JPH10107131A - Suction table and element thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent impurities from adhering to an electronic part to deteriorate it in electric properties, and to discharge electrostatic charge of a charged electronic part to an element so as to prevent electrostatic charge from remaining in the electronic part, by a method wherein the element is formed of material high in corrosion resistance and electrical conductivity. SOLUTION: A suction table is equipped with four ring-shaped elements 2 which are formed of conductive high-molecular material and high in corrosion resistance and a body 3 formed of stainless steel plate to support the elements 2. The elements 2 are inserted into recessed grooves 4 cut in the upper surface of the body 3 so as to make their upsides flush with the upper surface of the body 3 respectively and bonded to the body 3 in spots with conductive heat- resistant adhesive agent. As mentioned above, the elements 2 are high in resistance to corrosion and conductivity, so that impurities are prevented from adhering to an electronic part, electric charge of the charged electronic part is discharged through the elements 2 as conductor, and electric charge is prevented from remaining on the electronic part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction table used in a process of manufacturing an electronic component such as a semiconductor and the like, and to a suction table and an element thereof for sucking and fixing the electronic component. In particular, make sure that no impurities that adversely affect the electrical characteristics are attached.
The present invention relates to a suction table capable of preventing electrification of an electronic component and an element thereof.

[0002]

2. Description of the Related Art In a manufacturing process of electronic parts, a suction table is used for sucking and supporting a silicon wafer, a printed wiring board, a thin film member and the like. Since the surface of this silicon wafer is shaved by a grinder, the thickness of the wafer is extremely thin depending on the device. By the way, there has been proposed a suction table in which a metal table having a communication hole is supported by a body, and the metal table is connected to a suction source through a suction path formed in the body. .

[0003] However, in this case, as a result of the concentration of the suction location at the location of the communication hole in the metal table, particularly,
When a thin silicon wafer, a printed wiring board, or a thin film member is sucked, these may be deformed at the sucked portion, and a problem may occur such that it is difficult to form an accurate and precise pattern.

Therefore, as a suction table, a porous element is supported by a body, and this element is communicated with a suction source via a suction passage formed in the body, thereby increasing the suction area and communicating holes. There has been proposed a device which is fine and prevents a printed wiring board or a thin film member from being deformed at a suction portion when the device is sucked.

[0005] The surface of the body for receiving the electronic components is coated with ceramics, laminated with ceramic plates, or the entire body in order to prevent impurities, particularly impurities that change the electrical characteristics, from adhering to the electronic components. Is formed of ceramic.

[0006] As the element, there is one obtained by sintering irregularly shaped powder, granular powder or the like, and ceramic is used as the material.

[0007]

When an electronic component is sucked and supported by using a suction table formed of such an element made of a ceramic sintered body, for example, a step of attaching a protective film to a silicon wafer is performed. In this case, the film is attached to the wafer while being pressed with a roller. At this time, static electricity (charge) is generated, and the charge may remain on the electronic component.

In addition, in particular, for example, after a protective film is adhered to a silicon wafer, static electricity is generated even when the protective tape is peeled off from the surface of the wafer in a peeling step, and electric charges often remain on electronic components. is there.

As described above, when the electric charge remains, the circuit may be short-circuited due to the influence of the residual electric charge. Therefore, it is necessary to prevent static electricity (electric charge) from remaining.
For the removal of the electric charge, a method of neutralizing with an ionizer or the like is usually used.

However, when neutralizing with an ionizer or the like, the apparatus is complicated and expensive, and when the neutralization is insufficient or the influence of ionized gas, charges remain, There is a fatal defect that a short circuit may occur due to the influence of the residual charge.

SUMMARY OF THE INVENTION The present invention solves the above technical problem, and prevents the deformation of a silicon wafer, a printed wiring board, a thin film member and the like by sucking and fixing an electronic component over almost the entire surface, thereby achieving accurate and precise. It is an object of the present invention to provide a suction table and an element thereof that can form a pattern or the like, prevent an impurity from adhering to an electronic component, and prevent charging of the electronic component.

[0012]

In order to achieve the above object, a suction table according to the present invention has a porous element and a suction passage for holding the element and communicating the element with a suction source. A suction table including a body, wherein the element is formed of a corrosion-resistant and conductive material.

In the present invention, the term "corrosion resistance" means that there is no rust or the like and no impurities are generated in electronic parts, particularly, impurities which adversely affect the electrical characteristics of electronic parts. In addition, it is possible to prevent impurities from adhering to the electronic component.

