TW200719424A - Semiconductor wafer transfer tray - Google Patents

Semiconductor wafer transfer tray

Info

Publication number
TW200719424A
TW200719424A TW095130304A TW95130304A TW200719424A TW 200719424 A TW200719424 A TW 200719424A TW 095130304 A TW095130304 A TW 095130304A TW 95130304 A TW95130304 A TW 95130304A TW 200719424 A TW200719424 A TW 200719424A
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
transfer
wafer transfer
transfer tray
tray
Prior art date
Application number
TW095130304A
Other languages
Chinese (zh)
Other versions
TWI309447B (en
Inventor
Akiko Kamigori
Masami Yakabe
Takanori Hyakudomi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200719424A publication Critical patent/TW200719424A/en
Application granted granted Critical
Publication of TWI309447B publication Critical patent/TWI309447B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

Provided is a semiconductor wafer transfer tray which can stably transfer a semiconductor wafer whereupon a MEMS device is formed. On a front plane of the semiconductor wafer transfer tray, a shift preventing mechanism for preventing the semiconductor wafer from shifting is provided. The tray is also provided with a base bottom section having a rear plane to be sucked by vacuum for transfer. The base bottom section is provided with a penetrating section (4) arranged in a peripheral region. At the time of transfer, the semiconductor wafer is sucked by vacuum together with the base bottom section through the penetrating section (4).
TW095130304A 2005-08-22 2006-08-17 Semiconductor wafer transfer tray TW200719424A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005239965 2005-08-22
JP2006116880A JP4020938B2 (en) 2005-08-22 2006-04-20 Semiconductor wafer transfer tray and semiconductor wafer transfer system

Publications (2)

Publication Number Publication Date
TW200719424A true TW200719424A (en) 2007-05-16
TWI309447B TWI309447B (en) 2009-05-01

Family

ID=37771494

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130304A TW200719424A (en) 2005-08-22 2006-08-17 Semiconductor wafer transfer tray

Country Status (3)

Country Link
JP (1) JP4020938B2 (en)
TW (1) TW200719424A (en)
WO (1) WO2007023746A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111613562A (en) * 2019-02-25 2020-09-01 启端光电股份有限公司 Vacuum transfer device and method of forming the same

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102412176B (en) * 2010-09-26 2014-08-27 北京北方微电子基地设备工艺研究中心有限责任公司 Pallet and wafer processing equipment possessing the same
CN103011066B (en) * 2011-09-21 2014-03-19 叶哲良 Chip
JP5943742B2 (en) * 2012-07-04 2016-07-05 三菱電機株式会社 Semiconductor test jig and semiconductor test method using the same
JP6424719B2 (en) * 2015-04-06 2018-11-21 三菱電機株式会社 Semiconductor test jig, test method of semiconductor device
JP6494451B2 (en) * 2015-07-06 2019-04-03 株式会社ディスコ Chuck table and cleaning device
KR101732307B1 (en) * 2016-04-01 2017-05-02 한양대학교 산학협력단 Substrate treating apparatus
JP6626413B2 (en) * 2016-06-29 2019-12-25 東京応化工業株式会社 Support separating method and substrate processing method
US11201078B2 (en) * 2017-02-14 2021-12-14 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
KR102203726B1 (en) * 2018-12-12 2021-01-15 주식회사 선익시스템 Tray for receiving a test substrate and substrate processing apparatus including the same
JP7419030B2 (en) * 2019-11-18 2024-01-22 キヤノン株式会社 Holding device, exposure device, and article manufacturing method
CN111554603B (en) * 2020-06-02 2023-04-28 江西维易尔半导体设备有限公司 Square silicon chip processing conveying system with holes
FR3125355A1 (en) * 2021-07-19 2023-01-20 Soitec Holding device arrangement for use in a process for implanting a piezoelectric substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102849A (en) * 1989-09-14 1991-04-30 Fujitsu Ltd Wafer adapter and exposure device
JPH06120131A (en) * 1992-10-08 1994-04-28 Sumitomo Electric Ind Ltd Wafer adaptor
JP4088401B2 (en) * 2000-05-29 2008-05-21 松下電器産業株式会社 Wafer cassette device
JP2002173250A (en) * 2000-12-07 2002-06-21 Nitto Denko Corp Suction carrying method and suction machining method
JP2003124294A (en) * 2001-10-11 2003-04-25 Hitachi Ltd Semiconductor wafer and method for manufacturing semiconductor device
JP2004342834A (en) * 2003-05-15 2004-12-02 Seiko Epson Corp Substrate placing tray

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111613562A (en) * 2019-02-25 2020-09-01 启端光电股份有限公司 Vacuum transfer device and method of forming the same
CN111613562B (en) * 2019-02-25 2023-04-18 启端光电股份有限公司 Vacuum transfer device and method of forming the same

Also Published As

Publication number Publication date
WO2007023746A1 (en) 2007-03-01
JP4020938B2 (en) 2007-12-12
TWI309447B (en) 2009-05-01
JP2007088416A (en) 2007-04-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees