JP2010056467A - Jig for conveyance - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a jig for conveyance satisfactorily adapted to application to convey a substrate or the like under a clean environment by suppressing particle generation using a carbon fiber reinforced resin composite material while utilizing its merit. <P>SOLUTION: A jig for conveyance is constructed by processing a laminate plate 4 obtained by laminating a plurality of fiber reinforced prepreg sheets 4a, and capable of holding, in direct contact, a plate shaped article in a device for conveyance for conveying plate shaped articles. The jig 1 for conveyance is adapted such that an electrostatic disappearing layer 5 is formed on the surface of the laminate plate 4, and an end surface protective layer 6 is formed on a processing end surface of the laminate plate 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention is an automatic conveyance device that moves and unloads a plate-shaped conveyance object such as a semiconductor wafer or a glass substrate for liquid crystal as a component that directly contacts the conveyance object by holding the plate-shaped object or placing a plate-shaped object. More particularly, the present invention relates to a transfer jig that is optimal for transferring a semiconductor device such as a semiconductor wafer.

  In order to increase the processing efficiency, the size of transported objects such as substrates has increased in recent years in order to transport semiconductor wafers and liquid crystal glass substrates (hereinafter referred to as “substrates”). ing. Along with this, a hand for a transport device has a bending rigidity equivalent to that of a metal member used so far, and is lightweight and easy to handle to support these transported materials (hereinafter referred to as “CFRP”). (Also referred to as Patent Documents 1 and 2).

  In such a transfer jig, the substrate or the like may cause a serious malfunction when it is made into a product if conductive impurities or foreign matters (hereinafter referred to as “particles”) generated during transfer adhere to the substrate. For this reason, it is important that static electricity hardly occurs, outgas resistance, and dust resistance.

  In these respects, metal members such as aluminum and ceramics are generally more suitable than CFRP members because they can suppress the generation of particles. However, as the use of CFRP is expected to expand, carbon from CFRP There is a demand for a material that does not drop off fibers or powder off carbon fibers from the end face and suppresses the generation of particles.

Therefore, the present inventors have already filed a patent application (Japanese Patent Application No. 2007-267556), finding that the generation of particles from the conveying jig can be suppressed by forming a conductive coating layer on the surface.
JP-A-8-288364 JP 11-354608 A

  However, the above-mentioned technology is excellent in that it can suppress the adhesion of particles, but since the inside of the clean room is dry, static electricity is easily generated on the surface of the transfer jig, and a metal such as aluminum is used. In addition, in the case of providing conductivity as described in the above Japanese Patent Application No. 2007-267556, there are cases where electrostatic damage of the object to be processed due to discharge occurs as described below.

  For example, in the semiconductor wafer processing process in the semiconductor manufacturing industry, an impurity doping process by ion implantation, a CVD (Chemical Vapor Deposition) film forming process by plasma, a cleaning, a high-speed rotary drying process, etc. are performed on the semiconductor wafer. A semiconductor element is formed. In these processes, the semiconductor wafer as an insulator is charged with static electricity of several kV or more. In addition, since the semiconductor wafer and the transfer jig are in direct contact with each other, the contact resistance value is reduced and the contact capacitor capacity is reduced because the conductive layer of the transfer jig is electrically short-circuited directly to the ground. Becomes smaller.

  As a result, when a semiconductor wafer charged to several kV or more is transported, it is instantaneously discharged, the discharge current increases, and the semiconductor element may be destroyed.

  Therefore, an object of the present invention is to control the discharge current value from an article such as a semiconductor wafer to a predetermined range by controlling the surface resistivity of the contact member to a predetermined range when the article such as a semiconductor wafer is conveyed. An object of the present invention is to provide a conveying jig capable of preventing problems such as destruction of a semiconductor element due to electrostatic damage caused when static electricity charged on an article such as a semiconductor wafer is discharged.

  As a result of intensive studies, the present inventors have suppressed the generation of particles from the conveying jig and charged the object to be processed by covering the surface of the conveying jig with an electrostatic dissipation layer having a predetermined surface resistivity. The present invention has been completed by finding that the discharge current of static electricity can be controlled to a predetermined value or less to prevent the occurrence of static electricity damage to the object to be processed due to discharge.

That is, the conveying jig of the present invention is formed by processing a laminated plate in which a plurality of fiber-reinforced prepreg sheets are laminated, and can directly hold and hold the plate-like object in a conveying device that conveys the plate-like object. A transfer jig that can have a surface resistivity of 1 × 10 ⁵ Ω / sq. 1 × 10 ¹⁰ Ω / sq. It is characterized by having an electrostatic dissipation layer having an electrostatic dissipation property of less than.

  At this time, the static elimination layer is coated with a resin composition containing at least one powder or fibrous material selected from metal, carbon and conductive ceramics, and the surface resistance after curing thereof It is preferable that the rate has the characteristics within the predetermined range.

In general, if a material is classified according to its electrical properties, it can be divided into conductivity, electrostatic dissipation, and electrical insulation. The conductive material is 1 × 10 ⁵ Ω / sq. It has a lower surface resistivity and discharges static electricity very quickly. This discharge rate is fast enough to create surges that damage electrical components or cause electrical shock to individuals. The electrically insulating material is 1 × 10 ¹⁰ Ω / sq. The surface resistivity is higher than that, and electricity does not flow, so static electricity accumulates on the surface and attracts particles. The vanishing material is located between these materials, and discharges an electrostatic charge to the ground at a very low speed while suppressing the generation of static electricity.

  Thus, by forming an electrostatic dissipation layer on the surface of the laminate using a resin composition containing at least one kind of powder or fibrous material selected from metal, carbon and conductive ceramics, Generation | occurrence | production can be prevented, adhesion of a particle can be suppressed on the jig | tool surface for conveyance, contamination of a conveyed product can be reduced, and generation | occurrence | production of the electrostatic damage of the to-be-processed object accompanying discharge can be prevented.

  According to the transfer jig of the present invention, since the electrostatic dissipation layer is formed on the surface of the transfer jig, the surface of the transfer jig can be generated quickly by generating a counter charge of the charge generated on the surface of the laminate. The electric lines of force of the electric charge are converged inside, apparently the electric charge disappears, the internal counter charge gradually neutralizes, and the electric charge disappears, thereby causing no electrostatic induction to the surroundings, and the semiconductor breakdown. And destruction such as burnout due to overcurrent can be prevented.

  Hereinafter, the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view of a conveying jig according to the present invention, FIG. 2 is a cross-sectional view taken along the line AA of the conveying jig shown in FIG. 1, and FIG. 3 is the conveying shown in FIGS. It is the figure which showed the laminated structure of the laminated body of the jig for operation.

  Here, as shown in FIG. 1 and FIG. 2, the conveyance jig 1 of the present embodiment includes a fork-like hand 2 that holds a conveyed product and a fixing portion 3 that is fixed to the conveyance device. Is. And this conveyance jig 1 has the laminated body structure where the electrostatic-dissipation layer 5 was laminated | stacked on the surface of the laminated board 4 which laminated | stacked the several fiber reinforced prepreg sheet | seat 4a, and cut | disconnects by punching and drawing. 1 plane shape. The processed end face of the laminate 4 is covered with an elastomer 6, and all the faces of the laminate are covered with a resin composition or the like.

The static elimination layer 5 used here has a surface resistivity of 1 × 10 ⁵ Ω / sq. As long as it is less than 1 × 10 ¹⁰ Ω / sq, an electrostatic elimination resin layer formed from a resin composition is preferable. The resin composition used here may be either a thermoplastic resin or a thermosetting resin as a main component, and if considering that the surface is in contact with the conveyed product of the conveying jig, the strength is higher. It is preferable that it is a high thermosetting resin composition. In addition, the resin composition here does not include the case where an elastomer described later is used alone.

  Here, examples of the thermosetting resin include an epoxy resin, a phenol resin, a modified polyimide resin, an unsaturated polyester resin, etc. Among them, an epoxy resin can be preferably used from the viewpoint of strength and moldability, and the mass average molecular weight is 700-2000 epoxy resins are particularly preferred.