In the present invention, the term "conductive" refers to the ability to transfer a charge from a charged object in contact with an object to another object different from the charged object, and that the element has this conductivity. Accordingly, the electric charge carried by the electronic component is released by using the element as a conductor, and the electric charge is prevented from remaining on the electronic component.

Hereinafter, the suction table of the present invention will be described in more detail. In the present invention, examples of the element having corrosion resistance and conductivity include an element formed of a conductive polymer material and an element formed of a metal sintered body made of a corrosion-resistant metal powder. it can.

In the case of an element formed of a conductive polymer material, the conductivity, the diameter of the communication hole, and the porosity (opening ratio) depend on the mixing ratio of the synthetic resin and the conductive material or the method of forming the communication hole. In addition to this, it is possible to obtain an excellent element in which the distribution of the communication holes is very uniform and the element can be easily controlled.

Further, when a conductive polymer material is used as a material for the element, the element can be formed at a lower temperature than when sintering a metal, so that the element can be manufactured safely. In addition, it is advantageous to provide appropriate elasticity, so that the electronic component to be attracted can be softly contacted.

The conductive polymer material used in the present invention is not particularly limited as long as it is composed of a combination of a conductive material and a polymer material.

As the polymer material used for the conductive polymer material, any polymer material such as a synthetic or natural rubber polymer material, a thermoplastic resin, a thermosetting resin and the like can be mentioned.

Examples of the polymer material include synthetic or natural rubber polymer materials, polyolefin resins, acrylic resins, polyester resins, polyamide resins, polyacetal resins, polycarbonate resins, modified polyphenylene oxide resins, polysulfone resins, and polyphenylene oxides. Resin, polyphenylene sulfide resin, polyamide-imide resin, polysulfide resin, bismaleimide-triazine resin, aromatic polyamide resin, aromatic polyester resin, epoxy resin, unsaturated polyester resin, phenol resin, polyurethane resin,
Examples thereof include a polyimide resin, a melamine resin, a diacrylate resin, and an alkyd resin.

If necessary, a curing agent, a curing accelerator or various stabilizers, and a solvent or the like may be added to the polymer material.

Among these polymer materials, a thermosetting resin composition obtained by blending a curing agent or a curing accelerator with a thermosetting resin has a high heat resistance, handling property, chemical resistance, moisture resistance, and mechanical properties. It is preferable from the viewpoint of strength, durability, dimensional stability, friction resistance, etc., and particularly, heat resistance, handleability, chemical resistance, moisture resistance, mechanical strength, durability, dimensional stability, friction resistance, price, etc. It is desirable to use an epoxy resin composition, polyester, or unsaturated polyester for reasons such as excellent resilience.

Particularly preferred examples of the conductive polymer material include a material formed by melting and kneading a conductive material such as a metal powder and a carbon powder and a thermoplastic resin, and an uncured thermosetting resin composition and a conductive resin. What formed by mixing materials is mentioned.

When the electronic component sucked by the suction table is heated, the rubber-based polymer material having a softening point of 100 ° C. or more is used to prevent the electronic component from being fused to the suction table. It is preferable to use a thermoplastic resin or a thermosetting resin.

The conductive material used in the present invention is not particularly limited as long as it is formed of a conductive material. Specifically, for example, the conductive material is formed of a conductive material such as metal or carbon. It may be a granular material or a needle-like or linear powder, but the size is not particularly limited as long as it is 750 μm or less, particularly 0.05 to 500 μm.

In this case, when the metal powder is blended with the polymer material, the metal powder is coated with the polymer material, so that a metal powder such as zinc powder or iron powder which is easily oxidized in the air can be used. In particular, it is desirable to use metal powder which is relatively stable or stable in the air. Specific examples of this kind of metal powder include aluminum powder, copper powder, nickel powder, chromium powder, titanium powder, cobalt powder, and vanadium. Powder, manganese powder, 13-chrome steel powder, brass powder, Hastelloy powder, stainless steel powder, gold powder or silver powder.

The mixing ratio of the polymer material and the conductive material is in the range of 5 to 300 parts by weight, preferably 15 to 150 parts by weight, particularly preferably 30 to 120 parts by weight, based on 100 parts by weight of the polymer material. When the compounding ratio of the conductive material is less than 5 parts by weight, the compounding amount is too small and a desired static electricity removing effect may not be obtained. If the amount is more than 100 parts by weight, the effect of removing static electricity is limited, and the balance of the whole composition may be lost, resulting in a decrease in mechanical strength, durability and heat resistance, which is not preferable.

