JP2002173250A - Suction carrying method and suction machining method - Google Patents

Suction carrying method and suction machining method

Info

Publication number
JP2002173250A
JP2002173250A JP2000372429A JP2000372429A JP2002173250A JP 2002173250 A JP2002173250 A JP 2002173250A JP 2000372429 A JP2000372429 A JP 2000372429A JP 2000372429 A JP2000372429 A JP 2000372429A JP 2002173250 A JP2002173250 A JP 2002173250A
Authority
JP
Japan
Prior art keywords
suction
plate
porous sheet
workpiece
image recognition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000372429A
Other languages
Japanese (ja)
Inventor
Takashi Wano
隆司 和野
Junichi Moriyama
順一 森山
Keigo Funakoshi
啓吾 船越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2000372429A priority Critical patent/JP2002173250A/en
Publication of JP2002173250A publication Critical patent/JP2002173250A/en
Pending legal-status Critical Current

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Landscapes

  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Manipulator (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a suction carrying method and a suction machining method hardly causing unstable image recognition with the influence of a suction face and permitting highly precise control. SOLUTION: The suction carrying method utilizing the result of image recognition of a carried material 4 for carrying control when carrying the carried material 4 being sucked and fixed to the suction face of a suction plate 3 with the movement of the suction plate 3 comprises forming the suction face of the suction plate 3 with a porous sheet 5 having a thickness of 0.1-3 mm consisting of a sintered porous body of super high molecular weight polyethylene.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、吸着搬送や吸着加
工に使用する吸着プレートの吸着面を超高分子量ポリエ
チレン(UHMWPE)の燒結多孔質体からなる多孔質
シートで形成してある吸着搬送方法および吸着加工方法
に関し、特に、電子機器に使用されるフレキシブル回路
基板(FPC)、薄層シート、その他回路基板の搬送、
加工時の固定用途に有用な技術である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adsorbing and conveying an adsorbing plate used for adsorbing and conveying, wherein the adsorbing surface of the adsorbing plate is formed of a porous sheet made of a sintered porous material of ultra high molecular weight polyethylene (UHMWPE). And the suction processing method, in particular, flexible circuit boards (FPC) used for electronic equipment, thin-layer sheets, transport of other circuit boards,
This is a useful technique for fixing applications during processing.

【0002】[0002]

【従来の技術】液晶用ガラス板や半導体ウェハの精密切
断、液晶用ガラス板や半導体ウェハへの精密塗工、偏光
板と位相差板あるいはこれらとガラス板との精密貼り合
わせ等の加工に際しては、これらの被加工物が位置ズレ
しないように固定して作業している。
2. Description of the Related Art In the processing of precision cutting of a glass plate for liquid crystal or a semiconductor wafer, precise coating on a glass plate for liquid crystal or a semiconductor wafer, precision bonding of a polarizing plate and a retardation plate, or precision bonding of these and a glass plate. These workpieces are fixed so as not to be displaced.

【0003】このような上記被加工物の固定には真空吸
着法が採用されることが多い。この方法は、例えば、図
1に示すように、上面に所定個数の吸引孔1を設けると
共に所定位置に吸引接続部2を設けた吸着プレート(金
属等の機械的強度を有する材料から成る)3を用い、吸
着プレート3の吸引孔1の形成面上の多孔質シート5の
上に被加工物4を載置し、吸引接続部2に接続されたホ
ースを介して真空ポンプ(図示省略)により減圧し吸着
プレート3の内部を減圧状態とすることにより、被加工
物4を吸着プレート3上に吸引固定しその位置ズレを防
止して、これを加工するものである。
[0003] A vacuum suction method is often employed for fixing such a workpiece. In this method, for example, as shown in FIG. 1, a suction plate (made of a material having mechanical strength such as metal) 3 provided with a predetermined number of suction holes 1 on an upper surface and provided with suction connection portions 2 at predetermined positions. The workpiece 4 is placed on the porous sheet 5 on the surface of the suction plate 3 on which the suction holes 1 are formed, and a vacuum pump (not shown) is connected through a hose connected to the suction connection 2. By reducing the pressure to make the inside of the suction plate 3 in a reduced pressure state, the workpiece 4 is suction-fixed on the suction plate 3 to prevent the displacement thereof and to process the work.

【0004】上記真空吸着法は被加工物の固定が容易で
あり、また、加工時の位置ズレを防止できる利点を有す
る。そして、真空吸着装置の多孔質シート5としては、
セラミック多孔板、金属燒結板などの多孔体が使用され
てきた。
[0004] The vacuum suction method has an advantage that a workpiece can be easily fixed and a positional deviation during processing can be prevented. And as the porous sheet 5 of the vacuum suction device,
Porous materials such as ceramic perforated plates and sintered metal plates have been used.

【0005】しかし、近年、被加工物の形状が複雑にな
り、かつ加工形状も複雑になっており、孔径が大きいセ
ラミック多孔体や金属燒結板などでは、十分な吸引力が
得られにくく、また、吸引時に対象物が孔に沿ってへこ
むなどダメージを与えてしまう場合がある。また、2 つ
以上の部材を接着等により接合する場合など、多孔金属
板、もしくはセラミック多孔体では、圧縮時の密着性に
欠ける。このため、多孔質シート5として、より孔径の
小さい多孔質樹脂シートが提案されている(特開平8−
169971号公報等)。
[0005] However, in recent years, the shape of the workpiece has become complicated and the processing shape has become complicated, and it is difficult to obtain a sufficient suction force with a ceramic porous body or a metal sintered plate having a large hole diameter. In some cases, the object may be damaged during suction, such as dents along the hole. Further, in the case where two or more members are joined by bonding or the like, a porous metal plate or a ceramic porous body lacks adhesion during compression. For this reason, a porous resin sheet having a smaller pore diameter has been proposed as the porous sheet 5 (Japanese Unexamined Patent Application Publication No. Hei 8-
No. 169971).