  When an epoxy resin is used as the thermosetting resin, for example, more specifically, the component composition of the resin composition is (A) an epoxy resin, (B) a curing agent for epoxy resin, and (C It is preferable that an elastomer) and (D) at least one powder or fibrous material selected from metals, carbon, and conductive ceramics are essential components.

  The (A) epoxy resin used in the present invention is not particularly limited as long as it is an epoxy resin having two or more epoxy groups in one molecule. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin are used. , A novolac epoxy resin, a glycidyl ether epoxy resin, an alicyclic epoxy resin, an epoxy resin such as a heterocyclic epoxy resin, a polyfunctional epoxy resin containing a biphenyl skeleton, or two or more of these A mixture of these can be used.

  Further, the curing agent for epoxy resin (B) used in this resin composition is not particularly limited as long as it is usually used for epoxy resins. For example, dicyandiamide, aromatic diamine, etc. An amine curing agent, a phenolic curing agent such as a phenol novolac resin or a cresol novolac resin, an acid anhydride curing agent such as methylhexahydrophthalic anhydride or phthalic anhydride, or the like can be used. Further, at this time, a curing accelerator can be optionally blended. Examples of the curing accelerator include imidazole compounds such as 2-ethyl-4-methylimidazole and 1-benzyl-2-methylimidazole, and boron trifluoride amine. A complex, triphenylphosphine, or the like can be used.

  The (C) elastomer may be any elastomer having rubber-like elasticity at room temperature, such as nitrile rubber, acrylic rubber, styrene butadiene rubber, butadiene methyl acrylate acrylonitrile, rubber, butadiene rubber, carboxyl-containing acrylonitrile butadiene rubber, Examples thereof include synthetic rubbers such as vinyl-containing acrylonitrile butadiene rubber, silicone rubber, urethane rubber, and polyvinyl butyral, rubber-modified polymer compounds such as rubber-modified epoxy resins, and polymer epoxy resins having a number average molecular weight of 10,000 or more. Among these, nitrile rubber and acrylic rubber are preferable, but nitrile rubber is particularly preferable from the viewpoint of moldability.

  Moreover, as the electrostatic elimination layer of the outermost layer of the conveying jig 1, a thermosetting resin composition containing no fiber base and inorganic filler other than the component (D) and containing 20 to 80% by mass of an elastomer component. By forming the object, warpage of the conveying jig can be reduced.

  Further, (D) as at least one powder or fibrous material selected from metal, carbon and conductive ceramics, a conductive material is used so that the resin composition is not charged by static electricity, and static electricity is diffused. Any material may be used as long as it has a function of leaking into the atmosphere, and the shape to be blended at this time is preferably powder or fiber.

  The metal used here is preferably at least one metal selected from copper, manganese, nickel, iron, chromium and alloys of these metals. Preferred examples of conductive ceramics include titanium oxide, zinc oxide, tin oxide, potassium titanate, sodium titanate, silicon nitride, and the like, and those obtained by metal doping the surface of these particles. Moreover, as carbon, electroconductive carbon black, a graphite, etc. are mentioned as a preferable thing.

The shape of the metal, carbon, and conductive ceramic is not particularly limited as long as it can provide powder or fibrous conductivity, and the powder may be spherical, rod-like, needle-like, or plate-like. There are various shapes such as an irregular shape, a scaly shape, and a spindle shape, and a scaly shape is particularly preferable. These addition amounts are such that the surface resistivity of the cured product of the resin composition is 1 × 10 ⁵ Ω / sq. 1 × 10 ¹⁰ Ω / sq. Adjusted to be less than

  Moreover, it is preferable that the average particle diameter of this powder is 0.1-2 micrometers. And as a fibrous material, it is preferable that a fiber diameter is 0.01-0.5 mm and fiber length is 1-10 mm. Here, the average particle diameter is determined by a laser diffraction method.

  At this time, the blending ratio of the components other than the components (C) to (D) is such that (A) the epoxy resin is 60 to 96% by mass in the resin composition excluding the components (C) to (D), and (B). It is preferable that a hardening agent is 0.5-35 mass% and a hardening accelerator is 0-5 mass%.

  The blending ratio of the components (A) to (B) and the curing accelerator added as necessary is preferably in the range of 40 to 80% by volume in the thermosetting resin composition. If it is less than 40% by volume, the adhesive strength is insufficient and there is a concern about the generation of particles, and if it exceeds 80% by volume, it becomes difficult to control the surface resistivity.

  Moreover, it is preferable that the compounding quantity of (C) elastomer component is the range of 14-55 mass% in a thermosetting resin composition, and it is especially preferable that it is 14-35 mass%. If it is less than 14% by mass, the handleability at the time of molding the resin sheet is poor, and if it exceeds 55% by mass, it may be peeled off by scratching.

Moreover, it is preferable to contain 5-50 mass% of (D) component with respect to the whole resin composition. At this time, the surface resistivity after curing of the resin composition varies greatly depending on the blending amount of the component (D), but the surface resistivity is adjusted to 1 × 10 ⁵ to 1 × 10 ^{10 as} appropriate depending on the material used. What is necessary is just to mix | blend.

  In addition to these blending components, necessary additives can be blended as appropriate as long as the effects of the present invention are not impaired. In addition, as this static elimination layer 5, it is comprised without containing inorganic filler, fiber base materials, etc. other than (D) component substantially.

  The static elimination layer of the present invention can be formed from an adhesive sheet in which such a resin composition is formed into a sheet, and this adhesive sheet is composed of the essential components (A) to (D) described above and other components. Can be made into a varnish with an organic solvent suitable for dissolving a resin component such as methyl ethyl ketone, methyl cellosolve, etc., applied to a release film and dried to be in a semi-cured state. Here, the release film is not particularly limited, and any release film can be used as long as it satisfies the conditions such as heat resistance at the molding temperature, release property after molding, and low contamination. Specific examples include a sepanium film (manufactured by Sun Aluminum Industry Co., Ltd.), a tedlar film (manufactured by DuPont), and the like.

  And it is preferable that the static elimination layer 5 formed using this resin composition is 1-50 micrometers in thickness. If the thickness is less than 1 μm, the stability of the resin layer at the time of molding or use may be poor, and if it exceeds 50 μm, there is a problem in surface flatness.

  The fiber reinforced prepreg 4a used for the laminated plate 4 is a fiber-reinforced prepreg 4a, in which fibers are arranged so as to have a desired orientation and impregnated in a resin composition, and this resin composition is B-staged. It can be obtained by processing this B-stage and adjusting the fiber direction as appropriate.

  As the fibers used here, woven fabrics or nonwoven fabrics made of fibers such as glass fibers, carbon fibers, aramid fibers, FBO fibers, wholly aromatic polyesters can be used, but fibers arranged in one direction may be used as they are. .

  Furthermore, the conveyance jig | tool excellent in curvature can be obtained by using a unidirectional carbon fiber reinforced prepreg. For example, a commercially available UD prepreg (for example, Mitsubishi Rayon CS tape) may be used, or a carbon fiber obtained by integrally heating and pressing carbon fibers arranged in one direction with a resin sheet may be used.

  At this time, since the outermost layer prepreg has the most influence on the rigidity of the conveying jig, in the intermediate layer, for example, a carbon fiber woven reinforced prepreg and a unidirectional carbon fiber reinforced prepreg on the outer layer You may make it do.

  Here, the carbon fiber used in the carbon fiber reinforced prepreg 4a can be used without particular limitation as long as it is normally used as a reinforced fiber. For example, the tensile elastic modulus of the carbon fiber reinforced prepreg is 230 GPa. As described above, it is preferably 400 GPa or more. As this carbon fiber, for example, Toray Co., Ltd. made by Toray Industries, Inc., carbon fiber made by Toho Tenax Co., Ltd., etc. may be mentioned. Moreover, it is preferable that the mass ratio in this prepreg is 60 mass% or more, and it is especially preferable that it is 65-75 mass%.