The method of forming the element made of the conductive polymer material is not particularly limited. Specifically, for example, a molten mixture of the polymer material and the conductive material is poured into a mold having a cavity having a predetermined shape. A method of cooling and solidifying the material, or pouring an uncured conductive polymer material into a mold having a cavity of a predetermined shape, and pressing and heating the material, or curing the material by irradiation with ultraviolet rays or electron beams. A method of pouring a conductive polymer material into a mold having a cavity of a predetermined shape, irradiating the mold with irradiation radiation, and curing the same, when using a thermosetting resin such as an epoxy resin, a B-stage conductive prepreg is used. After forming, a plurality of these are laminated and heated and pressed and bonded to form a B-stage conductive laminate, which is further formed into a predetermined shape by machining such as cutting and polishing. That way, and the like.

It is necessary that the obtained element is a porous body having a communication hole penetrating through the front and back surfaces thereof. In the curing process, foaming, a method of communicating, softening and stretching the element,
Furthermore, a method of forming a filler into a porous body by eluting a soluble component with water, an acid, an alkali or an organic solvent, etc., by using an ultrafine needle, drilling, needle processing or punching processing (punching) on the element. A method of mechanically piercing is exemplified.

In order to foam the conductive polymer material, a foaming agent may be blended with the polymer material, and the blending ratio varies depending on the type of the polymer material and the foaming agent used. 0.05 for 100 parts by weight of molecular material
It is preferably in the range of 15 to 15 parts by weight. When the compounding ratio of the foaming agent is less than 0.05 part by weight, the conductive polymer material cannot be sufficiently foamed, and there is a possibility that the communication hole is not formed. If it exceeds, the foaming becomes excessively large and the mechanical strength is lowered, and the required durability may not be obtained.

Of course, the conductive polymer material has various properties for enhancing other properties such as weather resistance, corrosion resistance, heat resistance, oxidation resistance, alkali resistance, acid resistance or ultraviolet resistance. It is preferable to add additives.

The mixing ratio of this additive is determined by the polymer material 10
The amount is preferably in the range of 0.5 to 15 parts by weight with respect to 0 parts by weight. When the blending ratio of this additive is less than 0.5 part by weight, the amount of the additive is too small to obtain a desired effect. On the other hand, when the amount exceeds 15 parts by weight, the effect is limited, and the balance of the whole composition is lost, and conversely, the mechanical strength and the durability, the heat resistance are reduced, and the cost is increased. It is not preferable because there is a risk of such as.

Further, the conductive polymer material has handleability,
A reinforcing material may be blended or laminated for the purpose of improving heat resistance, chemical resistance, moisture resistance, mechanical strength, durability, dimensional stability, friction resistance and the like.

The reinforcing material is not particularly limited as long as it is fibrous. Specifically, for example, inorganic fibers such as glass fiber, carbon fiber, ceramic fiber and boron fiber, natural fibers, and recycled fibers At least one selected from fibers, semi-synthetic fibers or synthetic fibers, or a mixed fiber thereof, among them, among these, the most durable, mechanical strength, durability, dimensional stability, friction resistance, etc. It is desirable to use glass fiber, ceramic fiber, or the like, which can significantly improve the performance and can be obtained at a reasonable price.

The method of using the reinforcing material is not particularly limited. Specifically, for example, a fiber bundle, a long fiber, a short fiber or a filament may be blended, or a non-woven fabric, a woven fabric, a mat, It is preferable to use a cloth such as a woven cloth or a nonwoven cloth from the viewpoints of easy handling, strength non-directionality and the like, including various forms such as laminating cloth such as cloth or knit.

The reinforcing material is used for the purpose of ensuring that the handling properties, heat resistance, chemical resistance, moisture resistance, mechanical strength, durability, dimensional stability, friction resistance, etc. are improved.
Its basis weight is in the range of 10 to 500 g / m ² , especially 30 to ² g / m ^2.
It is desirable to be in the range of 00 g / m ² .

Further, the conductive polymer material may be improved in mechanical strength and durability, dimensional stability, body friction, etc., and the cost may be reduced by reducing the amount of the polymer material used. For the purpose, it is desirable to add an organic filler such as wood flour, wheat flour or a thermosetting resin filler, or an inorganic filler, particularly an inorganic filler.