【0006】一方、近年、加工対象の形状が複雑にな
り、かつ加工形状も複雑になってきたため、コンピュー
タ制御による加工や、その際に画像認識装置による画像
認識結果を利用して制御する方法が増加しつつある。ま
た、被搬送物を吸引固定して搬送する際に、画像認識結
果を利用して搬送制御を行う吸着搬送方法や、吸引固定
した被加工物に加工を行う加工手段を加工位置まで移動
させる際に、被加工物に対する画像認識結果を利用して
位置制御を行う吸着加工方法なども採用されつつある。
On the other hand, in recent years, the shape of a processing object has become complicated and the processing shape has also become complicated. Therefore, a method of processing by computer control and a method of controlling using an image recognition result by an image recognition apparatus at that time have been developed. Increasing. In addition, when an object to be conveyed is suction-fixed and conveyed, a suction conveyance method for performing conveyance control using an image recognition result or a processing unit for processing the suction-fixed object to a processing position. In addition, a suction processing method for performing position control using an image recognition result for a workpiece is being adopted.

【0007】[0007]

【発明が解決しようとする課題】このように画像認識結
果を利用する加工制御では、対象物の形状、部位や、各
部の位置を精度良く認識させる必要があるが、そのため
には、対象物以外の部分である吸着面などは認識に影響
を与えないことが望ましい。しかし、従来の多孔質樹脂
シートを用いた場合、その下方に存在する吸引孔が多孔
質樹脂シートを通して透けて見える場合があり、対象物
の位置決め用マーク等と誤認識する場合があった。ま
た、一般的な多孔質樹脂シートでは、その強度や通気度
との関係から、吸着孔上で凹状に変形し易く、その上記
マークがその上にあると変形により画像認識が不安定に
なることがある。これは、特に腰のない、弾性率の低い
シート、部材を吸引固定する場合に問題になる。
In the processing control using the image recognition result as described above, it is necessary to accurately recognize the shape, the part, and the position of each part of the object. It is desirable that the adsorption surface or the like, which is a part, does not affect recognition. However, when a conventional porous resin sheet is used, a suction hole below the porous resin sheet may be seen through the porous resin sheet, and may be erroneously recognized as a mark for positioning an object. In addition, a general porous resin sheet is easily deformed in a concave shape on the suction hole due to its strength and air permeability, and image recognition becomes unstable due to the deformation when the mark is thereon. There is. This is a problem particularly when a sheet or member having no stiffness and low elastic modulus is fixed by suction.

【0008】そこで、本発明の目的は、吸着面による影
響で画像認識が不安定になりにくく、精度の高い制御が
行える吸着搬送方法および吸着加工方法を提供すること
にある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a suction conveyance method and a suction processing method in which image recognition is less likely to be unstable due to the influence of a suction surface and high-precision control can be performed.

【0009】[0009]

【課題を解決するための手段】本発明者らは、超高分子
量ポリエチレンの燒結多孔質体からなる厚さ0.1〜3
mmの多孔質シートで吸着面を形成することにより、上
記目的を達成できることを見出し、本発明を完成するに
至った。
Means for Solving the Problems The present inventors have made a sintered porous body of ultrahigh molecular weight polyethylene having a thickness of 0.1 to 3 mm.
It has been found that the above object can be achieved by forming an adsorption surface with a porous sheet having a thickness of 2 mm, and the present invention has been completed.

【0010】即ち、本発明の吸着搬送方法は、吸着プレ
ートの吸着面に被搬送物を吸引固定した状態で、その吸
着プレートの移動により搬送を行う際に、前記被搬送物
に対する画像認識結果を利用して搬送制御を行う吸着搬
送方法において、前記吸着プレートの吸着面を超高分子
量ポリエチレンの燒結多孔質体からなる厚さ0.1〜3
mmの多孔質シートで形成してあることを特徴とする。
That is, according to the suction transfer method of the present invention, when a transfer object is transferred by moving the suction plate while the transfer object is suction-fixed to the suction surface of the suction plate, the image recognition result for the transfer object is determined. In the suction transfer method for controlling the transfer by utilizing the suction plate, the suction surface of the suction plate is made of a sintered porous body of ultra-high molecular weight polyethylene having a thickness of 0.1 to 3 mm.
mm porous sheet.

【0011】一方、本発明の吸着加工方法は、吸着プレ
ートの吸着面に被加工物を吸引固定し、その被加工物に
加工を行う加工手段を加工位置まで移動させる際に、前
記被加工物に対する画像認識結果を利用して位置制御を
行う吸着加工方法において、前記吸着プレートの吸着面
を超高分子量ポリエチレンの燒結多孔質体からなる厚さ
0.1〜3mmの多孔質シートで形成してあることを特
徴とする。
On the other hand, according to the suction processing method of the present invention, when the workpiece is suction-fixed to the suction surface of the suction plate and the processing means for processing the workpiece is moved to the processing position, In the suction processing method of performing position control using an image recognition result with respect to the above, the suction surface of the suction plate is formed of a porous sheet having a thickness of 0.1 to 3 mm made of a sintered porous body of ultra-high molecular weight polyethylene. There is a feature.

【0012】また、本発明の別の吸着加工方法は、第1
吸着プレートの吸着面に被加工物を吸引固定し、第2吸
着プレートの吸着面に被搬送物を吸引固定した状態で、
その第2吸着プレートの移動により前記被加工物に対す
る加工位置まで前記被搬送物の搬送を行う際に、前記被
搬送物及び/又は前記被加工物に対する画像認識結果を
利用して搬送制御を行う吸着加工方法において、前記第
2吸着プレート及び/又は前記第1吸着プレートの吸着
面を超高分子量ポリエチレンの燒結多孔質体からなる厚
さ0.1〜3mmの多孔質シートで形成してあることを
特徴とする。
[0012] Further, another suction processing method of the present invention is directed to the first method.
In a state where the workpiece is suction-fixed to the suction surface of the suction plate, and the workpiece is suction-fixed to the suction surface of the second suction plate,
When transporting the transported object to the processing position for the workpiece by moving the second suction plate, transport control is performed using the image recognition result for the transported object and / or the workpiece. In the adsorption processing method, the adsorption surface of the second adsorption plate and / or the first adsorption plate is formed of a porous sheet having a thickness of 0.1 to 3 mm made of a sintered porous body of ultra-high molecular weight polyethylene. It is characterized by.

【0013】[作用効果]本発明の吸着搬送方法または
吸着加工方法によると、画像認識の対象物が吸引固定さ
れる吸着面を、超高分子量ポリエチレンの燒結多孔質体
からなる厚さ0.1〜3mmの多孔質シートで形成する
ため、吸着面が画像認識に影響を与えにくく、対象物の
形状や部位、各部の位置等を正確に認識することができ
る。これは、微細孔が均一に形成されており、通気度や
弾性率等との関係で吸引孔による変形も少ないためであ
る。また、シート状物の接合加工においても、クッショ
ン性により部材の密着性は高いため、安定した加工が可
能であり、耐磨耗性に優れるため、加工、吸着に対して
も耐久性があり、自己発塵性が少なく、汚染、異物混入
の問題も回避可能である。更に、均一な微細孔によっ
て、対象物が不定形であっても、また対象物がどの位置
にあっても、吸着力が変動することなく、確実に吸引固
定することができ、搬送や加工が精度良く行える。
According to the suction conveying method or the suction processing method of the present invention, the suction surface on which the object of image recognition is to be suction-fixed has a thickness of 0.1 mm made of a sintered porous body of ultra-high molecular weight polyethylene. Since it is formed of a porous sheet having a thickness of about 3 mm, the suction surface hardly affects image recognition, and the shape, site, position of each part, and the like of the object can be accurately recognized. This is because the fine holes are formed uniformly, and the deformation due to the suction holes is small in relation to the air permeability and the elastic modulus. Also, in the joining process of the sheet-like material, since the adhesiveness of the member is high due to the cushioning property, stable processing is possible, and since it is excellent in abrasion resistance, it has durability against processing and suction, It has low self-dusting properties and can avoid problems of contamination and contamination. Furthermore, even if the target is amorphous or the target is located at any position, the suction force can be reliably fixed without changing the suction force by the uniform fine holes, and the conveyance and processing can be performed. Can be performed with high accuracy.

【0014】[0014]

【発明の実施の形態】以下、本発明の実施の形態につい
て、多孔質シート、吸着搬送方法、吸着加工方法の順で
説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in the order of a porous sheet, a suction conveyance method, and a suction processing method.

【0015】〔多孔質シート〕本発明における多孔質シ
ートはUHMWPEから形成されたものである。UHM
WPEは、一般のポリエチレンの分子量(粘度法による
測定値)が約10万以下であるのに対し、約50万以上
の高い値を示す点が特徴である。かようなUHMWPE
は、例えば、三井石油化学工業社から「ハイゼックス・
ミリオン」、ヘキスト社から「ホスタレンGUR」等の
商品名で市販されている。
[Porous Sheet] The porous sheet in the present invention is formed from UHMWPE. UHM
WPE is characterized in that the molecular weight (measured by a viscosity method) of general polyethylene is about 100,000 or less, while the molecular weight is about 500,000 or more. Such UHMWPE
For example, from Mitsui Petrochemical Industries, Inc.
Million "and Hoechst AG under the trade name" Hostalen GUR ".

【0016】また、このUHMWPE多孔質シートはそ
の摩擦係数が0.3以下が好ましく、0.2以下がより
好ましい。摩擦係数が0.3を超えると吸引固定に用い
たときの寿命が短くなる傾向がある。
The UHMWPE porous sheet preferably has a coefficient of friction of 0.3 or less, more preferably 0.2 or less. When the friction coefficient exceeds 0.3, the life when used for suction fixing tends to be short.

【0017】このUHMWPE多孔質シートの厚さ、気
孔率、孔径は、画像認識において孔形状が影響を与えに
くく、吸引孔による変形を少なくする上で、厚さ0.1
〜3mm、気孔率5〜60%、孔径5〜200μmが好
ましく、厚さ0.5〜2mm、気孔率20〜40%、孔
径10〜150μmがより好ましい。
The thickness, porosity, and pore size of the UHMWPE porous sheet are set to a value of 0.1 to reduce the deformation due to the suction hole because the shape of the hole hardly affects the image recognition.
33 mm, a porosity of 5-60%, and a pore size of 5-200 μm are preferred, and a thickness of 0.5-2 mm, a porosity of 20-40%, and a pore size of 10-150 μm are more preferred.

【0018】次に、このUHMWPE多孔質シートの製
造法の一例を述べる。この方法はUHMWPE粉末を金
型に充填し、次いで、これをUHMWPEの融点以上の
温度に加熱された水蒸気雰囲気中で焼結してブロック状
成形体とした後冷却し、この成形体を所定厚さのシート
に切削するものである。
Next, an example of a method for producing the UHMWPE porous sheet will be described. In this method, a mold is filled with UHMWPE powder, and then sintered in a steam atmosphere heated to a temperature equal to or higher than the melting point of UHMWPE to form a block-shaped compact, and then cooled. It is to be cut into a sheet.

【0019】この方法においては、先ず、UHMWPE
粉末(粒径は通常30〜200μm)を金型に充填し、
次いで、これをUHMWPEの融点以上に加熱された水
蒸気雰囲気中で焼結してブロック状成形体とする。この
ようにUHMWPE粉末を金型に充填し、これを加熱さ
れた水蒸気雰囲気中で焼結するので、金型としては少な
くとも一つの開口部(加熱水蒸気導入用)を有するもの
を用いる。焼結に要する時間は粉末の充填量や水蒸気の
温度等によって変わるが、通常、約1〜12時間であ
る。
In this method, first, UHMWPE
Filling a mold with powder (particle size is usually 30-200 μm)
Next, this is sintered in a steam atmosphere heated to the melting point of UHMWPE or higher to obtain a block-shaped molded body. Since the mold is filled with the UHMWPE powder and sintered in a heated steam atmosphere, a mold having at least one opening (for introducing heated steam) is used. The time required for sintering varies depending on the filling amount of the powder, the temperature of steam, and the like, but is usually about 1 to 12 hours.

【0020】この際に用いる水蒸気はUHMWPEの融
点以上に昇温させるため、加圧状態とされるので、金型
に充填されたUHMWPE粉末間に容易に進入すること
ができる。なお、UHMWPE粉末間への加熱水蒸気の
進入をより容易にするため、該粉末を金型に充填し、こ
の金型を耐圧容器に入れ、減圧状態とする脱気操作を施
し、その後加熱された水蒸気雰囲気中で焼結するように
してもよい。この際の減圧度合いは特に限定されない
が、約1〜100mmHgが好ましい。
The steam used at this time is pressurized in order to raise the temperature above the melting point of UHMWPE, so that it can easily enter between the UHMWPE powders filled in the mold. In order to make it easier for heated steam to enter between the UHMWPE powders, the powder was filled in a mold, and the mold was placed in a pressure-resistant container, subjected to a deaeration operation under reduced pressure, and then heated. Sintering may be performed in a steam atmosphere. The degree of pressure reduction at this time is not particularly limited, but is preferably about 1 to 100 mmHg.

【0021】従って、金型に充填されたUHMWPE粉
末の焼結は、前記耐圧容器に水蒸気導入管およびその開
閉バルブを設けておき、該粉末間の空気を脱気した後、
減圧を止めあるいは減圧を続けながら、水蒸気バルブを
開いて加熱水蒸気を導入する方法によって行うことがで
きる。
Therefore, the sintering of the UHMWPE powder filled in the mold is performed by providing a steam introduction pipe and an opening / closing valve thereof in the pressure-resistant container and degassing the air between the powders.
The method can be carried out by a method of opening the steam valve and introducing heated steam while stopping or continuing to reduce the pressure.

【0022】この焼結時において、UHMWPE粉末は
融点以上の温度に加熱されるがその溶融粘度が高いので
あまり流動せず、その粉末形状を一部乃至大部分維持
し、隣接する粉末相互がその接触部位において熱融着し
多孔質のブロック状成形体(粉末相互の非接触部が該多
孔質成形体の微孔となる)が形成される。なお、焼結に
際し、所望により加圧することもできるが、その圧力
は、通常、約10kg/cm2 以下とするのが好まし
い。
During the sintering, the UHMWPE powder is heated to a temperature not lower than its melting point, but does not flow much because of its high melt viscosity, and maintains a part or most of the powder shape, and the adjacent powders have the same shape. Heat fusion is performed at the contact portion to form a porous block-shaped molded product (the non-contact portions between the powders become micropores of the porous molded product). During sintering, pressure may be applied as desired, but the pressure is usually preferably about 10 kg / cm 2 or less.

【0023】上記のようにして焼結を行った後、冷却す
る。冷却に際してはブロック状成形体への亀裂の発生を
防止するため、急冷を避けるのが好ましく、例えば、室
温に放置して冷却する方法を採用できる。なお、冷却は
ブロック状成形体を金型に入れたまま行ってもよく、あ
るいは金型から取り出して行ってもよい。このようにし
てブロック状成形体を冷却した後、旋盤等により所定厚
さに切削することにより、多孔質シートを得ることがで
きる。
After sintering as described above, it is cooled. During cooling, it is preferable to avoid rapid cooling in order to prevent cracks from forming in the block-shaped molded body. For example, a method in which the molded body is left at room temperature and cooled can be employed. The cooling may be performed while the block-shaped molded body is placed in the mold, or may be removed from the mold. After cooling the block-shaped molded body in this manner, a porous sheet can be obtained by cutting to a predetermined thickness with a lathe or the like.

【0024】上記方法により得られる多孔質シートの微
孔の孔径、気孔率は用いるUHMWPE粉末の粒径や焼
結時における加圧の有無によって決定される。他の条件
が同じであれば、用いた粉末の粒径が大きい程微孔の孔
径が大きく、気孔率の高い多孔質シートが得られる。ま
た、焼結時に加圧しない場合は加圧した場合に比べ微孔
の孔径が大きく、気孔率の高い多孔質シートが得られ
る。更に、焼結時に加圧した場合はその圧力が高い程微
孔の孔径が小さく、気孔率の低い多孔質シートが得られ
る。
The pore size and porosity of the micropores of the porous sheet obtained by the above method are determined by the particle size of the UHMWPE powder to be used and the presence or absence of pressure during sintering. If the other conditions are the same, the larger the particle size of the powder used, the larger the pore size of the fine pores, and a porous sheet having a high porosity can be obtained. In addition, when pressure is not applied during sintering, a porous sheet having a large pore diameter and a high porosity can be obtained as compared with the case where pressure is applied. Furthermore, when pressure is applied during sintering, the higher the pressure, the smaller the pore size of the micropores and the lower the porosity of the porous sheet.

【0025】かような方法によって得られるUHMWP
E多孔質シートは、上記したように隣接するUHMWP
E粉末がその形状の一部乃至大部分を維持すると共に粉
末相互がその接触部位において熱融着してシート形状を
呈し、且つ、粉末相互の非接触部位を微孔とするミクロ
構造を有している。この多孔質シートのミクロ構造は、
例えば、多孔質シートを厚さ方向に沿って切断し、その
切断面を走査型電子顕微鏡を用いて観察(倍率は適宜設
定するが、通常、約100〜1000倍である)するこ
とができる。
UHMWP obtained by such a method
E porous sheet, as described above, the adjacent UHMWP
E has a microstructure in which the powder maintains a part or a large part of its shape, and the powders are heat-sealed at their contact portions to form a sheet, and the non-contact portions of the powders have micropores. ing. The microstructure of this porous sheet is
For example, the porous sheet can be cut along the thickness direction, and the cut surface can be observed using a scanning electron microscope (the magnification is appropriately set, but is usually about 100 to 1000 times).

【0026】本発明に係る多孔質シートは帯電防止処理
されたものであってもよい。帯電防止処理を施すことに
より、例えば、半導体ウェハのダイシング工程において
多孔質シートの帯電によるスパークを回避でき、スパー
クに起因するウェハの損傷を防止できる。また、塵やゴ
ミが半導体ウェハ等の被加工物に付着することも防止で
きる。
The porous sheet according to the present invention may have been subjected to an antistatic treatment. By performing the antistatic treatment, for example, a spark due to charging of the porous sheet can be avoided in a dicing process of a semiconductor wafer, and damage to the wafer due to the spark can be prevented. Further, it is possible to prevent dust and dirt from adhering to a workpiece such as a semiconductor wafer.

【0027】多孔質シートへの帯電防止処理は格別であ
る必要はなく、通常の方法を採用できる。例えば、上記
方法により多孔質シートを製造する場合にはUHMWP
E粉末の金型への充填に先立ち、該粉末と帯電防止剤を
混合し、この混合物を用いて作業すればよい。また、多
孔質のブロック状成形体またはこれを切削した多孔質シ
ートを帯電防止剤含有液と接触(浸漬、塗布等)させ、
該成形体またはシートに帯電防止剤を含浸させる方法を
採用することもできる。この処理を行う場合の帯電防止
剤の使用量は特に限定されないが、通常、処理済み多孔
質シートの重量中に占める帯電防止剤の割合が0.5〜
2重量%の範囲となるようにする。
The antistatic treatment on the porous sheet does not need to be exceptional, and a usual method can be employed. For example, when producing a porous sheet by the above method, UHMWP
Prior to filling the E powder into a mold, the powder and the antistatic agent may be mixed, and the mixture may be used for the operation. In addition, the porous block-shaped molded body or the porous sheet obtained by cutting the same is brought into contact with the antistatic agent-containing liquid (immersion, coating, etc.),
A method of impregnating the molded article or sheet with an antistatic agent can also be employed. The amount of the antistatic agent used when performing this treatment is not particularly limited, but usually the proportion of the antistatic agent in the weight of the treated porous sheet is 0.5 to
It is in the range of 2% by weight.

【0028】上記帯電防止剤としては「エレクノンOR
W(ニューファインケミカル株式会社製)」、「エレク
トロストリッパー(花王株式会社製)」等の市販品を用
いることができ、また、カーボンブラック粉末、金属粉
末等の無機質導電性材料を用いることができる。
As the above-mentioned antistatic agent, "Elecnon OR"
Commercially available products such as "W (manufactured by New Fine Chemical Co., Ltd.)" and "Electro Stripper (manufactured by Kao Corporation)" can be used, and inorganic conductive materials such as carbon black powder and metal powder can be used.

【0029】本発明に係る多孔質シートは着色されたも
のであってもよい。UHMWPE多孔質シートは白色不
透明であるが、これを任意の色に着色した場合には、例
えば、次のような利点がある。UHMWPE多孔質シー
トを液晶用ガラス板の切断に用いた場合、スクライビン
グ工程においてガラス板にスクライブ痕(白色に近い細
線)を付けるが、多孔質シートが白色であると、ガラス
板の下方の多孔質シートとスクライブ痕との画像認識に
よる区別が付きにくく、後の切断加工での加工制御が不
能となる場合がある。しかし、UHMWPE多孔シート
を白色以外の任意の色に着色しておけば、スクライブ痕
の白色と多孔質シートの色の対比により、このスクライ
ブ痕を容易に画像認識でき、精度良く切断加工が行える
ようになる。この着色された多孔質シートを上記の方法
により得るには、例えば、UHMWPE粉末の金型への
充填に先立ち、該粉末と顔料を混合し、この混合物を用
いて作業すればよい。
The porous sheet according to the present invention may be colored. Although the UHMWPE porous sheet is white and opaque, when it is colored in any color, there are the following advantages, for example. When the UHMWPE porous sheet is used for cutting a glass plate for liquid crystal, scribing marks (thin lines close to white) are formed on the glass plate in the scribing step. However, when the porous sheet is white, the porous sheet below the glass plate is removed. In some cases, it is difficult to distinguish between the sheet and the scribe mark by image recognition, and it may be impossible to perform processing control in the subsequent cutting processing. However, if the UHMWPE porous sheet is colored in an arbitrary color other than white, the scribe mark can be easily recognized as an image by the contrast between the white color of the scribe mark and the color of the porous sheet so that the cutting process can be performed with high accuracy. become. In order to obtain the colored porous sheet by the above-described method, for example, prior to filling the UHMWPE powder into a mold, the powder and the pigment may be mixed, and the mixture may be used for the operation.

【0030】本発明に係る多孔質シートを、後述の吸着
プレートの吸着面として形成する方法は、例えば両面粘
着テープや接着層を用いて、吸着面の形成面に部分的
(筋状、点状、網目状等)に接着したり、ストッパー等
で端縁近傍を着脱自在に固定したりする方法で行うこと
ができる。なお、接着剤としては基台への接着作業性、
および該シートを交換する際における基台からの剥離の
容易性を考慮すると感圧性接着剤が好ましいが、ホット
メルト接着剤や熱硬化型接着剤等を用いることもでき
る。
The method of forming the porous sheet according to the present invention as the suction surface of the suction plate described below is performed by partially (streak-like, dot-like) the formation surface of the suction surface using, for example, a double-sided adhesive tape or an adhesive layer. (Mesh-like or the like) or a method of detachably fixing the vicinity of the edge with a stopper or the like. In addition, as the adhesive, the workability of bonding to the base,
A pressure-sensitive adhesive is preferable in consideration of the ease of peeling from the base when the sheet is replaced, but a hot-melt adhesive or a thermosetting adhesive can also be used.

【0031】〔吸着搬送方法〕本発明の吸着搬送方法
は、吸着プレートの吸着面に被搬送物を吸引固定した状
態で、その吸着プレートの移動により搬送を行う際に、
前記被搬送物に対する画像認識結果を利用して搬送制御
を行うものである。この吸着搬送方法そのものは公知の
ため、装置図面に基づく詳細な説明は省略するが、吸着
プレートの移動機構、画像認識装置、制御方法などとし
ては以下のものが例示される。
[Suction and Conveyance Method] The suction and conveyance method of the present invention is a method for carrying an object by moving the suction plate while the object to be conveyed is suction-fixed to the suction surface of the suction plate.
The transport control is performed using the image recognition result for the transported object. Since the suction conveyance method itself is publicly known, a detailed description based on the drawing of the apparatus is omitted, but the following is exemplified as a suction plate moving mechanism, an image recognition device, a control method, and the like.

