JP2006196862A - Supporting pin for substrate - Google Patents
Supporting pin for substrate Download PDFInfo
- Publication number
- JP2006196862A JP2006196862A JP2005218116A JP2005218116A JP2006196862A JP 2006196862 A JP2006196862 A JP 2006196862A JP 2005218116 A JP2005218116 A JP 2005218116A JP 2005218116 A JP2005218116 A JP 2005218116A JP 2006196862 A JP2006196862 A JP 2006196862A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pin
- support pin
- porous body
- tip part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
本発明はガラス基板や半導体ウェーハなどの基板を支持する支持ピンに関する。 The present invention relates to a support pin that supports a substrate such as a glass substrate or a semiconductor wafer.
例えばLCD用ガラス基板にレジスト膜やカラーフィルタ膜を形成するには、レジスト液等を基板表面に塗布した後、ホットプレートなどを用いて基板を加熱処理する。この際、ガラス基板をホットプレートまで搬送する搬送アームやガラス基板を受け渡す昇降部材は、ガラス基板の下面を支持するピンを備えている。このピンがガラス基板の下面に下から当接することで、ガラス基板に温度ムラが発生したりピン跡が生じる問題がある。 For example, in order to form a resist film or a color filter film on a glass substrate for LCD, a resist solution or the like is applied to the substrate surface, and then the substrate is heated using a hot plate or the like. At this time, a transport arm that transports the glass substrate to the hot plate and a lifting member that delivers the glass substrate include pins that support the lower surface of the glass substrate. When this pin contacts the lower surface of the glass substrate from below, there is a problem that temperature unevenness occurs in the glass substrate or pin marks are generated.
この問題に対処するため、特許文献1ではホットプレート型のベーク炉に用いる支持ピンとして、全芳香族ポリイミド樹脂製のものが提案されている。
また、特許文献2及び3には基板支持部材の先端部に繊維からなる部分を設け、この繊維からなる部分をフェルト状或いは毛玉状にすることが提案されている。
In Patent Documents 2 and 3, it is proposed that a portion made of a fiber is provided at the tip of the substrate support member, and the portion made of the fiber is made in a felt shape or a pill shape.
特許文献1のように、ポリイミド樹脂製のピンとした場合には耐熱性には優れるが、ピンが密なためピン自体に熱が蓄積され、ピンと接触している箇所が他の箇所よりも冷却速度が遅くなるなど温度ムラが発生する。そして、この温度ムラは塗布ムラの原因になる。 When a pin made of polyimide resin is used as in Patent Document 1, the heat resistance is excellent, but since the pin is dense, heat is accumulated in the pin itself, and the portion in contact with the pin has a cooling rate higher than other portions. Temperature unevenness such as slowing down. This temperature unevenness causes uneven application.
また、特許文献1のように、繊維をフェルト状や毛玉状にした部分を基板の下面に接触させた場合には、当該接触部分において熱がこもらないので、温度ムラが発生しないが、基板に接触した際に細かい繊維がパーティクルとして基板に付着する不利がある。 In addition, as in Patent Document 1, when a fiber-like or pill-shaped portion is brought into contact with the lower surface of the substrate, heat does not accumulate at the contact portion, so temperature unevenness does not occur, but contact with the substrate In this case, there is a disadvantage that fine fibers adhere to the substrate as particles.
上記課題を解決するため本発明に係る基板支持ピンは、少なくとも基板の下面に当接する球状先端部を、プラスチック焼結多孔質体とした。尚、ピンの球状先端部のみでなくピン全体をプラスチック焼結多孔質体で構成してもよい。 In order to solve the above problems, in the substrate support pin according to the present invention, at least the spherical tip that contacts the lower surface of the substrate is a plastic sintered porous body. In addition, you may comprise not only the spherical front-end | tip part of a pin but the whole pin with a plastic sintered porous body.
多孔質体の好ましい気孔率としては20%以上〜60%以下である。気孔率が20%未満では温度ムラによるピン跡が生じやすく、気孔率が60%以上になるとピンの機械的強度が不足する。
尚、機械的強度を高めるためセラミック焼結体を支持ピンとすることも考えられるが、上記の気孔率にすることが困難で、ピン自体に熱が蓄積されてしまう。
The preferable porosity of the porous body is 20% to 60%. If the porosity is less than 20%, pin marks due to temperature unevenness are likely to occur, and if the porosity is 60% or more, the mechanical strength of the pin is insufficient.