  At this time, since components other than carbon fiber become a resin component, the resin component preferably has a mass ratio of 40% by mass or less, and particularly preferably 35 to 25% by mass. If this ratio is too low, the surface smoothness may decrease after lamination. And as this resin component, thermosetting resins, such as an epoxy resin, a phenol resin, and a modified polyimide resin, are mentioned, Especially, it is preferable that it is an epoxy resin.

  The thickness of the fiber reinforced prepreg 4a is preferably 10 to 200 [mu] m, and more preferably 100 to 160 [mu] m, in order to laminate a plurality of the fiber reinforced prepregs 4a to form a laminated plate for a conveying jig.

  Further, the end face protective layer 6 is provided on the processed end face, and the laminate 4 is covered on all sides. The material of the end face protective layer 6 is the same resin composition as that of the electrostatic dissipation layer 5. As the resin composition used here, a thermoplastic resin composition and a thermosetting resin composition can be used in the same manner as the material of the resin sheet. What was demonstrated as a structural component (C) elastomer of a resin composition can be used independently. Moreover, when covering a process end surface using a thermosetting resin composition similarly to the surface static elimination layer 5, it is preferable to use what contains 20-80 mass% of elastomer especially. It should be noted that in the outermost electrostatic dissipation layer, the processing end face is prone to cracking and partly missing when external force is applied to the surface, so the covering layer on the processing end face is particularly susceptible to such problems. It is preferable that the elastomer is hardly generated alone.

  In this way, the present invention can be used without generating fiber particles from the surface of the conveying jig by forming the electrostatic dissipation layer 5 having a specific composition in the outermost layer. Adhesion can be prevented. Furthermore, by providing the end face protective layer 6 as a coating layer also on the processed end face, the generation of particles is more effectively prevented and the conveyed product is not contaminated.

  The conveying jig 1 of the present invention forms an electrostatic elimination layer 5 made of a resin composition on the surface of a laminated plate 4 in which a plurality of fiber-reinforced prepregs 4a as described above are laminated, and a resin is formed on a processed end face. An end face protective layer 6 made of a composition or an elastomer is formed.

  The production includes a laminating step of laminating a plurality of fiber-reinforced prepregs 4a, an adhering step of laminating the prepregs laminated in this laminating step through a release film to bond them to each other by heating and pressing, and laminating It is possible to carry out by a static elimination layer forming step of forming a static elimination layer 5 by superposing and pressing the resin sheet to be the static elimination layer 5 on the surface of the plate 4 and bonding them together.

  The method of bonding the laminated plate 4 is not particularly limited as long as it is a high precision press or the like. The molding conditions differ depending on the resin to be used, but for example, the molding is performed under conditions such as molding at a pressure of 1 MPa and a temperature of 125 ° C. for 5 hours, and laminated and bonded under uniform conditions to form a laminated plate. Moreover, the static elimination layer formation process which adhere | attaches a resin sheet on the surface of a laminated board can be performed by a high precision press or a hot roll.

  In addition, in order to form the static elimination layer 5 on the surface of the laminate 4, the resin composition may be directly applied to the surface of the laminate 4 by a method such as hand coating or curtain coater and dried. In the production of the laminated plate, the resin sheet to be the electrostatic dissipation layer 5 can also be laminated together and integrally molded.

  Here, when the resin sheet 5a is used, the resin sheet 5a can be applied and dried on the release film, and may be overlapped with the fiber reinforced prepreg 4a or the laminated plate 4. In the case of a resin sheet mainly composed of a thermosetting resin and an elastomer, an aging process is generally performed after applying and drying the release film to blend the resin and the elastomer. By carrying out molding and integration without the aging step, a conveying jig having an excellent surface appearance can be obtained.

  Here, the release film is not particularly limited, and any release film can be used as long as it satisfies the conditions such as heat resistance at the molding temperature, release property after molding, and low contamination. Specifically, a sepanium film (manufactured by Sun Aluminum Industry Co., Ltd.), a tedlar film (manufactured by DuPont) and the like can be mentioned.

  The laminate obtained in this manner can be cut and punched with a predetermined outer diameter and inner hole diameter to remove the resin burrs on the end face, thereby manufacturing a conveying jig. At this time, in order to further form the end face protective layer 6 on the processed end face, the conveying jig 1 that does not generate more particles can be manufactured by applying, drying, and curing the elastomer.

  Examples of the resin composition used for forming the end face protective layer 6 of the processed end face used here include a resin composition used for the electrostatic dissipation layer 5, and the elastomer is a resin of the electrostatic dissipation layer 5. Examples include those that use the elastomer of the component (C) alone in the composition, and it is preferable to use silicone rubber, which can effectively prevent the carbon fibers that are reinforcing fibers from falling off from the processed end face.

  The viscosity of silicone rubber varies depending on the processed surface to be treated, but can be widely used from non-flowing to low-viscosity flowable types. Non-flowable and high-viscosity types are slower to penetrate into the fiber than low-viscosity types, but are easy to coat because there is no liquid dripping in the end face treatment. The low-viscosity fluidity type is suitable for thin coating with quick penetration into fibers. These can be appropriately selected and used depending on the manufacturing conditions of the conveying jig.

  The thickness of the elastomer layer on the processed end face is preferably 1 to 20 μm, and more preferably 3 to 15 μm.

  In addition, as a test method for the charging property of the conveying jig, a method of measuring the half-life of the withstand voltage in JIS L1094 (half-life measurement method), and a withstand voltage generated by rubbing with a friction cloth while rotating the test piece. (Tribological withstand voltage measurement method), method of measuring the amount of charge generated after triboelectrically charging a test piece (triboelectric charge measurement method), and withstanding voltage generated after triboelectrically charging a test piece However, none of these methods can cover a conductive material to an electrically insulating material.

  In contrast, a method has been proposed in which the amount of charge is measured by dropping the powder from the object to be measured and measuring the amount of charge due to contact and peeling between the object to be measured and the powder by comparing the elapsed time. (Patent No. 3112904).

  In this method, by adjusting the type of powder used and the flow rate per hour, it is possible to measure the charge amount with good measurement accuracy and measurement reproducibility from conductive materials to electrically insulating materials. This is a test method suitable for.

  When the object to be measured is set at an inclination angle of 60 degrees and the reference powder MF60 (product name, manufactured by Powdertech Co., Ltd.) is dropped at a drop amount of 5 g in 20 seconds, the charging voltage after 10 seconds is It is less than 5V for an electrically insulating material in which contamination of a conveyed product due to particle adhesion becomes a problem, and less than 2V for a conductive material that does not cause particle adhesion but is concerned about electrostatic damage due to discharge. . For this reason, it has been found that the static-dissipating material having the charging voltage in the middle is suitable as a surface layer of the conveying jig that is not affected by static electricity.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited by these Examples. In the following Examples and Comparative Examples, “part” means “part by mass”.

Example 1
A commercially available UD sheet (trade name: CS tape; thickness 150 μm, manufactured by Mitsubishi Rayon Co., Ltd.), which is a unidirectional carbon fiber prepreg, is cut into 550 mm × 550 mm, and 6 sheets are stacked, forming pressure while applying a pressure of 1 MPa. The temperature was raised to 160 ° C. and held for 60 minutes, followed by heating and pressure molding. Then, it cooled over 30 minutes and obtained the laminated board.

  Next, 70 parts of a cresol novolac type epoxy resin (manufactured by Toto Kasei Co., Ltd., trade name: YDCN703), 33 parts of a phenol resin curing agent (trade name: BRG-558, produced by Showa Polymer Co., Ltd.), 2 as a curing accelerator -0.1 part of ethyl-4-methylimidazole, 30 parts of elastomer (manufactured by JSR Corporation, trade name: PNR-1H), 30 parts of flake graphite (trade name: SG-BH8, manufactured by Ito Graphite Industries Co., Ltd.), Then, methyl ethyl ketone and methyl cellosolve are added to prepare a resin composition A having a resin solid content of 50% by mass, and it is applied to a PET film as a release film and dried by a roll coater so that the thickness after drying is 25 μm. It was set as the adhesive sheet A which has the static elimination property of a state. In addition, the compounding ratio in the resin composition of the epoxy resin of the resin composition A used here, a phenol resin hardening | curing agent, and a hardening accelerator is 63 volume%.