The inorganic filler is not particularly limited, but specific examples thereof include calcium carbonate, fused silica, raw silica, silica such as Aerosil and white carbon, zonotolite, sepiolite, talc, kaolin, and the like. Mica such as muscovite and phlogopite, as well as biotite, aluminum hydroxide, magnesium hydroxide, alumina, magnesia, titanium oxide, zinc oxide, silicon carbide,
Silicon nitride, potassium titanate, baryta, basic magnesium sulfate, aluminum borate, or the like can be used.

These inorganic fillers are appropriately selected in consideration of compatibility with a polymer material, the ability to be filled in a required amount, and improvement of various properties by addition.

The amount of the inorganic filler is not particularly limited as long as various properties such as required mechanical strength and durability, dimensional stability and friction resistance can be obtained. Although it varies depending on the type of the polymer material and the inorganic filler to be obtained, it is generally in the range of 10 to 150 parts by weight, particularly preferably 3 to 100 parts by weight, based on 100 parts by weight of the polymer material.
An inorganic filler in a range of 0 to 100 parts by weight is blended.

When the compounding ratio of the filler is 1
If the amount is less than 10 parts by weight with respect to 00 parts by weight, there is no point in adding a small amount of the compound, and desired properties such as abrasion resistance and durability and polishing efficiency cannot be improved. If it exceeds 150 parts by weight, on the contrary, the absolute amount of the polymer material becomes insufficient, and the mechanical strength and durability may be lowered.

By the way, in the present invention, an element having a required thickness and shape is formed of a polymer material, a surface such as polishing is applied, and a conductive paint is applied on the surface and dried. Then, a communication hole is formed uniformly over the entire surface, or an element having a required thickness and shape is formed of a polymer material, and the communication hole is formed uniformly over the entire surface. Polishing and other processing,
A conductive paint applied and dried on the surface, or a transparent conductive film such as tin oxide or ITO film printed on the surface of the element can be applied to the element formed of the conductive polymer material. included.

The porous element according to the present invention has a communicating hole having a diameter of 5 to 2000 μm, preferably 10 to 1500 μm, and an opening ratio of 7.5.
It may be set in the range of 80%, preferably 10% to 65%.

Next, in the case of an element made of a metal sintered body, it is formed by pressing metal powder as a raw material into a mold, melting the surface of the metal powder by heating, and fusing the metal powder to each other. You.

Even if the metal powder as the raw material is irregular shaped powder,
Granular powder or acicular or linear powder may be used, but the granular powder controls the diameter of the communication hole formed in the metal sintered body by selecting its particle size. This is advantageous because it can be easily performed and the distribution of the communication holes can be formed uniformly, and in the case of acicular or linear powder, the diameter of the communication holes can be easily adjusted by selecting the wire diameter. In addition, it is advantageous that the distribution of the communication holes can be formed uniformly by aligning the directions of the lines.

By the way, the silicon wafer has its surface,
For example, since the contact surface side of the element is shaved by a grinder, the surface is smooth, and as a result, in order to effectively perform suction, the surface flatness of the element formed of a metal sintered body is required, In addition, since the protective tape is peeled off after the tape for peeling is attached with a roller, the surface smoothness of the element becomes more important as the wafer becomes thinner when the tape is attached. Accordingly, there is an advantage that the surface can be formed smoothly at low cost and easily.

The kind of the metal constituting the metal sintered body is not particularly limited, but it is particularly preferable to use a metal which is relatively stable or stable in the air. For example, steel, copper, nickel, chromium, titanium, cobalt, vanadium, manganese, 13-chrome steel, brass, hastelloy, stainless steel, gold or silver, etc., among these, adversely affect the electrical characteristics of electronic components In addition, it is desirable to use inexpensive stainless steel, which is generally excellent in corrosion resistance and workability, and is generally made of a material.

Using a metal powder formed of these metals,
In producing the metal sintered body, the size of the metal powder is in the range of 10 to 750 μm, preferably 20 to 650 μm.
μm, particularly preferably in the range of 50 to 500 μm, and the metal sintered body has a communicating hole having a diameter of 20 to 2000 μm, preferably 50 to 150 μm.
The aperture ratio may be set in the range of 0 μm and the aperture ratio is set to 7.5 to 80%, preferably 10 to 65%.

By the way, the body of the present invention may have any structure as long as it supports the element and has a suction path for communicating the element with the suction source inside. The conductive body is used to further discharge the electric charge transferred to the element. And it is more preferable to ground to a body such as an electronic component manufacturing device or an electronic component transport device that supports the body.

Here, when a conductive body is used, the body may be formed of an airtight solid body, or may be formed of an air-permeable porous body such as a foam or a sintered body. It is. The material may be any material having conductivity, such as a metal or a conductive polymer material.

The type of the metal is not particularly limited, and specific examples thereof include the above-mentioned ones. Among them, the metal does not adversely affect the electrical characteristics of the electronic component. It is desirable to use inexpensive stainless steel, which has excellent corrosion resistance and workability, and is generally made of a material. By the way, the above-mentioned thing is mentioned as a conductive polymer material.

The suction path formed inside the body is
In order to prevent a reduction in vacuum suction force, it is preferable that the suction source is configured to communicate and suck only through the element. Therefore, when the body is formed of an airtight body, the suction path may be perforated by drilling, punching, laser processing, or the like, or the suction path may be formed by casting or the like. Is formed of a porous body having air permeability, an airtight hollow pipe or duct is provided in the body to make the suction passage airtight from the surroundings, and this hollow pipe or duct is provided. It is preferable to form a suction path in the space inside.

Of course, the external shape of the body of the present invention is not particularly limited, and may be appropriately designed according to the application. However, in order to reduce the size and thickness, the concave portion into which the element is inserted on one side is used. Is preferably formed in a concave plate shape. Also, the contour shape and size of the surface facing the electronic component to be attracted need not be the same as the contour shape of the electronic component, and may be any shape and size such as a circle, a rectangle, and a square.

The shape of the concave portion may be any shape as long as it corresponds to the shape of the electronic component to be attracted. For example, it may be formed in a square, rectangle, circle, ring, polygon ring, cross, star, etc. A plurality of concave portions may be provided in an appropriately dispersed manner. However, if the area where the concave portion is provided is larger than the size of the electronic component to be sucked, the suction source communicates with the atmosphere via the element and the suction force is significantly reduced. Is preferred.

When a plurality of recesses are provided in a distributed manner, the suction paths are made independent for each recess or an appropriate number of recesses, and a plurality of types of electronic components having different sizes are attached to one suction table. When handling in the area, the connection between the suction path and the suction source of a part that communicates with the element protruding outside the area of the electronic component to be sucked is shut off by, for example, a valve, and the outside of the area where the small electronic component is sucked. It is possible to prevent the suction source from communicating with the atmosphere via the element and thereby prevent the suction force from being reduced.

When the concave portion is provided as described above,
The suction path may be, for example, a straight line extending from the concave portion in the plate thickness direction or the radial direction, or an L-shape bent in the plate thickness direction in the radial direction or in the radial direction in the plate thickness direction. The crank type may be bent in the radial direction from the direction, further bent in the plate thickness direction from the radial direction, or bent in the plate thickness direction from the radial direction, and further bent in the plate thickness direction in the radial direction.

In the present invention, the holding of the above-mentioned element to the body is not particularly limited as long as the structure does not hinder the suction of the element. The element may be simply placed on the body by being sucked into the body, or only the outer peripheral end face of the element may be bonded to the body with an adhesive, or the back surface of the element may be partially conductive on the body. It may be bonded with an adhesive.

In this case, in order to partially adhere the back surface of the element to the body with a conductive adhesive, the element may be adhered to the body in a dot-like, annular or intermittent and annular manner.

Also, on the surface of the body that contacts the electronic parts,
For example, in order to protect the surface, it may be coated with a polymer material, ceramic, or the like, or may be laminated.

Next, the element for a suction table according to the present invention is characterized in that the element for a suction table made of a porous material has corrosion resistance and conductivity in order to achieve the above object. It is assumed that.

This prevents impurities, particularly impurities that adversely affect the electrical characteristics, from adhering to the electronic component, and also transfers the charged charge of the electronic component to the element.
It is possible to prevent charges from remaining on the electronic component.

A more detailed description of the elements of the suction table of the present invention will be omitted to avoid duplication.

[0063]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A suction table and its elements according to one embodiment of the present invention will be specifically described with reference to the drawings.

As shown in the plan view of FIG. 1 and the cross-sectional view of FIG. 2, the suction table according to one embodiment of the present invention comprises four annular conductive polymers for sucking the silicon wafer 1. Elements 2 made of material and these elements 2
And a body 3 made of a stainless steel plate that supports
Each element 2 is inserted into an annular groove 4 recessed in the upper surface of the body 3 so that its upper surface is substantially flush with the upper surface of the body 3, and is made of a conductive material such as a conductive epoxy adhesive. -It is point-like bonded to the body 3 with a heat-resistant adhesive.

However, when the elements 2 are sucking the silicon wafer 1, the elements 2 may be inserted into the grooves 4 so that the upper surface of each element 2 projects above the upper surface of the body 3. When the upper surface of the body 3 has conductivity, the charge of the silicon wafer 1 moves to the body 3 by the contact of the silicon wafer 1 with the body 3, and the charge remaining on the silicon wafer 1 can be prevented. The element 2 may be inserted into the groove 4 such that the upper surface is lower than the upper surface of the body 3.

In the body 3, suction holes 5 penetrating from the groove bottom of each groove 4 to the back surface are formed in each of the grooves 4 in the circumferential direction.
It is formed at a total of 16 locations, 4 locations at 0 ° intervals. These suction holes 5 are connected to suction sources 7 independently of each other for each of the four suction holes 5 of each groove 4 via a branch pipe 6, and open and close a valve 8 interposed in each branch pipe of the branch pipe 6. Thus, the connection between the concave groove 4 and the suction path 5 and the suction source 7 can be connected and disconnected independently of the other concave groove 4 and the suction path 5.

Thus, for example, when sucking a 3-inch silicon wafer 1, only the element 2 having the smallest diameter is connected to the suction source 7, and when sucking a 5-inch silicon wafer 1, the inside of the element 2 is sucked. The three elements 2 are communicated with a suction source 7 and an 8 inch silicon wafer 1
When all the elements 2 are sucked,
The silicon wafer 1 is uniformly adsorbed over the entire surface by communicating with the
The suction source 7 is prevented from communicating with the atmosphere via the element 2 located outside of the suction source 7, and a reduction in suction force due to the communication of the suction source 7 with the atmosphere is prevented.

The element 2 has an apparent thickness of 0.1.
8mm glass woven cloth (Asahi Shovel, part number AS76
28/450) and a laminate comprising a conductive epoxy resin composition layer described below.

First, in the resin compounding step, an epoxy resin (trade name: Epicoat 10 manufactured by Yuka Shell Epoxy Co., Ltd.) was used.
01) 3.5 parts by weight of dicyanamide as a curing agent (trade name: DICY, manufactured by Nippon Carbide Co.) and 0.2 parts by weight of imidazole as a curing accelerator (trade name: 2PHZ-CN, manufactured by Shikoku Chemicals) based on 100 parts by weight. 85 parts by weight of stainless steel powder (SUS304 particle size 120 μm) as a conductive material and 15 parts by weight of calcium carbonate powder as an inorganic filler,
As a solvent, 120 parts by weight of methyl ethyl ketone was blended and uniformly mixed to obtain a solution of a conductive epoxy resin composition.

Next, in a prepreg manufacturing process, the solution of the conductive epoxy resin composition was mixed at a solid content weight ratio of 1: 1.
After impregnating the reinforcing material so that
For 10 minutes to form a B-stage glass epoxy prepreg.

Thereafter, in the laminating step, the glass
Stacking 10 sheets of epoxy prepreg, 20kg / c
The resultant was heated and cured at a temperature of 150 ° C. for 90 minutes under a pressure of m ² to obtain a conductive laminate.

Next, the conductive laminate was cut into a predetermined shape by a machining process such as machining or laser machining, in this case, machining, and a communication hole was formed. At this time,
The average diameter of the communicating holes is 500 μm and the opening ratio is 35
% Of the element 2 of the present invention.

When the element 2 is used, even if the silicon wafer 1 is charged, the electric charge moves from the silicon wafer 1 to the body 3 due to the conductivity of the element 2, so that the electric charge does not remain on the silicon wafer 1. It was later recognized that short circuit could be reliably prevented by residual charge.

Further, by using the conductive polymer material, the conductivity, the diameter of the communication hole, the porosity (opening ratio), and the like can be easily controlled by the composition and the method of forming the communication hole. An element having a uniform distribution can be obtained, and furthermore, the element can be manufactured at a lower temperature than when sintering a metal. As a result, the element can be manufactured safely, and an element having a required shape can be obtained at extremely low cost. ,
In addition, by giving appropriate elasticity, the electronic component to be sucked can be softly contacted.

