KR20060069335A - Supporting pin for substrate - Google Patents

Supporting pin for substrate Download PDF

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Publication number
KR20060069335A
KR20060069335A KR1020050124608A KR20050124608A KR20060069335A KR 20060069335 A KR20060069335 A KR 20060069335A KR 1020050124608 A KR1020050124608 A KR 1020050124608A KR 20050124608 A KR20050124608 A KR 20050124608A KR 20060069335 A KR20060069335 A KR 20060069335A
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South Korea
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substrate
support pin
pin
porous body
sintered porous
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KR1020050124608A
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Korean (ko)
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카즈노부 야마구치
츠네오 타니모토
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도쿄 오카 고교 가부시키가이샤
다즈모 가부시키가이샤
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Publication of KR20060069335A publication Critical patent/KR20060069335A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

기판에 온도 편차에 기인하는 핀 흔적을 남기지 않는 지지핀을 제공한다. A support pin is provided on the substrate that does not leave pin traces due to temperature variations.

기판 지지핀(20)은 본체부(21)에 대하여 선단부(22)가 교환 가능하게 장착되고, 선단부(22)의 상면은 구면 형상으로 되어 있다. 또한, 선단부(22)는 플라스틱 소결 다공질체로 이루어지고, 그의 기공률은 20% ~ 60%로 되어 있다. 그 결과, 핀 선단부에 열이 응집되지 않고, 기판과의 접촉부에 온도차가 발생하지 않는다. As for the board | substrate support pin 20, the front-end | tip part 22 is replaceably attached with respect to the main body part 21, and the upper surface of the front-end | tip part 22 is spherical shape. The tip portion 22 is made of a plastic sintered porous body, and its porosity is 20% to 60%. As a result, heat is not agglomerated at the pin tip and no temperature difference occurs at the contact portion with the substrate.

기판, 지지핀, 플라스틱 소결 다공질체, 반송 장치, 승강 장치 Board, support pin, plastic sintered porous body, conveying device, elevating device

Description

기판 지지핀{Supporting pin for substrate}Supporting pin for substrate

도 1은 본 발명에 따른 지지핀을 반송 장치와 승강 장치에 부착한 예를 나타낸 도면.1 is a view showing an example in which a support pin according to the present invention is attached to a conveying device and a lifting device.

도 2는 지지핀에 의해 유리 기판을 지지하고 있는 상태의 확대도.2 is an enlarged view of a state in which a glass substrate is supported by a support pin.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

1 : 핫 플레이트 10 : 관통 구멍1: Hot Plate 10: Through Hole

2 : 반송 장치 20 : 기판 지지핀2 transfer device 20 substrate support pin

21 : 핀 본체부 22 : 선단부21: pin body portion 22: tip portion

3 : 승강 장치 30 : 지지핀3: lifting device 30: support pin

W : 유리 기판W: glass substrate

본 발명은 유리 기판이나 반도체 웨이퍼 등의 기판을 지지하는 지지핀에 관한 것이다. The present invention relates to a support pin for supporting a substrate such as a glass substrate or a semiconductor wafer.

예를 들면, LCD용 유리 기판에 레지스트막이나 컬러 필터막을 형성하기 위해서는 레지스트액 등을 기판 표면에 도포한 후, 핫 플레이트 등을 이용하여 기판을 가열 처리한다. 이 때, 유리 기판을 핫 플레이트까지 반송하는 반송 암(arm)이나 유리 기판을 수수(受授)하는 승강 부재는 유리 기판의 하면을 지지하는 핀을 구비하고 있다. 이 핀이 유리 기판의 하면에 아래로부터 맞닿음으로써, 유리 기판에 온도 편차가 발생하거나 핀 흔적이 생기는 문제가 있다. For example, in order to form a resist film or a color filter film on a glass substrate for LCD, a resist liquid or the like is applied onto the substrate surface, and then the substrate is heat treated using a hot plate or the like. At this time, the conveyance arm which conveys a glass substrate to a hot plate, and the elevating member which carries a glass substrate are provided with the pin which supports the lower surface of a glass substrate. When this pin abuts on the lower surface of a glass substrate from below, there exists a problem that a temperature deviation generate | occur | produces in a glass substrate, or a pin trace arises.

이 문제에 대처하기 위해, 일본국 공개특허공고 평 08-279548호 공보에는 핫 플레이트형의 베이크(bake) 로(爐)에 사용하는 지지핀으로서 모든 방향족 폴리이미드 수지제의 것이 제안되어 있다. In order to cope with this problem, Japanese Unexamined Patent Application Publication No. 08-279548 proposes all aromatic polyimide resins as support pins for use in a hot plate bake furnace.