Although it is conceivable to use a ceramic sintered body as a support pin in order to increase the mechanical strength, it is difficult to achieve the above porosity, and heat is accumulated in the pin itself.
上記のようなプラスチック焼結多孔質体を成形するには、プラスチック粉体を支持ピン形状に成形し、この成形体を当該プラスチックの融点近くまで加熱する。すると粉体粒子間の結合が進み、点接触から面接触への形状変化によって、緻密化とともに強度が増加する。尚、焼結によって寸法が縮まるためその分を見越した寸法の成形体を作製する必要がある。
またプラスチック焼結多孔質体は、焼結した母材を加工して製作する場合もある。
In order to mold the plastic sintered porous body as described above, a plastic powder is molded into a support pin shape, and the molded body is heated to near the melting point of the plastic. Then, the bonding between the powder particles proceeds, and the strength increases with densification due to the shape change from point contact to surface contact. In addition, since a dimension shrinks | reduces by sintering, it is necessary to produce the molded object of the dimension which anticipated the part.
The plastic sintered porous body may be manufactured by processing a sintered base material.
また、プラスチック焼結多孔質体を構成する材料としては、超高分子ポリエチレン、高密度ポリエチレンおよびPFA(フッ素樹脂)が、耐熱性、硬度において他の材料(ポリエチレン、ポリプロピレン、エチレン酢酸ビニル共重合体)と比較した結果、基板支持ピンとして最も優れていた。 In addition, as materials constituting the plastic sintered porous body, ultra-high molecular polyethylene, high density polyethylene and PFA (fluororesin) are other materials (polyethylene, polypropylene, ethylene vinyl acetate copolymer) in heat resistance and hardness. As a result, it was the most excellent substrate support pin.
本発明によれば、基板を支持するピンをプラスチック焼結多孔質体とすることでピン自体に熱がこもることがなくなり、温度ムラが基板に転写されることがなくなる。またプラスチック製とすることで繊維と比較して細かなパーティクルの発生を抑制することができる。
このように、温度ムラによって基板にピン跡がついてしまうおそれがないので、基板が大型化しても基板周囲のみでなく基板中央をピンによって支持することができる。
According to the present invention, since the pins supporting the substrate are made of a plastic sintered porous body, heat is not trapped in the pins themselves, and temperature unevenness is not transferred to the substrate. Moreover, generation | occurrence | production of a fine particle can be suppressed by using plastics compared with a fiber.
In this way, there is no fear that pin marks will be attached to the substrate due to temperature unevenness, so that not only the periphery of the substrate but also the center of the substrate can be supported by the pins even if the substrate is enlarged.
以下に本発明の好適な実施例を添付図面に基づいて説明する。図1は本発明に係る支持ピンを搬送装置と昇降装置に取り付けた例を示した図、図2は支持ピンによってガラス基板を支持している状態の拡大図である。 Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a view showing an example in which a support pin according to the present invention is attached to a transport device and a lifting device, and FIG. 2 is an enlarged view of a state in which a glass substrate is supported by the support pin.
図中1はホットプレート、2はホットプレート1に対しガラス基板Wを受け渡し或いはホットプレート1からガラス基板Wを受け取る搬送装置、3はホットプレート1からガラス基板Wを持ち上げる昇降装置である。 In the figure, 1 is a hot plate, 2 is a transfer device that delivers the glass substrate W to the hot plate 1 or receives the glass substrate W from the hot plate 1, and 3 is an elevating device that lifts the glass substrate W from the hot plate 1.
前記搬送装置2のアーム4の内側上面には本発明に係る支持ピン20が取り付けられている。この支持ピン20は図2に示すように本体部21に対し先端部22が交換可能に装着され、先端部22の上面は球面状とされている。 A support pin 20 according to the present invention is attached to the inner upper surface of the arm 4 of the transport device 2. As shown in FIG. 2, the support pin 20 is attached to the main body portion 21 so that the tip end portion 22 is replaceable, and the top surface of the tip end portion 22 is spherical.
