 2013-07-09 2020-04-16 삼성디스플레이 주식회사 금속 마스크 고정 장치
JP6607923B2 (ja) 2014-08-05 2019-11-20 インテヴァック インコーポレイテッド 注入マスク及びアライメント
WO2016109975A1 (en) * 2015-01-09 2016-07-14 Applied Materials,Inc. Method for coating thin metal substrates using pulsed or combustion coating processes
KR102123335B1 (ko) * 2015-01-12 2020-06-17 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 챔버에서 층 증착 동안에 기판 캐리어 및 마스크 캐리어를 지지하기 위한 홀딩 어레인지먼트, 기판 상에 층을 증착하기 위한 장치, 및 기판을 지지하는 기판 캐리어와 마스크 캐리어를 정렬시키기 위한 방법
JP6650440B2 (ja) * 2015-04-20 2020-02-19 シャープ株式会社 成膜方法
CN105428552B (zh) * 2015-12-31 2017-06-09 昆山国显光电有限公司 Oled器件发光层形成方法
DE102017105374A1 (de) * 2017-03-14 2018-09-20 Aixtron Se Vorrichtung zum Abscheiden einer strukturierten Schicht auf einem Substrat sowie Verfahren zum Einrichten der Vorrichtung
DE102017105379A1 (de) * 2017-03-14 2018-09-20 Aixtron Se Substrathalteranordnung mit Maskenträger
CN108198958B (zh) * 2018-01-30 2020-06-30 京东方科技集团股份有限公司 显示基板及其制作方法、制作设备、显示装置
KR102591646B1 (ko) * 2018-06-29 2023-10-20 삼성디스플레이 주식회사 증착 장치 및 증착 장치의 마그넷 플레이트 얼라인 방법
WO2020242611A1 (en) 2019-05-24 2020-12-03 Applied Materials, Inc. System and method for aligning a mask with a substrate
US11189516B2 (en) 2019-05-24 2021-11-30 Applied Materials, Inc. Method for mask and substrate alignment
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US11196360B2 (en) 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
US10950441B1 (en) * 2019-09-03 2021-03-16 Kyoka Utsumi Mimura Low energy e-beam contact printing lithography
JP7266555B2 (ja) * 2020-06-16 2023-04-28 キヤノン株式会社 アライメント方法および蒸着方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10152776A (ja) * 1996-11-21 1998-06-09 Toray Ind Inc 基板支持具および基板の支持方法
JPH11158605A (ja) * 1997-12-01 1999-06-15 Anelva Corp 真空成膜装置、そのマスク着脱装置、及びマスク位置合わせ方法
JP2003187973A (ja) * 2001-12-10 2003-07-04 Ans Inc 電磁石を用いた有機電界発光素子製作用蒸着装置及びこれを用いた蒸着方法
JP2004047238A (ja) * 2002-07-10 2004-02-12 Ans Inc 有機電界発光表示装置用製造設備のシャドーマスク着脱装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5474611A (en) * 1992-05-20 1995-12-12 Yoichi Murayama, Shincron Co., Ltd. Plasma vapor deposition apparatus
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
JP2001049422A (ja) * 1999-08-09 2001-02-20 Hitachi Ltd メタルマスクの基板への保持固定構造、保持固定治具、その補助具、及びトレイ
DE10132348A1 (de) * 2001-07-04 2003-02-06 Aixtron Ag Masken- und Substrathalteranordnung
US8808457B2 (en) * 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
CN100464440C (zh) * 2002-06-03 2009-02-25 三星移动显示器株式会社 用于有机电致发光装置的薄层真空蒸发的掩模框组件
US20040026634A1 (en) * 2002-08-08 2004-02-12 Takao Utsumi Electron beam proximity exposure apparatus
JP4257497B2 (ja) * 2003-02-26 2009-04-22 株式会社日立ハイテクノロジーズ 真空蒸着方法及び真空蒸着装置、並びにこの真空蒸着方法により製造したｅｌパネル
PL1715075T3 (pl) * 2005-04-20 2008-10-31 Applied Mat Gmbh & Co Kg Magnetyczny uchwyt maski