  The above laminate and the adhesive sheet A were superposed and press-cured under the conditions of 180 ° C., 4 MPa, and 60 minutes to obtain a laminate with an adhesive sheet having electrostatic dissipation.

  The 0.8 mm-thick laminate thus obtained was cut and punched into the shape shown in FIG. 1 to produce a conveying jig.

(Example 2)
Cresol novolac type epoxy resin (product name: YDCN703, manufactured by Toto Kasei Co., Ltd.) 70 parts, phenol resin curing agent (product name: BRG-558, manufactured by Showa Polymer Co., Ltd.) 33 parts, 2-ethyl- as a curing accelerator 4-methylimidazole 0.1 part, elastomer (manufactured by JSR Corporation, trade name: PNR-1H) 30 parts, stainless steel SUS304 powder 5 parts with an average particle diameter of 10 μm, flake graphite (made by Ito Graphite Industries, trade name) : SG-BH8) 10 parts, and methyl ethyl ketone and methyl cellosolve were added to prepare resin composition B having a resin solid content of 50% by mass, and a PET film as a release film was rolled so that the thickness after drying was 25 μm. It was coated and dried with a coater to obtain a semi-cured adhesive sheet B having electrostatic disappearance. In addition, the compounding ratio in the resin composition of the epoxy resin of the resin composition B used here, a phenol resin hardening | curing agent, and a hardening accelerator is 67 volume%.

  And the conveyance jig was manufactured by operation similar to Example 1. FIG.

(Example 3)
Cresol novolac type epoxy resin (product name: YDCN703, manufactured by Toto Kasei Co., Ltd.) 70 parts, phenol resin curing agent (product name: BRG-558, manufactured by Showa Polymer Co., Ltd.) 33 parts, 2-ethyl- as a curing accelerator 4-methylimidazole 0.1 part, elastomer (manufactured by JSR Corporation, trade name: PNR-1H) 30 parts, titanium oxide (Ishihara Sangyo Co., Ltd., trade name: ET500W) 50 parts, methyl ethyl ketone and methyl cellosolve are added. The resin composition C having a resin solid content of 50% by weight was prepared, and applied to a PET film as a release film by a roll coater so that the thickness after drying was 25 μm. It was set as the adhesive sheet C which has. In addition, the compounding ratio in the resin composition of the epoxy resin of the resin composition B used here, a phenol resin hardening | curing agent, and a hardening accelerator is 63 volume%.

  And the conveyance jig was manufactured by operation similar to Example 1. FIG.

(Comparative Example 1)
Bisphenol A type phenoxy resin (Japan Epoxy Resin Co., Ltd., trade name: Epicoat 1256) 20 parts, Bisphenol A type epoxy resin (Japan Epoxy Resin Co., Ltd., trade name: Epicoat 828) 30 parts, Dicyandiamide 1.6 parts, 2-ethyl-4-methylimidazole 0.1 part, synthetic silica (manufactured by Admafine Co., Ltd., trade name: CS2050) 40 parts, and methyl ethyl ketone and methyl cellosolve “added resin composition D having a resin solid content of 50% by mass Was applied to the PET film as a release film and dried with a roll coater so that the thickness after drying was 25 μm, to obtain a semi-cured conductive adhesive sheet D. The resin composition used here D phenoxy resin, epoxy resin, dicyandiamide, imidazole hard The blending ratio of the chemical accelerator in the resin composition is 67% by volume.

  And the conveyance jig was manufactured by operation similar to Example 1. FIG.