また、先端部22はプラスチック焼結多孔質体からなり、その気孔率は20%〜60%とされている。尚、図示例では支持ピン20を本体部21と先端部22に分けたが、ピン全体をプラスチック焼結多孔質体にて構成してもよい。 Moreover, the front-end | tip part 22 consists of a plastic sintered porous body, and the porosity is 20%-60%. In the illustrated example, the support pin 20 is divided into the main body portion 21 and the tip portion 22, but the entire pin may be formed of a plastic sintered porous body.
一方、ホットプレート1には厚み方向に貫通孔10が形成され、この貫通孔10に前記昇降装置3に設けた支持ピン30が挿通している。この支持ピン30も前記支持ピン20と同様に本体部とこれに着脱自在とされた先端部にて構成されている。 On the other hand, a through hole 10 is formed in the hot plate 1 in the thickness direction, and a support pin 30 provided in the lifting device 3 is inserted into the through hole 10. Like the support pin 20, the support pin 30 is also composed of a main body portion and a tip portion that is detachable from the main body portion.
尚、図示例では支持ピンを搬送装置または昇降装置に適用した例を示したが、これに限らず基板の下面を支持する部材であれば、本発明に係る支持ピンを適用することができる。 In the illustrated example, the support pin is applied to the transport device or the lifting device. However, the present invention is not limited to this, and the support pin according to the present invention can be applied to any member that supports the lower surface of the substrate.
以下の(表)はプラスチック焼結多孔質体からなる先端部の材料として、超高分子ポリエチレンを用い、気孔率を変化させた場合のピン跡の有無を調べた結果である。この(表)から、気孔率は20%〜60%が好ましいことが分かる。 The following (Table) is the result of examining the presence or absence of pin marks when the porosity is changed using ultra high molecular weight polyethylene as the material of the tip portion made of a plastic sintered porous body. From this (table), it is understood that the porosity is preferably 20% to 60%.
1…ホットプレート、10…貫通孔、2…搬送装置、20…基板支持ピン、21…ピン本体部、22…先端部、3…昇降装置、30…支持ピン、W…ガラス基板。 DESCRIPTION OF SYMBOLS 1 ... Hot plate, 10 ... Through-hole, 2 ... Conveying device, 20 ... Board | substrate support pin, 21 ... Pin main-body part, 22 ... Tip part, 3 ... Elevating device, 30 ... Support pin, W ... Glass substrate.
Claims (3)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005218116A JP2006196862A (en) | 2004-12-16 | 2005-07-28 | Supporting pin for substrate |
KR1020050124608A KR20060069335A (en) | 2004-12-16 | 2005-12-16 | Supporting pin for substrate |
TW094144870A TW200625512A (en) | 2004-12-16 | 2005-12-16 | Supporting pin for substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004364460 | 2004-12-16 | ||
JP2005218116A JP2006196862A (en) | 2004-12-16 | 2005-07-28 | Supporting pin for substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006196862A true JP2006196862A (en) | 2006-07-27 |
Family
ID=36802658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005218116A Pending JP2006196862A (en) | 2004-12-16 | 2005-07-28 | Supporting pin for substrate |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006196862A (en) |
KR (1) | KR20060069335A (en) |
TW (1) | TW200625512A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008112902A (en) * | 2006-10-31 | 2008-05-15 | Mitsubishi Heavy Ind Ltd | Supporting method and supporting structure of substrate |
JP2010047330A (en) * | 2008-08-19 | 2010-03-04 | Avanstrate Inc | Glass plate carrying device and contact member |
WO2019038902A1 (en) * | 2017-08-25 | 2019-02-28 | 株式会社日本製鋼所 | Laser irradiation device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100824305B1 (en) * | 2006-12-22 | 2008-04-22 | 세메스 주식회사 | Support pin, unit for supporting a substrate and apparatus for cleaning the substrate having the same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263520A (en) * | 1994-03-17 | 1995-10-13 | Dainippon Screen Mfg Co Ltd | Apparatus for conveying/accomodating substrate |
JPH08323571A (en) * | 1995-05-30 | 1996-12-10 | Nitto Denko Corp | Suction locking device |
JP2002173250A (en) * | 2000-12-07 | 2002-06-21 | Nitto Denko Corp | Suction carrying method and suction machining method |