또한, 일본국 공개특허공고 평 03-296228호 공보 및 일본국 공개특허공고 2000-012655호 공보에는 기판 지지 부재의 선단부에 섬유로 된 부분을 마련하고, 이 섬유로 된 부분을 펠트 형상 혹은 털 뭉치 형상으로 하는 것이 제안되어 있다. Further, Japanese Unexamined Patent Application Publication No. 03-296228 and Japanese Unexamined Patent Application Publication No. 2000-012655 provide a fiber portion at the distal end of the substrate support member, and the fiber portion is formed in a felt shape or a bundle of hairs. The shape is proposed.

일본국 공개특허공고 평 08-279548호 공보와 같이, 폴리이미드 수지제의 핀으로 한 경우에는 내열성에는 우수하지만, 핀이 치밀하기 때문에 핀 자체에 열이 축적되어, 핀과 접촉하고 있는 개소가 다른 개소보다도 냉각 속도가 늦어지는 등의 온도 편차가 발생한다. 그리고, 이 온도 편차는 도포 편차의 원인이 된다. As in Japanese Patent Application Laid-Open No. 08-279548, a pin made of polyimide resin is excellent in heat resistance, but since the fin is dense, heat is accumulated in the fin itself, and the locations in contact with the fin are different. A temperature deviation, such as a slow cooling rate, arises rather than a location. And this temperature variation becomes a cause of application variation.

또한, 일본국 공개특허공고 평 03-296228호 공보 및 일본국 공개특허공고 2000-012655호 공보와 같이, 섬유를 펠트 형상이나 털 뭉치 형상으로 한 부분을 기판의 하면에 접촉시킨 경우에는, 이 접촉 부분에서, 열이 응집되지 않으므로, 온도 편차가 발생하지 않지만, 기판에 접촉했을 때에 미세한 섬유가 파티클로서 기판에 부착하는 단점이 있다. In addition, as in Japanese Patent Laid-Open No. 03-296228 and Japanese Patent Laid-Open No. 2000-012655, this contact is made when a part in which a fiber is made into a felt shape or a flock form is brought into contact with the lower surface of the substrate. In the part, since the heat does not agglomerate, a temperature deviation does not occur, but there is a disadvantage in that fine fibers adhere to the substrate as particles when contacted with the substrate.

상기 과제를 해결하기 위해 본 발명에 따른 기판 지지핀은 적어도 기판의 하면에 접하는 구(球) 형상 선단부를 플라스틱 소결 다공질체로 하였다. 또한, 핀의 구 형상 선단부뿐만 아니라, 핀 전체를 플라스틱 소결 다공질체로 구성하여도 좋다. In order to solve the said subject, the board | substrate support pin which concerns on this invention made the plastic sintered porous body at least the spherical tip part which contact | connects the lower surface of a board | substrate. In addition to the spherical tip of the fin, the entire fin may be made of a plastic sintered porous body.

다공질체의 바람직한 기공률은 20% 이상 ~ 60% 이하이다. 기공률이 20% 미만에서는 온도 편차에 의한 핀 흔적이 생기기 쉽고, 기공률이 60%를 초과하게 되면 핀의 기계적 강도가 부족하다. The porosity of the porous body is preferably 20% or more and 60% or less. If the porosity is less than 20%, pin traces are likely to occur due to temperature variation, and if the porosity exceeds 60%, the mechanical strength of the pin is insufficient.

또한, 기계적 강도를 높이기 위해 세라믹 소결체를 지지핀으로 하는 것도 생각해 볼 수 있지만, 상기 기공률로 하는 것이 어렵고, 핀 자체에 열이 축적되게 된다. It is also conceivable to use the ceramic sintered body as a support pin to increase the mechanical strength, but it is difficult to set the porosity, and heat is accumulated in the fin itself.

상기와 같은 플라스틱 소결 다공질체를 형성하기 위해서는, 플라스틱 분체(粉體)를 지지 핀 형상으로 성형하고, 이 성형체를 당해 플라스틱의 융점 가까이까지 가열한다. 그러면, 분체 입자 간의 결합이 진행되어, 점 접촉으로부터 면 접촉으로의 형상 변화에 의해, 치밀화와 함께 강도가 증가한다. 또한, 소결에 의해 치수가 줄어들기 때문에 그만큼을 예상한 치수의 성형체를 제조해야 할 필요가 있다. In order to form the plastic sintered porous body as described above, the plastic powder is molded into a support pin shape, and the molded body is heated to near the melting point of the plastic. Then, the bonding between the powder particles proceeds, and the strength increases with densification due to the shape change from point contact to surface contact. In addition, since the size is reduced by sintering, it is necessary to produce a molded article having the expected size.

