JP4677397B2 - Electrostatic adsorption method - Google Patents

Description

  The present invention relates to a method for electrostatically attracting an object to be attracted using a bipolar electrostatic chuck device.

The electrostatic chuck device is a device that electrostatically attracts an object to be attracted by applying a voltage to an electrode provided therein.
As an electrostatic chuck device, two types of electrostatic chuck devices of a monopolar type and a bipolar type are known. A monopolar electrostatic chuck apparatus adsorbs an object to be adsorbed by generating a potential difference between one electrode and one object to be adsorbed. The bipolar electrostatic chuck device adsorbs one object to be adsorbed by applying voltages having different polarities to the two electrodes and generating a potential difference between the two electrodes (for example, Patent Document 1).

However, a method of adsorbing two or more objects to be attracted to the electrostatic chuck device, and another object to be adsorbed while the object to be adsorbed on the electrostatic chuck device side is adsorbed. There is no known way to get things off.
JP 2004-235563 A

Therefore, an object of the present invention is to provide an electrostatic adsorption method in which two or more objects to be adsorbed are adsorbed to an electrostatic chuck device.
Another object of the present invention is to detach other objects to be adsorbed while adsorbing the objects to be adsorbed on the electrostatic chuck apparatus side, out of two or more objects to be adsorbed to the electrostatic chuck apparatus. It is to provide an electrostatic adsorption method.

In the electrostatic adsorption method of the present invention, n (n is an integer of 2 or more) objects to be adsorbed by applying a voltage having the same polarity to each electrode of an electrostatic chuck device having two or more electrodes. In which the electrostatic chuck is electrostatically attracted to the electrostatic chuck device by increasing the potential difference between the electrodes by bringing the potential of any one of the electrodes close to 0V. The present invention is characterized in that i objects (i is an integer of 1 to n-1) close to the electric chuck device are adsorbed and other objects to be adsorbed are separated from the electrostatic chuck device. To do.

  The electrode comprises a first electrode and a second electrode, the area of the second electrode is made larger than the area of the first electrode, and the potential difference between the first electrode and the second electrode is increased. When increasing, it is preferable to change the voltage of the second electrode without changing the voltage of the first electrode.

  The electrode comprises a first electrode and a second electrode, the area of the second electrode is made larger than the area of the first electrode, and the potential difference between the first electrode and the second electrode is increased. When increasing the voltage, it is preferable to change the voltage of the first electrode without changing the voltage of the second electrode.

According to the electrostatic adsorption method of the present invention, two or more objects to be adsorbed can be adsorbed to the electrostatic chuck device in a stacked state.
In addition, according to the electrostatic chucking method of the present invention, among the two or more objects to be attracted to the electrostatic chuck device, the object to be attracted on the electrostatic chuck device side is attracted and another attracted object is attracted. Things can be removed.

<Electrostatic chuck device>
FIG. 1 is a cross-sectional view showing an example of an electrostatic chuck device according to the present invention. The electrostatic chuck device 10 includes a substrate 20 and an electrode sheet 30 bonded to the substrate 20 via an adhesive layer 21.

(Electrode sheet)
In the electrode sheet 30, a pair of insulating organic films 31 and 32 are attached via an insulating adhesive layer 33, and the first electrode 34 and the second electrode 35 are alternately arranged in the insulating adhesive layer 33. Are arranged. The exposed surface of the insulating organic film 32 becomes an adsorption surface for adsorbing an object to be adsorbed.

  FIG. 2 is a front view of the electrode sheet 30. The first electrode 34 and the second electrode 35 are comb-shaped electrodes, and these comb-shaped electrodes are arranged on the same plane in a state where they are meshed with each other without contacting each other at a predetermined interval. The first electrode 34 and the second electrode 35 have terminals 36 and 37 formed at the tips of lead wires extending from the comb-like electrodes, respectively.

  In addition, the 1st electrode 34 and the 2nd electrode 35 may be formed in contact with the insulating organic film 31 as shown in FIG. 1, and as shown in FIG. It may be formed so as to be separated from 32, and may be formed in contact with the insulating organic film 32 as shown in FIG.

Examples of the material for the insulating organic films 31 and 32 include polyester (polyethylene terephthalate, etc.), polyolefin (polyethylene, etc.), polyimide, polyamide, polyamideimide, polyethersulfone, polyphenylene sulfide, polyetherketone, polyetherimide, Examples include triacetylcellulose, silicone rubber, and the like, and polyester, polyolefin, polyimide, silicone rubber, polyetherimide, and polyethersulfone are preferable, and polyimide is particularly preferable because of excellent insulation.
Examples of the commercially available polyimide film include trade name Kapton manufactured by Toray DuPont, trade name Upilex manufactured by Ube Industries, and trade name Apical manufactured by Kaneka.

