JP2008187006A - Electrostatic chucking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrostatic chucking device having superior separation properties with respect to an object to be attracted, after voltage application is stopped. <P>SOLUTION: In the electrostatic chucking device 10, an outermost surface layer in contact with an attraction object contains fluororesin. The electrostatic chucking device 10 has a lamination structure, wherein an adhesive layer 21, an insulating layer 31, an insulating adhesive layer 22, inner electrodes 41, 42, an insulating adhesive layer 23 and an outermost surface layer 33, having a surface whereon an object to be chucked, is mounted are laminated one by one on a substrate 20. In the electrostatic chuck device 10, the fluorine content in the outermost surface layer is 0.025 to 100 mass%. According to this constitution, it is possible to provide an electrostatic chucking device which has superior separation properties with respect to an object to be chucked, after voltage application is stopped. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electrostatic chuck device that holds, for example, a semiconductor wafer or a glass substrate by suction.

In semiconductor manufacturing, it is necessary to fix a semiconductor wafer at a predetermined position of a processing apparatus such as a plasma etching apparatus. In particular, in the production of an integrated circuit in which a fine pattern is drawn on a semiconductor wafer to form a large number of semiconductor elements, it is indispensable to securely fix the semiconductor wafer to a flat surface.
Mechanical, vacuum, and electrical chuck devices are used as means for fixing the semiconductor wafer. Among these, the electric chuck device, that is, the electrostatic chuck device has an advantage that even a non-flat semiconductor wafer can be fixed with good adhesion, is easy to handle, and can be used even in a vacuum.
The electrostatic chuck device applies a voltage to internal electrodes sandwiched between insulators, and adsorbs an object to be attracted using static electricity generated by the voltage.

2. Description of the Related Art Conventionally, for example, an electrostatic chuck device (Patent Document 1) or the like is known in which a dielectric breakdown voltage is improved and a stable adsorption force is obtained by using a polyimide film as an outermost layer in contact with an object to be adsorbed.
An object to be attracted such as a semiconductor wafer is fixed to a predetermined position of a processing apparatus by an electrostatic chuck and needs to be quickly detached from the electrostatic chuck after a predetermined processing step. If the adherend does not detach immediately after the voltage application to the electrostatic chuck is stopped, the tact time will be increased and the productivity will be reduced. Therefore, it is desired that the electrostatic chuck device used for these applications has a quick detachability with respect to the object to be adsorbed as well as a stable adsorbing force with respect to the object to be adsorbed.
JP 2004-235563 A

However, it has been difficult for the conventional electrostatic chuck apparatus to obtain a quick detachment property of the adherend after the voltage application is stopped.
The present invention has been made in view of the above situation, and an object of the present invention is to provide an electrostatic chuck device that is excellent in detachability of an object to be attracted when voltage application is stopped.

(1) The electrostatic chuck device, wherein the outermost layer in contact with the object to be adsorbed contains a fluororesin.
(2) It has a laminated structure in which an adhesive layer, an insulating layer, an insulating adhesive layer, an internal electrode, an insulating adhesive layer, and an outermost layer having a surface on which an adsorbed object is placed are sequentially laminated on the substrate. (1) The electrostatic chuck device according to (1).
(3) It has a laminated structure in which an adhesive layer, an insulating layer, an internal electrode, an insulating adhesive layer, and an outermost layer having a surface on which an adsorbed object is placed are sequentially laminated on a substrate ( The electrostatic chuck apparatus as described in 1).
(4) It has a laminated structure in which an adhesive layer, an insulating layer, an insulating adhesive layer, an internal electrode, and an outermost layer having a surface on which an adsorbed object is placed are sequentially laminated on a substrate ( The electrostatic chuck apparatus as described in 1).
(5) The static structure according to (1), which has a laminated structure in which an outermost layer having an adhesive layer, an insulating layer, an internal electrode, and a surface on which an object to be adsorbed is sequentially laminated on a substrate. Electric chuck device.
(6) On the substrate, an adhesive layer, an insulating layer, an insulating adhesive layer, an internal electrode, an insulating adhesive layer, an insulating layer, an adhesive layer, and an outermost layer having a surface on which an object to be adsorbed is placed sequentially The electrostatic chuck device according to (1), wherein the electrostatic chuck device has a laminated structure.
(7) A laminated structure in which an adhesive layer, an insulating layer, an internal electrode, an insulating adhesive layer, an insulating layer, an adhesive layer, and an outermost layer having a surface on which an object to be adsorbed are sequentially laminated on a substrate The electrostatic chuck device according to (1), comprising:
(8) The electrostatic chuck device according to (1), wherein the fluororesin content in the outermost layer is 0.025 to 100% by mass.
(9) The electrostatic chuck device according to (1), wherein a fluororesin is dispersed as a filler in the outermost layer.
(10) The electrostatic chuck device according to (9), wherein the filler has a particle size of 0.01 to 10 μm.

  ADVANTAGE OF THE INVENTION According to this invention, the electrostatic chuck apparatus excellent in the removal property of the to-be-adsorbed object in the case of a voltage application stop can be provided.

  An embodiment of an electrostatic chuck device according to the present invention will be described with reference to the drawings. 1 to 6 are cross-sectional views when the electrostatic chuck device of the present embodiment is cut in a direction perpendicular to the extending direction of the internal electrodes. For convenience of explanation, the side that adsorbs the object to be adsorbed is defined as the upper side, and the opposite side is defined as the lower side. For convenience of explanation, each layer is illustrated with a certain interval. In an actual electrostatic chuck, the layers are in close contact.

  As shown in FIG. 1, in the electrostatic chuck device 10 of the present embodiment, an insulating layer 31 and an outermost layer 33 are bonded via insulating adhesive layers 22 and 23, and the insulating adhesive layers 22 and 23 are bonded. The electrode sheet (electrostatic chuck device electrode sheet) 30 is mainly composed of band-like internal electrodes 41 and 42 formed therebetween, and the electrode sheet 30 is adhered to the substrate 20 via the adhesive layer 21. It is an electrostatic chuck device. In the present embodiment, the upper surface of the outermost layer 33 is an adsorption surface that adsorbs an object to be adsorbed.

  FIG. 2 shows another shape of the present embodiment. The difference from FIG. 1 is that the insulating adhesive layer 22 of FIG. 1 is omitted, and the electrostatic chuck device is functionally similar to FIG.

  FIG. 3 shows another shape of the present embodiment. The difference from FIG. 1 is that the insulating adhesive layer 23 of FIG. 1 is omitted, and the electrostatic chuck device is functionally similar to FIG.

  FIG. 4 shows another shape of the present embodiment. The difference from FIG. 1 is that the insulating adhesive layers 22 and 23 of FIG. 1 are omitted, and the electrostatic chuck device is functionally similar to FIG.

  FIG. 5 shows another shape of the present embodiment. A difference from FIG. 1 is that an insulating layer 32 and an adhesive layer 24 are sequentially added between the insulating adhesive layer 23 and the outermost layer 33 in FIG. This is an electrostatic chuck device.

  FIG. 6 shows another shape of the present embodiment. The difference from FIG. 1 is that the insulating adhesive layer 22 of FIG. 1 is omitted, and an insulating layer 32 and an adhesive layer 24 are sequentially added between the insulating adhesive layer 23 and the outermost layer 33. It is functionally the same electrostatic chuck apparatus as FIG.

The electrostatic chuck device of the present invention is characterized in that the outermost layer 33 includes a fluororesin. Here, the fluororesin widely refers to a resin containing a fluorine element. The present inventors include a fluororesin in the adsorption surface of the electrostatic chuck device, that is, the outermost layer 33 in the present invention, so that the adherend can be quickly detached after the voltage application is stopped. It has been found that the releasability is improved. In addition, the adsorption force at the time of voltage application has a stable adsorption force equivalent to that of a resin such as polyimide, which has been conventionally used for the outermost layer.
The layer structure of the electrostatic chuck apparatus of the present invention is not limited to the layer structure shown in FIGS. 1 to 6 as long as the outermost layer 33 contains a fluororesin. Further, the electrostatic chuck device of the present invention may be the electrode sheet 30 itself without the adhesive layer 21 and the substrate 20.

  Examples of the fluororesin contained in the outermost layer 33 include polytetrafluoroethylene, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene- Ethylene Copolymer, Polyvinyl Fluoride, Vinylidene Fluoride Fluoro Rubber, Tetrafluoroethylene-Propylene Fluoro Rubber, Tetrafluoroethylene-Propylene Rubber, Fluorine-Containing Silicone Rubber, Fluorophosphazene Fluoro Rubber, Fluorine-Containing Thermoplastic Based fluororubbers. The outermost layer 33 may contain a resin other than the fluororesin.

  The content of the fluororesin contained in the outermost layer 33 is preferably 0.025 to 100% by mass. More preferably, it is 1-86 mass%. If it is less than 0.025% by mass, the release property is not good, which is not preferable.

As a form of the fluororesin contained in the outermost layer 33, for example, a resin film containing as a main component a fluororesin molded into a film, that is, a fluororesin film can be mentioned.
Fluororesin films are commercially available. For example, polytetrafluoroethylene film (trade name: NITOFLON, manufactured by Nitto Denko Corporation), tetrafluoroethylene-hexafluoropropylene copolymer film (trade names: NEOFRON film, Daikin Industries, Ltd.) And tetrafluoroethylene-ethylene copolymer film (trade name: Fluon-ETFE, manufactured by Asahi Glass Co., Ltd.) are preferably used.
As another form of the outermost layer 33 containing a fluororesin, the fluororesin may be dispersed as a filler in the outermost layer 33. The particle diameter of the fluororesin filler is preferably 0.01 to 10 μm. If the particle diameter of the filler is less than 0.01 μm, the particles are fine, and even if dispersed, the filler will be secondary agglomerated. On the other hand, if the particle diameter of the filler exceeds 10 μm, unevenness is likely to occur on the adsorption surface, and the adhesion to the object to be adsorbed decreases, which is not preferable.

The thickness of the outermost layer 33 is preferably 5 to 150 μm. More preferably, it is 10-50 micrometers. If the thickness is less than 5 μm, there is a problem in the strength of the outermost layer 33. On the other hand, if it exceeds 150 μm, the distance from the internal electrode to the object to be adsorbed becomes long, and it is difficult to obtain a good adsorption force. The outermost layer 33 preferably has a pencil hardness of 2H or higher.
The unevenness difference of the surface of the outermost layer 33, that is, the adsorption surface for adsorbing the adsorbed material is preferably 20 μm or less. When the uneven | corrugated difference of the adsorption | suction surface 33 exceeds 20 micrometers, adhesiveness with to-be-adsorbed object will fall, and adsorption | suction power will become inadequate.

  Furthermore, the outermost layer 33 has an ultraviolet absorber, a near infrared absorber, a light stabilizer, a light scattering agent for the purpose of improving hardness, adhesion, durability, weather resistance, light resistance, water resistance, corrosion resistance, and the like. Various additives such as an antioxidant, an antifoaming agent, a leveling agent, a thixotropy imparting agent, an internal mold release agent, an ion scavenger, a lubricant, and a coupling agent can be added.

The material of the insulating layers 31 and 32 in FIGS. 1 to 6 is not particularly limited as long as it has an insulating property, but an insulating resin film is preferably used. Examples of the main component of the insulating resin film include polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyimide, polyamide, polyamideimide, polyethersulfone, polyphenylene sulfide, polyetherketone, and polyetherimide. , Triacetyl cellulose, silicone rubber and the like. Of these, polyesters, polyolefins, polyimide, silicone rubber, polyetherimide, polyethersulfone and the like are preferable because of excellent insulation. Particularly preferred is polyimide. The polyimide film is commercially available. For example, trade name Kapton manufactured by Toray DuPont, trade name Upilex manufactured by Ube Industries, and trade name Apical manufactured by Kaneka Chemical Co., Ltd. are preferably used.
Although the thickness of the insulating organic films 31 and 32 is not specifically limited, 20-150 micrometers is preferable and 25-75 micrometers is more preferable.

  Polyimide has excellent dielectric breakdown resistance against high voltage application. For example, as shown in the electrostatic chuck device 10 of FIGS. 5 and 6, in the embodiment in which the insulating layer 32 is laminated between the electrodes 41 and 42 and the outermost layer 33, when a polyimide film is used for the insulating layer 32, In addition to improving the releasability by fluororesin, it can be expected to improve the dielectric breakdown resistance by polyimide.