또한, 플라스틱 소결 다공질체는 소결한 모재(母材)를 가공하여 제조하는 경우도 있다. In addition, the plastic sintered porous body may be manufactured by processing the sintered base material.

또한, 플라스틱 소결 다공질체를 구성하는 재료로서는 초고분자 폴리에틸렌, 고밀도 폴리에틸렌 및 PFA(불소 수지)가 내열성, 경도에 있어서 다른 재료(폴리에 틸렌, 폴리프로필렌, 에틸초산비닐 공중합체)와 비교한 결과, 기판 지지핀으로서 가장 우수하다. As a material constituting the plastic sintered porous body, ultra high molecular polyethylene, high density polyethylene and PFA (fluorine resin) are compared with other materials (polyethylene, polypropylene, ethyl acetate copolymer) in heat resistance and hardness, It is the best as a substrate support pin.

[실시예]EXAMPLE

아래에 본 발명의 바람직한 실시예를 첨부 도면에 기초하여 설명한다. 도 1은 본 발명에 따른 지지핀을 반송 장치와 승강 장치에 부착한 예를 나타낸 도면, 도 2는 지지핀에 의해 유리 기판을 지지하고 있는 상태의 확대도이다. EMBODIMENT OF THE INVENTION Below, the preferred embodiment of this invention is described based on an accompanying drawing. BRIEF DESCRIPTION OF THE DRAWINGS The figure which showed the example which attached the support pin which concerns on this invention to a conveying apparatus and a lifting device, and FIG. 2 is an enlarged view of the state which supports the glass substrate by the support pin.

도면 중 부호 1은 핫 플레이트, 부호 2는 핫 플레이트(1)에 대하여 유리 기판(W)을 수수하거나 혹은 핫 플레이트(1)로부터 유리 기판(W)을 받는 반송 장치, 부호 3은 핫 플레이트(1)로부터 유리 기판(W)을 들어올리는 승강 장치이다. In the figure, reference numeral 1 denotes a hot plate, reference numeral 2 denotes a conveying apparatus which receives the glass substrate W with respect to the hot plate 1 or receives the glass substrate W from the hot plate 1, and reference numeral 3 denotes a hot plate 1 It is a lifting device which lifts the glass substrate W from ().

상기 반송 장치(2)의 암(arm)(4)의 내측 상면에는 본 발명에 따른 지지핀(20)이 부착되어 있다. 이 지지핀(20)은 도 2에 나타내는 바와 같이 본체부(21)에 대하여 선단부(22)가 교환 가능하게 장착되고, 선단부(22)의 상면은 구면(球面) 형상으로 되어 있다. The support pin 20 according to the present invention is attached to the inner upper surface of the arm 4 of the conveying device 2. As shown in FIG. 2, this support pin 20 is mounted so that the tip part 22 is replaceable with respect to the main body part 21, and the upper surface of the tip part 22 is spherical shape.

또한, 선단부(22)는 플라스틱 소결 다공질체로 이루어지고, 그의 기공률은 20% ~ 60%로 되어 있다. 또한, 도시예에서는 지지핀(20)을 본체부(21)와 선단부(22)로 나누었지만, 핀 전체를 플라스틱 소결 다공질체로 구성하여도 좋다. The tip portion 22 is made of a plastic sintered porous body, and its porosity is 20% to 60%. In addition, although the support pin 20 was divided into the main-body part 21 and the front-end | tip part 22 in the example of illustration, you may comprise the whole pin with the plastic sintered porous body.

한편, 핫 플레이트(1)에는 두께 방향으로 관통 구멍(10)이 형성되고, 이 관통 구멍(10)에 상기 승강 장치(3)에 설치된 지지핀(30)이 관통하고 있다. 이 지지핀(30)도 상기 지지핀(20)과 마찬가지로 본체부와 이것에 착탈할 수 있도록 된 선단부로 구성되어 있다. On the other hand, a through hole 10 is formed in the hot plate 1 in the thickness direction, and the support pin 30 provided in the elevating device 3 passes through the through hole 10. Like the support pin 20, this support pin 30 is comprised from a main body part and the tip part which can be attached or detached to it.