  20-150 micrometers is preferable and, as for the thickness of the insulating organic films 31 and 32, 25-75 micrometers is more preferable. When the thickness of the insulating organic film 32 on the side that adsorbs the object to be adsorbed is less than 20 μm, the insulating property may be deteriorated due to scratches on the surface. When the thickness of the insulating organic film 32 exceeds 150 μm, there is a possibility that sufficient electrostatic adsorption force cannot be obtained.

  Examples of the insulating adhesive for the insulating adhesive layer 33 include epoxy resin, phenol resin, polyamide resin, acrylonitrile-butadiene copolymer, polyester resin, polyimide resin, silicone resin, styrene block copolymer, amine compound, bis Examples thereof include an adhesive mainly composed of one or more kinds of resins selected from maleimide compounds and the like.

  Epoxy resins include bisphenol, phenol novolac, cresol novolac, glycidyl ether, glycidyl ester, glycidylamine, trihydroxyphenylmethane, tetraglycidylphenolalkane, naphthalene, diglycidyldiphenylmethane, and diglycidyl. Bifunctional or higher functional epoxy resins such as biphenyl type can be mentioned, bisphenol type epoxy resin is preferable, and bisphenol A type epoxy resin is particularly preferable.

  The adhesive mainly composed of an epoxy resin contains curing agents such as imidazoles, tertiary amines, phenols, dicyandiamides, aromatic diamines, organic peroxides, and curing accelerators as necessary. May be.

  Examples of the phenol resin include novolak phenol resins such as alkylphenol resins, p-phenylphenol resins, and bisphenol A type phenol resins, resole phenol resins, and polyphenylparaphenol resins.

  Examples of the styrene block copolymer include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-butylene-styrene block copolymer (SEBS), Examples include styrene-ethylene-propylene-styrene copolymer (SEPS).

  As the 1st electrode 34 and the 2nd electrode 35, what patterned metal thin films, such as copper, aluminum, gold | metal | money, silver, platinum, chromium, nickel, tungsten, these alloys, is preferable. Examples of the metal thin film include those formed by vapor deposition, plating, sputtering, etc., those formed by applying and drying a conductive paste, and metal foils such as copper foil.

1-50 micrometers is preferable and, as for the thickness of the 1st electrode 34 and the 2nd electrode 35, 3-25 micrometers is more preferable. If the thickness of the electrode is less than 1 μm, it is difficult to form a uniform film, so that stable production becomes difficult. In addition, when the wiring from an external power supply device is joined by solder or the like, the strength of the joint is insufficient. There is a risk of becoming. When the thickness of the electrode exceeds 50 μm, the unevenness appearing on the attracting surface becomes prominent, and the flatness of the portion in contact with the object to be adsorbed is likely to be impaired. Adhesiveness on the surface is reduced, which may cause a reduction in adsorption force and instability. In addition, the insulating adhesive layer 33 to be electrically insulated between the first electrode 34 and the second electrode 35 may be insufficiently embedded, which may cause dielectric breakdown. If the thickness of the electrode is 25 μm or less, the insulating adhesive layer 33 to be electrically insulated between the first electrode 34 and the second electrode 35 can be sufficiently embedded, so that the electrostatic chuck device The insulation durability of 10 is improved.
The width of the first electrode 34 and the second electrode 35 is preferably 0.05 to 10 mm. If the width of the electrode is less than 0.05 mm, there is a possibility that electric field strength sufficient for electrostatic adsorption cannot be expressed. If the width of the electrode exceeds 10 mm, the repetition interval of the electric field strength for expressing the gradient force, which is a characteristic of the bipolar electrostatic chuck device, becomes too large, and there is a possibility that sufficient adsorption force cannot be expressed.
The distance between the first electrode 34 and the second electrode 35 is preferably 2 mm or less. When the distance between the electrodes exceeds 2 mm, a sufficient electrostatic force is not developed between the electrodes, and the adsorptive power may be insufficient.

(substrate)
Examples of the substrate 20 include an aluminum substrate, a stainless steel substrate, and a ceramic substrate.
Examples of the adhesive for the adhesive layer 21 include the same adhesives for the insulating adhesive layer 33.

<Adsorption method>
Hereinafter, the electrostatic adsorption method of the present invention using the electrostatic chuck device 10 will be described.

First, as shown in FIG. 5, the first adsorbent 41 and the second adsorbent 42 are placed on a stand 50 connected to the ground so that the first adsorbent 41 is on the upper side. Arrange them in layers. Next, the electrostatic chuck device 10 is moved on the first object to be attracted 41 with the electrode sheet 30 side facing down, and the electrode sheet 30 side is brought into contact with the surface of the first object to be attracted 41 (step A). ).
In addition, the 1st to-be-adsorbed object 41 and the 2nd to-be-adsorbed object 42 may slip | deviate.

  A voltage is applied to the first electrode 34 and the second electrode 35 (preferably, a voltage having the same polarity is applied), and as shown in FIG. At the same time, the second object 42 is adsorbed to the electrostatic chuck device 10 via the first object 41, and the electrostatic chuck device 10 is moved upward (step B).