(Comparative Example 2)
Bisphenol A type epoxy resin (Japan Epoxy Resin Co., Ltd., trade name: Epicoat 1001; mass average molecular weight 900) 70 parts, Nitrile rubber (JSR Corporation, trade name: N-172) 30 parts, 4, 4'- Diaminodiphenyl sulfone 0.7 part and boron trifluoride monomethylamine complex 0.5 phr which is a boron trifluoride complex compound were added and kneaded with a kneader, and then diluted with a solvent, methyl ethyl ketone and methyl cellosolve acetate. The resin composition E was obtained by mixing 30 parts by mass of scaly silver powder (average particle size 5 μm) in the resin composition. In addition, the compounding ratio in the resin composition of the epoxy resin of the resin composition E used here, 4,4'- diamino diphenyl sulfone, and a boron trifluoride monomethylamine complex is 61 volume%.

  The carbon fiber base laminate having a thickness of 0.8 mm of Example 1 was cut and punched into the shape of FIG. 1, and the resin composition E was applied to the surface of the laminate with a brush to a thickness of 25 μm. Then, it was cured by heating at 80 ° C. for 6 hours to produce a conveyance jig.

(Comparative Example 3)
A resin composition F was produced in the same manner as in Comparative Example 2 except that no silver powder was blended, and further, a conveying jig was produced in the same manner as in Comparative Example 2.

(Comparative Example 4)
The carbon fiber substrate laminate of Example 1 with a thickness of 0.8 mm was cut and punched into the shape of FIG. 1, and a commercially available urethane resin (spray type) was applied to the surface of the laminate to a thickness of 25 μm. Then, it was cured by heating at 80 ° C. for 6 hours to produce a conveyance jig.

(Test example)
About the conveyance jig | tool obtained in Examples 1-3 and Comparative Examples 1-4, it shows in FIG. 2 about an external appearance, a bending, curvature, the maximum surface roughness, surface roughness, surface resistance, and electrostatic surface charge amount. The results are shown in Table 1.

  The surface roughness Ra and Rt are based on the 2001 JIS standard.

  From the above results, the conveyance jig of the present invention is suitable for the use of carbon fiber reinforced resin composite material, suppressing the generation of particles while taking advantage of its advantages, and conveying the substrate and the like in a clean environment, Furthermore, since the static elimination layer is formed on the surface of the laminate, it is possible to effectively prevent electrical breakdown of the conveyed product.

It is the top view which showed an example of the jig | tool for conveyance of this invention. It is AA sectional drawing of the jig | tool for conveyance described in FIG. It is the schematic which showed the laminated structure of the jig | tool for conveyance of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Conveying jig | tool, 2 ... Hand, 3 ... Fixed part, 4 ... Laminated board, 4a ... Fiber reinforced prepreg, 5 ... Electrostatic elimination layer, 5a ... Adhesive sheet, 6 ... End surface protective layer

Claims (7)

A conveying jig formed by processing a laminated plate in which a plurality of fiber-reinforced prepreg sheets are laminated,
On the surface of the laminate, the surface resistivity after curing is 1 × 10 ⁵ Ω / sq. 1 × 10 ¹⁰ Ω / sq. A conveying jig comprising a static elimination resin layer having a static elimination property of less than 1.   The conveying jig according to claim 1, wherein the static elimination resin layer is formed by superposing a resin adhesive sheet on at least one surface of the laminate.   The static elimination layer is at least one powder or fiber selected from (A) an epoxy resin, (B) a curing agent for epoxy resin, (C) an elastomer, and (D) metal, carbon, and conductive ceramics. The conveyance jig according to claim 1 or 2, comprising a resin composition containing a material in the form of an essential component.   The conveyance jig according to any one of claims 1 to 3, wherein the fiber used in the fiber-reinforced prepreg sheet is carbon fiber, and the resin is a thermosetting resin.   5. The carbon fiber prepreg sheet according to claim 1, wherein the fiber reinforced prepreg sheet is a carbon fiber prepreg sheet in which a large number of carbon fibers are oriented in one direction and a resin composition is impregnated between the carbon fibers and semi-cured. The conveying jig according to claim 1.   The conveyance jig according to any one of claims 1 to 5, wherein a holding portion of the conveyance object in the conveyance jig is a fork-shaped hand.   7. The semiconductor transport jig according to claim 1, wherein the transported object by the transport jig is a semiconductor wafer or a liquid crystal substrate.

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