【0032】吸着プレートの移動機構としては、各種の
駆動機構を備えたXYテーブル、XYZテーブル、回転
自由度を更に有するテーブルやステージ、ロボットハン
ド、コンベヤなどのテーブル等を吸着プレートで構成し
たもの等が挙げられる。
As the moving mechanism of the suction plate, an XY table provided with various driving mechanisms, an XYZ table, a table having a rotational degree of freedom, a table such as a stage, a robot hand, a conveyor, etc. are constituted by the suction plate. Is mentioned.

【0033】画像認識装置としては画像処理手段を備え
たCCDカメラ、ITV、赤外線カメラ、イメージセン
サなとが挙げられる。これらは、搬送終了位置に向けて
配置される場合の他、搬送途中に配置されて吸着プレー
トと被搬送物との相対的な位置関係の計測等に用いられ
る場合がある。
Examples of the image recognition device include a CCD camera, an ITV, an infrared camera, and an image sensor having image processing means. These may be arranged toward the conveyance end position or may be arranged in the middle of the conveyance and used for measuring the relative positional relationship between the suction plate and the object to be conveyed.

【0034】画像認識の結果は、対象物の形状、部位
や、各部の位置などを特定するデータとして、制御フロ
ーに取り込まれて搬送制御に利用される。
The result of the image recognition is taken into a control flow as data for specifying the shape, part, and position of each part of the object, and is used for transport control.

【0035】吸着プレートは、例えば、図1に示すよう
に、上面に所定個数の吸引孔1を設けると共に所定位置
に吸引接続部2を設けた吸着プレート(金属等の機械的
強度を有する材料から成る)3とし、その吸引孔1の形
成面上に前述した多孔質シート5を固着した構成として
ある。この多孔質シート5の上に被加工物4を載置し、
吸引接続部2に接続されたホースを介して真空ポンプ
(図示省略)により減圧し吸着プレート3の内部を減圧
状態とすることにより、被加工物4を吸着プレート3上
に吸引固定しその位置ズレを防止しながら、吸着搬送を
行うことができる。
For example, as shown in FIG. 1, the suction plate is provided with a predetermined number of suction holes 1 on the upper surface and a suction connection portion 2 at a predetermined position (a material having mechanical strength such as metal). 3), and the above-described porous sheet 5 is fixed on the surface on which the suction holes 1 are formed. The workpiece 4 is placed on the porous sheet 5,
The workpiece 4 is suction-fixed onto the suction plate 3 by depressurizing the inside of the suction plate 3 through a hose connected to the suction connection part 2 to reduce the pressure inside the suction plate 3, thereby displacing the position thereof. Can be performed while preventing suction.

【0036】ロボットハンドなどにより上下方向の移動
を含む搬送の場合などでは、上方からの吸引固定が行わ
れる場合があり、その場合、図面の上下が逆転する。ま
た、水平方向からの吸引固定なども可能である。
In the case of transportation including vertical movement by a robot hand or the like, suction and fixing from above may be performed, in which case the drawing is turned upside down. In addition, it is also possible to fix by suction from the horizontal direction.

【0037】〔吸着加工方法〕本発明の吸着加工方法
は、吸着プレートの吸着面に被加工物を吸引固定し、そ
の被加工物に加工を行う加工手段を加工位置まで移動さ
せる際に、前記被加工物に対する画像認識結果を利用し
て位置制御を行うものである。この吸着加工方法そのも
のは公知のため、装置図面に基づく詳細な説明は省略す
るが、加工手段、加工手段の移動機構、画像認識装置、
制御方法などとしては以下のものが例示される。
[Suction Processing Method] In the suction processing method of the present invention, when a workpiece is suction-fixed to the suction surface of a suction plate and the processing means for processing the workpiece is moved to a processing position, The position control is performed using the image recognition result for the workpiece. Since this adsorption processing method itself is publicly known, detailed description based on the apparatus drawings is omitted, but processing means, a moving mechanism of the processing means, an image recognition device,
The following are examples of the control method and the like.

【0038】加工手段としては、部材同士の接合(貼り
合わせ、接着、溶接などを含む)、被加工物の切断、塗
工、マーキング、研磨、研削、穴あけ、ドライエッチン
グ、蒸着、被加工物への部品等の実装、固着、などを行
ういずれの手段でもよい。
As processing means, joining (including bonding, bonding, welding, etc.) of members, cutting, coating, marking, polishing, grinding, drilling, dry etching, vapor deposition, and processing of a workpiece are performed. Any means for mounting, fixing, and the like the above components may be used.

【0039】加工手段の移動機構としては、各種の駆動
機構を備えたXYテーブル、XYZテーブル、回転自由
度を更に有するテーブルやステージ、ロボットハンドな
どが挙げられる。
Examples of the moving mechanism of the processing means include an XY table, an XYZ table provided with various driving mechanisms, a table and a stage having a further degree of freedom of rotation, a robot hand, and the like.

【0040】画像認識装置としては画像処理手段を備え
たCCDカメラ、ITV、赤外線カメラ、イメージセン
サなとが挙げられる。これらは、吸着面上の被加工物に
向けて配置される。画像認識の結果は、対象物の形状、
部位や、各部の位置などを特定するデータとして、制御
フローに取り込まれて、加工手段を加工位置まで移動さ
せる際の位置制御に利用される。
Examples of the image recognition device include a CCD camera, an ITV, an infrared camera, and an image sensor having an image processing means. These are arranged towards the workpiece on the suction surface. The result of image recognition is the shape of the object,
The data is specified in a control flow as data for specifying a part, a position of each part, and the like, and is used for position control when the processing means is moved to the processing position.

【0041】吸着プレート自体は、前述の吸着搬送方法
の場合と同様である。また、被加工物を吸引固定した吸
着プレートは、搬送機構により搬送可能としてもよく、
その場合に前述の吸着搬送方法を採用してもよい。
The suction plate itself is the same as in the suction transport method described above. The suction plate on which the workpiece is fixed by suction may be transportable by a transport mechanism.
In that case, the above-mentioned suction conveyance method may be adopted.