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10152776A (ja) * 1996-11-21 1998-06-09 Toray Ind Inc 基板支持具および基板の支持方法
JPH11158605A (ja) * 1997-12-01 1999-06-15 Anelva Corp 真空成膜装置、そのマスク着脱装置、及びマスク位置合わせ方法
JP2003187973A (ja) * 2001-12-10 2003-07-04 Ans Inc 電磁石を用いた有機電界発光素子製作用蒸着装置及びこれを用いた蒸着方法
JP2004047238A (ja) * 2002-07-10 2004-02-12 Ans Inc 有機電界発光表示装置用製造設備のシャドーマスク着脱装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180114888A (ko) * 2017-02-24 2018-10-19 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 및 마스크 캐리어를 위한 포지셔닝 어레인지먼트, 기판 캐리어 및 마스크 캐리어를 위한 이송 시스템, 및 이를 위한 방법들
KR102069018B1 (ko) * 2017-02-24 2020-01-22 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 및 마스크 캐리어를 위한 포지셔닝 어레인지먼트, 기판 캐리어 및 마스크 캐리어를 위한 이송 시스템, 및 이를 위한 방법들

Also Published As

Publication number Publication date
EP1715076A1 (de) 2006-10-25
JP2006302896A (ja) 2006-11-02
JP5063925B2 (ja) 2012-10-31
EP1715076B1 (de) 2009-07-22
ATE437248T1 (de) 2009-08-15
CN1854909A (zh) 2006-11-01
TW200706663A (en) 2007-02-16
TWI311158B (en) 2009-06-21
US20070009671A1 (en) 2007-01-11
DE502005007746D1 (de) 2009-09-03
KR20060110804A (ko) 2006-10-25

Similar Documents

Publication Publication Date Title
KR100800237B1 (ko) 마스크 포지셔닝 장치 및 방법
KR100777534B1 (ko) 자석 마스크 홀더
JP4058149B2 (ja) 真空成膜装置のマスク位置合わせ方法
KR101993532B1 (ko) 성막장치, 성막방법, 및 전자 디바이스 제조방법
KR102241187B1 (ko) 기판 지지 장치, 기판 재치 장치, 성막 장치, 기판 지지 방법, 성막 방법 및 전자 디바이스의 제조 방법
JP7244401B2 (ja) アライメント装置、成膜装置、アライメント方法、成膜方法、及び電子デバイスの製造方法
JP4375232B2 (ja) マスク成膜方法
KR101145201B1 (ko) Ｏｌｅｄ 제조용 박막 증착 장치
CN109722626A (zh) 对准装置和方法、成膜装置和方法及电子器件的制造方法
JP2006302896A5 (https=)
CN107541711A (zh) 基板的夹持装置、成膜装置、基板载置装置及其方法
JP2018504526A (ja) 処理チャンバ内での層堆積中に基板キャリアとマスクキャリアを支持するための保持装置、基板を支持する基板キャリアとマスクキャリアを位置合わせするための方法
KR102505832B1 (ko) 흡착장치, 위치 조정 방법, 및 성막 방법
KR20210126147A (ko) 마스크 프레임 통합, 마스크 프레임을 위한 캐리어, 및 마스크를 핸들링하는 방법
KR102871998B1 (ko) 성막 장치 및 성막 방법
CN102400103A (zh) 蒸镀设备以及蒸镀方法
KR102459872B1 (ko) 정전척 시스템, 성막 장치, 흡착 방법, 성막 방법 및 전자 디바이스의 제조방법
KR101944197B1 (ko) 성막장치, 성막방법 및 이를 사용한 유기 el 표시 장치의 제조방법
KR102748864B1 (ko) 성막 장치
KR102501609B1 (ko) 성막 장치, 이를 사용한 성막 방법, 및 전자 디바이스의 제조방법
CN110557955A (zh) 用于支撑基板或掩模的载体
KR102809545B1 (ko) 성막 장치 및 성막 방법
KR102501617B1 (ko) 성막 장치, 성막 방법, 및 전자 디바이스의 제조방법
TWI475736B (zh) 電激發光顯示裝置的製作方法以及鍍膜機台
JP2023183223A (ja) 搬送装置、搬送方法、電子デバイスの製造方法及び成膜装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20130118

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140116

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20150115

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20160114

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20170112

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20180111

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20190126

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20190126