JP2002289664A (en) * | 2001-03-26 | 2002-10-04 | Toray Ind Inc | Substrate carrying hand and substrate carrying method, color filter manufacturing apparatus using these and manufacturing method thereof |
JP2003103723A (en) * | 2001-10-01 | 2003-04-09 | Nitto Denko Corp | Antistatic porous object |
-
2005
- 2005-07-28 JP JP2005218116A patent/JP2006196862A/en active Pending
- 2005-12-16 TW TW094144870A patent/TW200625512A/en unknown
- 2005-12-16 KR KR1020050124608A patent/KR20060069335A/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263520A (en) * | 1994-03-17 | 1995-10-13 | Dainippon Screen Mfg Co Ltd | Apparatus for conveying/accomodating substrate |
JPH08323571A (en) * | 1995-05-30 | 1996-12-10 | Nitto Denko Corp | Suction locking device |
JP2002173250A (en) * | 2000-12-07 | 2002-06-21 | Nitto Denko Corp | Suction carrying method and suction machining method |
JP2002289664A (en) * | 2001-03-26 | 2002-10-04 | Toray Ind Inc | Substrate carrying hand and substrate carrying method, color filter manufacturing apparatus using these and manufacturing method thereof |
JP2003103723A (en) * | 2001-10-01 | 2003-04-09 | Nitto Denko Corp | Antistatic porous object |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008112902A (en) * | 2006-10-31 | 2008-05-15 | Mitsubishi Heavy Ind Ltd | Supporting method and supporting structure of substrate |
JP2010047330A (en) * | 2008-08-19 | 2010-03-04 | Avanstrate Inc | Glass plate carrying device and contact member |
WO2019038902A1 (en) * | 2017-08-25 | 2019-02-28 | 株式会社日本製鋼所 | Laser irradiation device |
JPWO2019038902A1 (en) * | 2017-08-25 | 2020-11-05 | 株式会社日本製鋼所 | Laser irradiation device |
US11684999B2 (en) | 2017-08-25 | 2023-06-27 | Jsw Aktina System Co., Ltd | Laser irradiation apparatus |
Also Published As
Publication number | Publication date |
---|---|
TW200625512A (en) | 2006-07-16 |
KR20060069335A (en) | 2006-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2006196862A (en) | Supporting pin for substrate | |
CN107117802B (en) | Glass forming die and method for manufacturing curved glass | |
TW200909363A (en) | Methods for forming compositions containing glass | |
JP2010064945A (en) | Method for manufacturing ceramic composite particle and functional ceramic composite particle | |
JP2002025758A (en) | Hot plate unit | |
JP2006026981A (en) | Sucking and fixing sheet and its manufacturing method | |
JPH10107131A (en) | Suction table and element thereof | |
JPWO2014163130A1 (en) | Glass substrate and slow cooling method thereof | |
JP2007251073A (en) | Member for supporting substrate | |
JP5231064B2 (en) | Vacuum adsorption apparatus and method for manufacturing the same | |
JP2015150787A (en) | Method for conveying slit sheet | |
JP4092553B2 (en) | Transport system | |
WO2007069519A1 (en) | Microstructure and method for manufacturing same | |
JP2009007223A (en) | Method and apparatus for producing glass formed article | |
JP2004250321A (en) | Inorganic porous thin film, laminate using it, and method of manufacturing inorganic porous thin film | |
JP2009149474A (en) | Molding die and method for manufacturing the die | |
JP2008000609A (en) | Conductive plate for cooking container for induction range | |
KR101661035B1 (en) | Forming mold for glass | |
JP2000062950A (en) | Flotation apparatus | |
JP2007005333A (en) | Porous plate and manufacturing method thereof | |
JP2007281206A (en) | Usage of sheet for suction-fixing | |
JP2017149614A (en) | Glass molding die and method for manufacturing curved surface glass | |
CN106601465B (en) | A kind of high temperature resistant circle alms bowl | |
JP4085485B2 (en) | Wafer transfer mechanism | |
JP2007283493A (en) | Method for producing sheet for adsorption fixing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080609 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100223 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100302 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20100706 |