【0042】〔別の吸着加工方法〕本発明の別の吸着加
工方法は、第1吸着プレートの吸着面に被加工物を吸引
固定し、第2吸着プレートの吸着面に被搬送物を吸引固
定した状態で、その第2吸着プレートの移動により前記
被加工物に対する加工位置まで前記被搬送物の搬送を行
う際に、前記被搬送物及び/又は前記被加工物に対する
画像認識結果を利用して搬送制御を行うものである。こ
の吸着加工方法そのものは公知のため、装置図面に基づ
く詳細な説明は省略するが、第2吸着プレートの移動機
構、加工手段、加工手段の移動機構、画像認識装置、制
御方法などとしては以下のものが例示される。
[Another Suction Processing Method] In another suction processing method of the present invention, a workpiece is suction-fixed on a suction surface of a first suction plate, and a workpiece is suction-fixed on a suction surface of a second suction plate. In this state, when the transported object is transported to the processing position for the workpiece by moving the second suction plate, the image recognition result for the transported object and / or the workpiece is used. This is to control the transport. Since this suction processing method itself is publicly known, a detailed description based on the device drawing is omitted, but the following are the second suction plate moving mechanism, processing means, processing means moving mechanism, image recognition device, control method, and the like. Are exemplified.

【0043】第2吸着プレートの移動機構としては、各
種の駆動機構を備えたXYテーブル、XYZテーブル、
回転自由度を更に有するテーブルやステージ、ロボット
ハンドなどが挙げられる。
As a moving mechanism of the second suction plate, an XY table provided with various driving mechanisms, an XYZ table,
A table, a stage, a robot hand, and the like further having a rotational degree of freedom are exemplified.

【0044】画像認識装置としては画像処理手段を備え
たCCDカメラ、ITV、赤外線カメラ、イメージセン
サなとが挙げられる。被搬送物に対する画像認識結果を
利用する場合、これらは搬送終了位置に向けて配置され
る場合の他、搬送途中に配置されて吸着プレートと被搬
送物との相対的な位置関係の計測等に用いられる場合が
ある。また、被加工物に対する画像認識結果を利用する
場合、これらは吸着面上の被加工物に向けて配置され
る。
The image recognition device includes a CCD camera, an ITV, an infrared camera, and an image sensor having an image processing means. When using the image recognition results for the transported object, these are not only placed toward the transport end position, but also placed in the middle of transport to measure the relative positional relationship between the suction plate and the transported object, etc. May be used. When the image recognition results for the workpiece are used, they are arranged toward the workpiece on the suction surface.

【0045】画像認識の結果は、被搬送物及び/又は被
加工物の形状、部位や、各部の位置などを特定するデー
タとして、制御フローに取り込まれて搬送制御に利用さ
れる。
The result of the image recognition is taken into a control flow as data for specifying the shape and the part of the object to be conveyed and / or the position of each part, and is used for the conveyance control.

【0046】被搬送物による加工方法としては、部材同
士の接合(貼り合わせ、接着、溶接などを含む)、部品
等の実装、固着などを行ういずれの方法でもよい。
As a processing method using an object to be conveyed, any method of joining (including bonding, bonding, welding, etc.) members, mounting and fixing components and the like may be used.

【0047】第1及び第2吸着プレート自体は、前述の
吸着搬送方法の場合と同様である。また、被加工物を吸
引固定した第1吸着プレートは、搬送機構により搬送可
能としてもよく、その場合に前述の吸着搬送方法を採用
してもよい。
The first and second suction plates themselves are the same as in the case of the suction and conveyance method described above. Further, the first suction plate on which the workpiece is suction-fixed may be conveyable by a conveyance mechanism, and in that case, the above-described suction conveyance method may be employed.

【0048】本発明では前記第2吸着プレート及び/又
は前記第1吸着プレートの吸着面であって、画像認識装
置を行う少なくとも何れかの吸着面を前述した多孔質シ
ートで形成してある。
In the present invention, at least one of the suction surfaces of the second suction plate and / or the first suction plate for performing the image recognition device is formed of the above-described porous sheet.

【0049】[0049]

【実施例】以下、本発明の構成と効果を具体的に示す実
施例等について説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments and the like specifically showing the configuration and effects of the present invention will be described below.

【0050】実施例1 図1に示す吸着プレートに、超高分子量ポリエチレンの
燒結多孔質体からなる厚さ0.5mm、気孔率35%、
孔径50μmの多孔質シートを装着し、吸引力が一定に
保たれるよう調節できる吸引ブロアにより吸引を行っ
た。次に、不定形の回路基板を設置し、固定が行えてい
るか確認した。更に、上方から別の回路基板を同様の吸
着プレートに吸引固定させたものを自動搬送させ、これ
ら2種類の基板を接合させるためにCCDカメラによる
画像認識により位置決めを行った結果、正確に両者を接
合させることができた。さらに次工程へ、接合された回
路基板を上から吸着し搬送することができた。
Example 1 An adsorption plate shown in FIG. 1 was formed of a sintered porous body of ultra-high molecular weight polyethylene having a thickness of 0.5 mm and a porosity of 35%.
A porous sheet having a pore size of 50 μm was attached, and suction was performed with a suction blower that could be adjusted to maintain a constant suction force. Next, an irregular-shaped circuit board was installed, and it was confirmed whether the circuit board was fixed. Further, a circuit board from which another circuit board was suction-fixed to the same suction plate was automatically conveyed from above, and positioning was performed by image recognition with a CCD camera in order to join the two types of boards, and as a result, both were accurately positioned. We were able to join. Further, the bonded circuit board could be sucked from above and transported to the next step.

【0051】比較例1 実施例1の多孔質シートをSMC製の吸着プレートSP
シリーズ(SUS材焼結金属、空孔径φ0.3mm、開
口率15%以上、空隙率30%、表面ラッピング仕上
げ)の多孔質シートに代える以外は、実施例1と同様に
して2種類の基板の接合を試みたが、孔径が不揃いで長
い孔があり、画像読み込み時に誤認識が生じて位置決め
制御が不能となった。
COMPARATIVE EXAMPLE 1 The porous sheet of Example 1 was replaced with a suction plate SP made of SMC.
Except for replacing the porous sheet of the series (SUS material sintered metal, pore diameter φ0.3 mm, opening ratio 15% or more, porosity 30%, surface lapping finish), two kinds of substrates were prepared in the same manner as in Example 1. Attempts were made to join, but there were long holes with unequal hole diameters, and erroneous recognition occurred when reading images, making positioning control impossible.