The insulating adhesive layers 22 and 23 are not particularly limited as long as the insulating adhesive layers 22 and 23 have insulating properties that do not cause a short circuit between the internal electrodes. However, the insulating adhesive layers 22 and 23 are preferably composed of an adhesive mainly composed of a resin material. Examples of the main resin material include epoxy resin, phenol resin, polyamide resin, acrylonitrile-butadiene copolymer, polyester resin, polyimide resin, silicone resin, styrene block copolymer, amine compound, bismaleimide compound, and the like. From the adhesive which has 1 type or 2 types or more of resin selected as a main component, what satisfy | fills conditions can be selected and used.
Epoxy resins include bisphenol, phenol novolac, cresol novolac, glycidyl ether, glycidyl ester, glycidylamine, trihydroxyphenylmethane, tetraglycidylphenolalkane, naphthalene, diglycidyldiphenylmethane, and diglycidyl. Specific examples include bifunctional or polyfunctional epoxy resins such as biphenyl type. Among these, bisphenol type epoxy resins are preferable, and bisphenol A type epoxy resins are particularly preferable. When epoxy resin is the main component, curing agents for epoxy resins such as imidazoles, tertiary amines, phenols, dicyandiamides, aromatic diamines, organic peroxides, and curing accelerators are used as necessary. What mix | blended the agent can also be used.
Specific examples of the phenol resin include novolak phenol resins such as alkylphenol resins, p-phenylphenol resins, and bisphenol A type phenol resins, resole phenol resins, polyphenylparaphenol resins, and the like.
Examples of the styrene block copolymer include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-butylene-styrene block copolymer (SEBS), Specific examples include styrene-ethylene-propylene-styrene copolymer (SEPS).

  As the adhesive constituting the adhesive layers 21 and 24, the same adhesive as the insulating adhesive layers 22 and 23 can be used. However, since the adhesive layers 21 and 24 are not in direct contact with the internal electrodes, the high insulation resistance required for the insulating adhesive layers 22 and 23 is not necessary.

  The internal electrodes 41 and 42 are not particularly limited as long as they are conductive substances that can exhibit electrostatic attraction when a voltage is applied, but copper, aluminum, gold, silver, platinum, chromium, nickel, tungsten, etc. What patterned the thin film which consists of 1 type, or 2 or more types of metals selected from these alloys is preferable. Specific examples of the metal thin film include a film formed by vapor deposition, plating, sputtering, etc., a film formed by applying and drying a conductive paste, a metal foil such as a copper foil, and the like.

  Although it does not specifically limit as the board | substrate 20 which adheres the electrode sheet 30, For example, an aluminum substrate, a stainless steel substrate, a ceramic substrate etc. are mentioned.

  According to the electrode sheet 30 and the electrostatic chuck device 10 of the present embodiment, since the outermost layer 33 in contact with the object to be adsorbed employs a resin containing fluorine, the ability to detach the object to be adsorbed when voltage application is stopped. An excellent electrostatic chuck device can be provided. Since the detachability is excellent, the tact time in the production of semiconductor wafers can be reduced, and the productivity can be improved.

EXAMPLES Next, although this invention is demonstrated in more detail using an Example, this invention is not limited to these Examples.
<Production of electrostatic chuck device>
(Example 1)
A method for producing the electrostatic chuck device 10 of Example 1 will be described with reference to FIG.
First, a polyimide film having a thickness of 50 μm corresponding to the insulating layer 31 (trade name: Kapton 200H, manufactured by Toray DuPont Co., Ltd.) is disposed on an adhesive film having a thickness of 20 μm corresponding to the insulating adhesive layer 22. Then, a 12 μm-thick copper foil (trade name: TQ-VLP, manufactured by Mitsui Kinzoku Mining Co., Ltd.) for forming the internal electrodes 41 and 42 was laminated.
Next, etching was performed on the copper foil surface to form electrodes 41 and 42 having the shape of comb electrodes. The comb-shaped electrode was a comb-shaped internal electrode in which conductive portions having a width of 5 mm and insulating portions having a width of 5 mm were alternately arranged in an area of 90 × 90 mm.
Next, a polytetrafluoroethylene film having a thickness of 50 μm corresponding to the outermost layer 33 is placed on the internal electrodes 41 and 42 via an adhesive film having a thickness of 20 μm corresponding to the insulating adhesive layer 23 (trade name). : Nitoflon, manufactured by Nitto Denko Corporation) was laminated to obtain an electrode sheet 30.
After cutting the electrode sheet 30 into a predetermined size, a 5 × 100 × 100 mm aluminum substrate corresponding to the substrate 20 is laminated via an adhesive film having a thickness of 20 μm corresponding to the adhesive layer 21. Example 1 The electrostatic chuck device 10 was manufactured.

The adhesive film was obtained by the following materials and processes. First, a resol phenol resin (trade name: Shonor CKM-908A, manufactured by Showa Polymer Co., Ltd.) and NBR (trade name: Nipol 1001, manufactured by Nippon Zeon Co., Ltd.) are mixed at a mass ratio of 1: 1, and an adhesive composition is prepared. It was a thing. This adhesive composition was dissolved in methyl ethyl ketone to prepare an adhesive solution having a solid content of 30% by mass. Next, this adhesive solution was applied to one side of a releasable polyethylene terephthalate film (thickness 38 μm) and then dried by heating at 150 ° C. for 3 minutes to obtain an adhesive film having a thickness of 20 μm.
At the time of lamination through the adhesive film corresponding to the insulating adhesive layers 22 and 23, the adhesive film was thermally melted by using a high-temperature continuous lamination at 150 ° C. to adhere the laminates. In addition, when the electrode sheet 30 and the aluminum substrate 20 are laminated through the adhesive sheet corresponding to the adhesive layer 21, the thermosetting of the adhesive is completed after performing a vacuum press at 150 ° C./30 minutes. Therefore, the laminates were attached by performing heat treatment at 150 ° C./12 hours in a ventilated oven.

(Example 2)
The insulating adhesive layer 22 is eliminated, and a nickel thin film with a thickness of 50 nm subjected to aluminum plating is formed on one side of the polyimide film corresponding to the insulating layer 31 instead of the copper foil used in Example 1. Then, the nickel thin film was etched to form the internal electrodes 41 and 42 made of comb-shaped electrodes as in the first embodiment, and the electrostatic chuck device 10 in FIG. Produced. In addition, the polyimide film similar to Example 1 was used for the said polyimide film, and the electroless nickel plating was employ | adopted as the method of forming a nickel thin film in a polyimide film.
(Example 3)
The electrostatic chuck device 10 of FIG. 3 was produced under the same conditions as in Example 1 except that the insulating adhesive layer 23 was removed and a vacuum pressure device was used when the outermost layer 33 was laminated and pasted. .
Example 4
Instead of the copper foil used in Example 1 without the insulating adhesive layers 22 and 23, an internal electrode 41 made of a nickel thin film is formed on one side of the polyimide film corresponding to the insulating layer 31 by the same method as in Example 2. The electrostatic chuck device 10 of FIG. 4 was produced under the same conditions as in Example 1, except that the vacuum pressing device was used when the outermost layer 33 was laminated and pasted.
(Example 5)
An insulating adhesive through an adhesive film having a thickness of 20 μm corresponding to the adhesive layer 24 and a polyimide film having a thickness of 50 μm corresponding to the insulating layer 32 (trade name: Kapton 200H, manufactured by Toray DuPont) 5 was produced under the same conditions as in Example 1 except that the layer 23 and the outermost layer 33 were laminated. In addition, in the case of lamination | stacking through the adhesive film applicable to the adhesive bond layer 24, 150 degreeC high temperature continuous lamination was used, the adhesive film was heat-melted, and laminates were stuck.
(Example 6)
Instead of the copper foil used in Example 1 without the insulating adhesive layer 22, internal electrodes 41 and 42 made of a nickel thin film are formed on one side of a polyimide film corresponding to the insulating layer 31 by the same method as in Example 2. Except for the formation, the electrostatic chuck device 10 of FIG. 6 was manufactured under the same conditions as in Example 5.

(Comparative Example 1)
The electrostatic capacitance of Comparative Example 1 was the same as Example 1 except that a polyimide film (Kapton 200H, manufactured by Toray DuPont) having a thickness of 50 μm was used as the outermost layer 33 instead of the polytetrafluoroethylene film. A chuck device was produced.

(Comparative Example 2)
The electrostatic chuck of Comparative Example 2 is the same as Example 5 except that a 50 μm-thick polyimide film (Kapton 200H, manufactured by Toray DuPont) is used as the outermost layer 33 instead of the polytetrafluoroethylene film. A device was made.

<Evaluation>
Using the electrostatic chuck devices obtained in Examples 1 to 6 and Comparative Examples 1 and 2, adsorption force, detachability, and electrical characteristics were tested by the methods shown below. The results are shown in Table 1.
(Adsorption power)
A voltage with a potential difference of 5 kV was applied to the internal electrode of the electrostatic chuck device to adsorb the object to be adsorbed, and fixed and held for 1 minute, and then the voltage application was stopped. The peel strength of the object to be adsorbed was measured once during the fixed holding, 0 times after stopping the voltage application, and 30 times after stopping the applied voltage for a total of 3 times, and the adsorptive power was evaluated.
Note that non-alkali glass having a size of 0.3 × 80 × 80 mm was used as the object to be adsorbed. For measuring the peel strength, Tensilon (model number: RTC-1150A, manufactured by Orientec Co., Ltd.) was used, and the peel strength when the glass was peeled in the vertical direction at a speed of 50 mm / min was measured. The measurement environment was 25 ° C. and relative humidity 55%.
(Withdrawal)
Based on the measurement of the adsorption force, the detachability was evaluated according to the following criteria.
○ = less than 1 gf / cm ² immediately after application stop Δ = less than 1 gf / cm ² 30 seconds after application stop × = 1 gf / cm ² or more 30 seconds after application stop (Electrical characteristics)
A silicon wafer is placed on the electrostatic chuck device and a voltage is applied. Then, the voltage difference to be applied is gradually increased, and the applied voltage difference at the time when the dielectric breakdown occurs in the electrode sheet 30 is recorded. The electrical characteristics were evaluated according to the criteria for determining electrical characteristics.
○ = 20 kV or more △ = 10 kV or more and less than 20 kV × = less than 10 kV