Further, in this embodiment, since the body 3 is formed of a stainless steel plate, the electric charge moved to the lower surface of the element 2 further moves to the lower surface of the body 2, so that the electric charge remaining on the silicon wafer 1 is reduced. This can more reliably prevent the occurrence of a short circuit in the circuit due to residual charges.

The body 3 is formed in the shape of a donut plate. A center table 10 for lifting the silicon wafer 1 higher than the upper surface of the body 3 is inserted through the center hole so as to be able to move up and down. Is formed with a circular concave portion 11, and a disc-shaped element 12 is laminated in the concave portion 11. Further, a suction hole 13 for communicating the element 12 with the suction source 7 is formed in the center table 10 from the bottom of the concave portion 11.

After the upper surface of the center table 10 is lifted higher than the upper surface of the body 3, the silicon wafer 1 is placed on the center table 10. Put on top. Further, after stopping the suction of the silicon wafer 1 to the body 3, it rises while sucking, and after sucking the silicon wafer 1, the upper surface thereof is lifted higher than the upper surface of the body 3 so that the center of the silicon wafer 1 is lifted. It is configured to wait for removal from the table 10.

In another embodiment of the present invention, each of the elements 2 and 12 is made of a sintered metal obtained by sintering stainless steel powder (SUS304 having an average particle size of 120 μm). In this embodiment, except for the fact that the elements 2 and 12 are inserted into the concave grooves 4 or the concave portions 11 so that the upper surfaces thereof do not protrude upward from the upper surface of the body 3 or the center table 10, other configurations, actions or operations are not performed. Since the effects are the same as those of the above-described embodiment, the description thereof will be omitted to avoid duplication.

In this case, the communicating holes of the elements 2 and 12 have a diameter of 20 to 500 μm and an opening ratio of 20 to 35 μm.
%, A porosity of 30%, and a surface lapping finish.

When the elements 2 and 12 are used, even if the silicon wafer 1 is charged, the charges move from the silicon wafer 1 to the body 3 due to the conductivity of the elements 2 and 12, as in the above embodiment. As a result of the elimination of charges remaining on the silicon wafer 1, it was recognized that short circuits could be reliably prevented later by the remaining charges.

[0081]

As described above, according to the suction table of the present invention, since the element is corrosion-resistant and conductive, impurities that deteriorate the electric characteristics do not adhere to the electronic components and the element is adsorbed to the element. The electrostatic charge carried by the electronic component is moved from the electronic component to the element and released,
As a result of preventing electrostatic charges from remaining on electronic components,
This has the effect of preventing the short circuit of the circuit due to the residual charge of the electronic component.

Further, in the suction table of the present invention, since the electrostatic charge can be prevented from remaining on the electronic parts, it is not necessary to spray ionized gas to the electronic parts to neutralize the electronic parts. In addition to being inexpensive, the effect of reliably preventing the adverse effects caused by insufficient neutralization and the like can be obtained.

Further, in the suction table of the present invention,
When the suction area is large and the communication holes are fine and the electronic components are suctioned, the electronic components are prevented from being deformed at the suction position, so that an accurate and precise pattern or the like is formed.

The element for the chuck according to the present invention is corrosion-resistant and conductive, so that impurities which deteriorate the electric characteristics do not adhere to the electronic parts, and that the short circuit of the circuit due to the residual charges of the electronic parts is prevented. Also, there is no need to spray ionized gas onto the electronic component to neutralize it, and the device is simple and inexpensive, and has an effect that an accurate and precise pattern or the like is formed on the electronic component. is there.

[Brief description of the drawings]

FIG. 1 is a plan view of a suction table according to an embodiment of the present invention.

FIG. 2 is a sectional view of a suction table according to one embodiment of the present invention.

[Explanation of symbols]

 2 element 3 body 10 center table 11 element

Claims (4)

[Claims] 1. A suction table comprising a porous element and a body having a suction passage for holding the element and communicating the element with a suction source, wherein the element is corrosion-resistant and conductive. A suction table characterized by being formed of: 2. The suction table according to claim 1, wherein the element is formed of a conductive polymer material. 3. The suction table according to claim 1, wherein the element is formed of a corrosion-resistant metal sintered body. 4. An element for a suction table, wherein the element is a porous element for a suction table, the element being corrosion-resistant and conductive.