TWI309447B - - Google Patents

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Publication number
TWI309447B
TWI309447B TW95130304A TW95130304A TWI309447B TW I309447 B TWI309447 B TW I309447B TW 95130304 A TW95130304 A TW 95130304A TW 95130304 A TW95130304 A TW 95130304A TW I309447 B TWI309447 B TW I309447B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
region
tray
wafer
base portion
Prior art date
Application number
TW95130304A
Other languages
English (en)
Chinese (zh)
Other versions
TW200719424A (en
Inventor
Akiko Kamigori
Masami Yakabe
Takanori Hyakudomi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200719424A publication Critical patent/TW200719424A/zh
Application granted granted Critical
Publication of TWI309447B publication Critical patent/TWI309447B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095130304A 2005-08-22 2006-08-17 Semiconductor wafer transfer tray TW200719424A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005239965 2005-08-22
JP2006116880A JP4020938B2 (ja) 2005-08-22 2006-04-20 半導体ウェハ用搬送トレイおよび半導体ウェハ搬送システム

Publications (2)

Publication Number Publication Date
TW200719424A TW200719424A (en) 2007-05-16
TWI309447B true TWI309447B (ja) 2009-05-01

Family

ID=37771494

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130304A TW200719424A (en) 2005-08-22 2006-08-17 Semiconductor wafer transfer tray

Country Status (3)

Country Link
JP (1) JP4020938B2 (ja)
TW (1) TW200719424A (ja)
WO (1) WO2007023746A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102412176B (zh) * 2010-09-26 2014-08-27 北京北方微电子基地设备工艺研究中心有限责任公司 托盘及具有其的晶片处理设备
CN103011066B (zh) * 2011-09-21 2014-03-19 叶哲良 芯片
JP5943742B2 (ja) * 2012-07-04 2016-07-05 三菱電機株式会社 半導体試験治具およびそれを用いた半導体試験方法
JP6424719B2 (ja) * 2015-04-06 2018-11-21 三菱電機株式会社 半導体試験治具、半導体装置の試験方法
JP6494451B2 (ja) * 2015-07-06 2019-04-03 株式会社ディスコ チャックテーブル及び洗浄装置
KR101732307B1 (ko) * 2016-04-01 2017-05-02 한양대학교 산학협력단 기판 처리 장치
JP6626413B2 (ja) * 2016-06-29 2019-12-25 東京応化工業株式会社 支持体分離方法、および基板処理方法
US11201078B2 (en) * 2017-02-14 2021-12-14 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
KR102203726B1 (ko) * 2018-12-12 2021-01-15 주식회사 선익시스템 테스트 기판 수납용 트레이 및 이를 포함하는 기판 처리 장치
CN111613562B (zh) * 2019-02-25 2023-04-18 启端光电股份有限公司 真空转移装置及其形成方法
JP7419030B2 (ja) * 2019-11-18 2024-01-22 キヤノン株式会社 保持装置、露光装置、及び物品の製造方法
CN111554603B (zh) * 2020-06-02 2023-04-28 江西维易尔半导体设备有限公司 一种带孔方形硅片加工传送系统
FR3125355A1 (fr) * 2021-07-19 2023-01-20 Soitec Agencement de dispositif de maintien pour une utilisation dans un processus d'implantation d'un substrat piézoélectrique

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102849A (ja) * 1989-09-14 1991-04-30 Fujitsu Ltd ウェハアダプタ及び露光装置
JPH06120131A (ja) * 1992-10-08 1994-04-28 Sumitomo Electric Ind Ltd ウエハアダプター
JP4088401B2 (ja) * 2000-05-29 2008-05-21 松下電器産業株式会社 ウェハカセット装置
JP2002173250A (ja) * 2000-12-07 2002-06-21 Nitto Denko Corp 吸着搬送方法および吸着加工方法
JP2003124294A (ja) * 2001-10-11 2003-04-25 Hitachi Ltd 半導体ウエハおよび半導体装置の製造方法
JP2004342834A (ja) * 2003-05-15 2004-12-02 Seiko Epson Corp 基板載置トレイ

Also Published As

Publication number Publication date
JP4020938B2 (ja) 2007-12-12
JP2007088416A (ja) 2007-04-05
WO2007023746A1 (ja) 2007-03-01
TW200719424A (en) 2007-05-16

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MM4A Annulment or lapse of patent due to non-payment of fees