As shown in Table 1, Examples 1 to 6 not only have good adsorption power when applying voltage to an adherend, but also have excellent detachability when voltage application is stopped. confirmed. This was considered due to the fact that the outermost layer contained a fluororesin. On the other hand, it was confirmed that Comparative Examples 1 and 2 did not have good detachability.
Moreover, it was confirmed that Examples 5 and 6 have excellent detachability and excellent electrical characteristics, that is, high dielectric breakdown resistance. It was speculated that the dielectric breakdown resistance was improved by interposing a polyimide film insulating layer between the outermost layer and the electrode.

  As described above in detail, according to the present invention, it is possible to provide an electrostatic chuck device that is excellent in the ability to detach an object to be attracted when voltage application is stopped.

It is sectional drawing which shows the embodiment of the electrostatic chuck apparatus which concerns on this invention. It is sectional drawing which shows the other embodiment of the electrostatic chuck apparatus which concerns on this invention. It is sectional drawing which shows the other embodiment of the electrostatic chuck apparatus which concerns on this invention. It is sectional drawing which shows the other embodiment of the electrostatic chuck apparatus which concerns on this invention. It is sectional drawing which shows the other embodiment of the electrostatic chuck apparatus which concerns on this invention. It is sectional drawing which shows the other embodiment of the electrostatic chuck apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electrostatic chuck apparatus 20 Substrate 21, 24 Adhesive layers 22, 23 Insulating adhesive layer 30 Electrode sheet 31, 32 Insulating layer 33 Outermost layer 41, 42 Internal electrode

Claims (10)

  An electrostatic chuck device, wherein an outermost layer in contact with an object to be adsorbed contains a fluororesin.   It has a laminated structure in which an adhesive layer, an insulating layer, an insulating adhesive layer, internal electrodes, an insulating adhesive layer, and an outermost layer having a surface on which an adsorbed object is placed are sequentially laminated on a substrate. The electrostatic chuck device according to claim 1.   2. A laminated structure in which an adhesive layer, an insulating layer, an internal electrode, an insulating adhesive layer, and an outermost layer having a surface on which an adsorbed object is placed are sequentially laminated on a substrate. The electrostatic chuck apparatus described.   2. A laminated structure in which an adhesive layer, an insulating layer, an insulating adhesive layer, an internal electrode, and an outermost layer having a surface on which an adsorbed object is placed are sequentially laminated on a substrate. The electrostatic chuck apparatus described.   2. The electrostatic chuck device according to claim 1, wherein the electrostatic chuck device has a laminated structure in which an adhesive layer, an insulating layer, an internal electrode, and an outermost layer having a surface on which an object to be adsorbed is sequentially laminated. .   On the substrate, an adhesive layer, an insulating layer, an insulating adhesive layer, an internal electrode, an insulating adhesive layer, an insulating layer, an adhesive layer, and an outermost layer having a surface on which an adsorbed object is placed are sequentially laminated. The electrostatic chuck device according to claim 1, wherein the electrostatic chuck device has a laminated structure.   It has a laminated structure in which an adhesive layer, an insulating layer, an internal electrode, an insulating adhesive layer, an insulating layer, an adhesive layer, and an outermost layer having a surface on which an object to be adsorbed are sequentially laminated on a substrate. The electrostatic chuck device according to claim 1, wherein:   The electrostatic chuck device according to claim 1, wherein the content of the fluororesin in the outermost layer is 0.025 to 100% by mass.   The electrostatic chuck apparatus according to claim 1, wherein the fluororesin is dispersed as a filler in the outermost layer.   The electrostatic chuck apparatus according to claim 9, wherein the filler has a particle size of 0.01 μm to 10 μm.

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