또한, 도시예에서는 지지핀을 반송 장치 또는 승강 장치에 적용한 예를 나타내었지만, 이것에 한정되지 않고, 기판의 하면을 지지하는 부재라면, 본 발명에 따른 지지핀을 적용할 수 있다. In addition, although the example which applied the support pin to the conveying apparatus or the lifting apparatus was shown in the example of illustration, if it is a member which supports the lower surface of a board | substrate, the support pin which concerns on this invention can be applied.

아래의 표는 플라스틱 소결 다공질체로 이루어지는 선단부의 재료로서, 초고분자 폴리에틸렌을 이용하고, 기공률을 변화시킨 경우의 핀 흔적의 유무를 조사한 결과이다. 이 표로부터 기공률은 20% ~ 60%가 바람직하다는 것을 알 수 있다. The table below shows the results of investigating the presence or absence of traces of pins in the case where the porosity is changed by using ultra-high molecular polyethylene as the material of the tip portion made of the plastic sintered porous body. From this table, it can be seen that the porosity is preferably 20% to 60%.

[표 1]TABLE 1

기공률Porosity 20%20% 30%30% 40%40% 60%60% 핀 흔적 정도Pin trace degree △△ ○○ ○○ ○○

△ : 핀 흔적 약간 있음, ○ : 핀 흔적 없음△: slight trace of pin, ○: no trace of pin

본 발명에 따르면, 기판을 지지하는 핀을 플라스틱 소결 다공질체로 함으로써 핀 자체에 열이 응집되는 일이 없어지고, 온도 편차가 기판에 전사되는 일이 없어진다. 또한, 플라스틱제로 함으로써 섬유와 비교하여 미세한 파티클의 발생을 억제할 수 있다. According to the present invention, the pin supporting the substrate is made of a plastic sintered porous body so that heat is not aggregated on the fin itself, and the temperature deviation is not transferred to the substrate. Moreover, by making it plastic, generation | occurrence | production of a fine particle can be suppressed compared with a fiber.

이와 같이, 온도 편차에 의해 기판에 핀 흔적이 생길 우려가 적으므로, 기판이 대형화하더라도 기판 주위뿐만 아니라 기판 중앙을 핀에 의해 지지할 수 있다. As described above, since traces of pins are less likely to occur in the substrate due to temperature variation, the pins can be supported not only around the substrate but also in the center of the substrate even when the substrate is enlarged.

Claims (3)

기판의 하면을 지지하기 위해, 반송 장치나 승강 장치에 설치된 지지핀으로서, 이 지지핀은 적어도 기판의 하면에 접하는 구(球) 형상 선단부를 플라스틱 소결 다공질체로 한 것을 특징으로 하는 기판 지지핀.A support pin provided in a conveying device or a lifting device for supporting a lower surface of a substrate, wherein the supporting pin has a spherical tip portion at least in contact with the lower surface of the substrate as a plastic sintered porous body. 제 1 항에 있어서, 상기 플라스틱 소결 다공질체의 기공률은 20% 이상 60% 이하인 것을 특징으로 하는 기판 지지핀.The substrate support pin of claim 1, wherein a porosity of the plastic sintered porous body is 20% or more and 60% or less. 제 1 항 또는 제 2 항에 있어서, 상기 플라스틱 소결 다공질체는 초고분자 폴리에틸렌으로 이루어지는 것을 특징으로 하는 기판 지지핀.3. The substrate support pin according to claim 1 or 2, wherein the plastic sintered porous body is made of ultra high molecular polyethylene.
KR1020050124608A 2004-12-16 2005-12-16 Supporting pin for substrate KR20060069335A (en)

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JPJP-P-2004-00364460 2004-12-16
JPJP-P-2005-00218116 2005-07-28
JP2005218116A JP2006196862A (en) 2004-12-16 2005-07-28 Supporting pin for substrate

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JP2008112902A (en) * 2006-10-31 2008-05-15 Mitsubishi Heavy Ind Ltd Supporting method and supporting structure of substrate
JP4870734B2 (en) * 2008-08-19 2012-02-08 ＡｖａｎＳｔｒａｔｅ株式会社 Glass plate conveyor
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JP2002173250A (en) * 2000-12-07 2002-06-21 Nitto Denko Corp Suction carrying method and suction machining method
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KR100824305B1 (en) * 2006-12-22 2008-04-22 세메스 주식회사 Support pin, unit for supporting a substrate and apparatus for cleaning the substrate having the same

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