【0052】比較例2 実施例1の多孔質シートをセラミックス製の多孔質シー
ト(粒度♯46、気孔率35%、平均孔径0.22m
m)に代える以外は、実施例1と同様にして2種類の基
板の接合を試みた。その際、画像がざらつくものの画像
読み込みは可能となったが、使用中にゴミが黒く堆積
し、画像読み込みが不安定となった。また、多孔質シー
トの掃除が困難であり、交換するにも高価すぎるという
問題がある。
Comparative Example 2 The porous sheet of Example 1 was replaced with a ceramic porous sheet (particle size: 46, porosity: 35%, average pore diameter: 0.22 m).
An attempt was made to bond two types of substrates in the same manner as in Example 1 except that m) was replaced. At that time, the image reading became possible although the image was rough, but dust was deposited in black during use, and the image reading became unstable. Further, there is a problem that it is difficult to clean the porous sheet and it is too expensive to replace the porous sheet.

【0053】比較例3 実施例1の多孔質シートをアルミ製の吸着プレート(穴
径φ1.2mm、間隔6mm)に代える以外は、実施例
1と同様にして2種類の基板の接合を試みたが、穴を避
けなければ画像読み込みが不可能となった。
Comparative Example 3 Two types of substrates were joined in the same manner as in Example 1 except that the porous sheet of Example 1 was replaced with an aluminum suction plate (hole diameter φ1.2 mm, interval 6 mm). However, the image could not be read without avoiding the holes.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明における吸着プレートの一例を示す断面
FIG. 1 is a cross-sectional view showing an example of a suction plate according to the present invention.

【符号の説明】[Explanation of symbols]

1 吸引孔 2 吸引接続部 3 吸着プレート 4 被加工物(又は被搬送物) 5 多孔質シート DESCRIPTION OF SYMBOLS 1 Suction hole 2 Suction connection part 3 Suction plate 4 Workpiece (or workpiece) 5 Porous sheet

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01L 21/68 H01L 21/68 B P F 21/301 21/78 N (72)発明者 船越 啓吾 大阪府茨木市下穂積1丁目1番2号 日東 精機株式会社内 Fターム(参考) 3C007 DS01 FS01 FT00 FT11 FU00 3C016 CE05 DA05 HC02 3F061 AA01 CA01 CB00 CB05 CC00 3F101 CB08 LA15 LB10 LB12 5F031 CA02 CA05 CA09 DA11 EA02 FA01 FA02 FA05 FA07 GA24 GA25 GA26 HA02 HA03 HA10 HA13 HA53 JA04 JA27 KA06 KA07 KA08 MA34 PA21 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 21/68 H01L 21/68 BF 21/301 21/78 N (72) Inventor Keigo Funakoshi Osaka 1-1-2 Shimohozumi, Ibaraki-shi Nitto Seiki Co., Ltd. F-term (reference) 3C007 DS01 FS01 FT00 FT11 FU00 3C016 CE05 DA05 HC02 3F061 AA01 CA01 CB00 CB05 CC00 3F101 CB08 LA15 LB10 LB12 5F031 CA02 CA05 FA01 FA02 FA07 GA24 GA25 GA26 HA02 HA03 HA10 HA13 HA53 JA04 JA27 KA06 KA07 KA08 MA34 PA21

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 吸着プレートの吸着面に被搬送物を吸引
固定した状態で、その吸着プレートの移動により搬送を
行う際に、前記被搬送物に対する画像認識結果を利用し
て搬送制御を行う吸着搬送方法において、前記吸着プレ
ートの吸着面を超高分子量ポリエチレンの燒結多孔質体
からなる厚さ0.1〜3mmの多孔質シートで形成して
あることを特徴とする吸着搬送方法。
1. A suction device for performing conveyance control by using an image recognition result for an object to be conveyed when the object to be conveyed is conveyed by moving the suction plate while the object to be conveyed is suction-fixed to an adsorption surface of the adsorption plate. In the transfer method, the suction surface of the suction plate is formed of a porous sheet having a thickness of 0.1 to 3 mm and made of a sintered porous body of ultra-high molecular weight polyethylene.
【請求項2】 吸着プレートの吸着面に被加工物を吸引
固定し、その被加工物に加工を行う加工手段を加工位置
まで移動させる際に、前記被加工物に対する画像認識結
果を利用して位置制御を行う吸着加工方法において、前
記吸着プレートの吸着面を超高分子量ポリエチレンの燒
結多孔質体からなる厚さ0.1〜3mmの多孔質シート
で形成してあることを特徴とする吸着加工方法。
2. A workpiece is suction-fixed to a suction surface of a suction plate, and when a processing means for processing the workpiece is moved to a processing position, an image recognition result for the workpiece is used. In an adsorption processing method for performing position control, an adsorption surface of the adsorption plate is formed of a porous sheet having a thickness of 0.1 to 3 mm made of a sintered porous body of ultra-high molecular weight polyethylene. Method.
【請求項3】 第1吸着プレートの吸着面に被加工物を
吸引固定し、第2吸着プレートの吸着面に被搬送物を吸
引固定した状態で、その第2吸着プレートの移動により
前記被加工物に対する加工位置まで前記被搬送物の搬送
を行う際に、前記被搬送物及び/又は前記被加工物に対
する画像認識結果を利用して搬送制御を行う吸着加工方
法において、前記第2吸着プレート及び/又は前記第1
吸着プレートの吸着面を超高分子量ポリエチレンの燒結
多孔質体からなる厚さ0.1〜3mmの多孔質シートで
形成してあることを特徴とする吸着加工方法。
3. The workpiece is suction-fixed to the suction surface of the first suction plate, and the workpiece is suction-fixed to the suction surface of the second suction plate. In the suction processing method of performing transfer control using an image recognition result for the transferred object and / or the processed object when the transferred object is transferred to a processing position for the object, the second suction plate and / Or the first
An adsorption processing method, characterized in that the adsorption surface of the adsorption plate is formed of a porous sheet having a thickness of 0.1 to 3 mm made of a sintered porous body of ultra-high molecular weight polyethylene.
JP2000372429A 2000-12-07 2000-12-07 Suction carrying method and suction machining method Pending JP2002173250A (en)

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