  Next, after performing a predetermined process such as a dry etching process using plasma or the like, the potential difference between the first electrode 34 and the second electrode 35 is increased, and as shown in FIG. Only the second object to be adsorbed 42 is detached from the electrostatic chuck device 10 while the object 41 is adsorbed (step C).

  The first object to be attracted 41 that is still attracted to the electrostatic chuck device 10 is transported to the next step together with the electrostatic chuck device 10. Further, in this step, the potential difference between the first electrode 34 and the second electrode 35 is reduced (returned to the original state), and another second adsorbent is passed through the first adsorbent 41. May be attracted to the electrostatic chuck device 10.

In the present invention, the “conductor” refers to an object to be adsorbed having an electric conductivity of approximately 10 ⁶ S / cm or more in an environment where electrostatic adsorption is performed, and the “insulator” refers to an environment where electrostatic adsorption is performed. It refers to an object to be adsorbed having an electric conductivity of approximately 10 ⁻⁶ S / cm or less.
When the electric conductivity of one of the two types of adsorbents is approximately 10 ⁻⁶ S / cm or more and 10 ⁶ S / cm or less, which is a so-called “semiconductor”, the other adsorbent may be a conductor. For example, if the semiconductor is handled as an insulator and the other object to be adsorbed is an insulator, the semiconductor can be handled as a conductor.

The first adsorbent 41 is preferably an insulator or a semiconductor. Specifically, plate-like or film-like materials such as various types of glass, ceramics, and resins; plate-like materials of semiconductor materials such as single crystal silicon, polycrystalline silicon, amorphous silicon, and compound semiconductors (gallium arsenide, etc.); The composite etc. which shape | molded in plate shape combining these are mentioned.
A transparent electrode, an organic semiconductor material (pentacene, etc.), a fine electric circuit (TFT, etc.) color filter, various optical control films (antireflection film, etc.), etc. are formed on the surface or inside of the first adsorbent 41. These various structural members may be formed partially or entirely.

The second object to be adsorbed 42 is preferably a conductor or a semiconductor. Specifically, plates of various metals, various conductive resins, graphite carbon, etc .; plates of semiconductor materials such as single crystal silicon, polycrystalline silicon, amorphous silicon, compound semiconductors (gallium arsenide, etc.); insulation Examples include a composite in which a conductor or semiconductor thin film is formed on the surface of a body plate. Examples of the method for forming a conductor or semiconductor thin film include vapor deposition, sputtering, thermal spraying, coating, printing, and bonding.
Specific examples of the second object to be adsorbed 42 include a mask made of a conductor or a semiconductor for processing or protecting the surface of the first object to be adsorbed 41. The mask may be subjected to fine processing such as through-holes for processing, protrusions and irregularities for handling, and the like. As the second object to be adsorbed 42, a metal plate having an oxide film layer on the surface, for example, an aluminum plate having an alumite layer can be used.

  In step A, the voltage applied to the first electrode 34 and the second electrode 35 is zero. In step A, neither the first object to be adsorbed 41 nor the second object to be adsorbed 42 is adsorbed to the electrostatic chuck device 10.

In Step B, the voltage applied to the first electrode 34 and the second electrode 35 is a negative voltage when the first adsorbent 41 is easily positively charged, and the first adsorbent 41 is negative. When it is easy to be charged, if it is set to a positive voltage, electrostatic adsorption is likely to occur. For example, when the first object to be adsorbed 41 is a glass plate, the glass is easily positively charged. Therefore, when a negative voltage is applied to the first electrode 34 and the second electrode 35, the electrostatic adsorption can be effectively performed. .
The magnitude of the voltage to be applied needs to be set as appropriate according to the specifications of the electrostatic chuck device 10 and the mass and shape of the first object 41 and the second object 42. That is, the distance from the electrode to the attracting surface of the first object to be attracted 41 varies depending on the electrostatic chuck device 10. The distance from the electrode to the second object to be adsorbed 42 is also related to the thickness of the first object to be adsorbed 41. Usually, the longer the distance, the higher the absolute value of the voltage required for electrostatic adsorption. For example, the insulating organic film 31 is polyimide having a thickness of 50 μm, and the first adsorbent 41 is A glass plate having a thickness of 0.7 mm, the second object to be adsorbed 42 is a stainless steel plate having a thickness of 0.3 mm, and the areas of the first object to be adsorbed 41 and the second object to be adsorbed 42 are the same. In the case where the entire surface of the attracting surface is attracted so that it does not protrude from the electrostatic chuck device 10, the voltage applied to the first electrode 34 and the second electrode 35 is −2.0 kV to −10. 0.0 kV is preferable, and −2.0 kV to −6.0 kV is more preferable. If the applied voltage is within this range, the first adsorbent 41 and the second adsorbent 42 can be held without dropping even if the adsorption surface is directed vertically downward. If the absolute value of the voltage is greater than 10.0 kV, it will be difficult to maintain electrical insulation with various insulating materials constituting the electrostatic chuck device.

In step B, the potential difference between the first electrode 34 and the second electrode 35 is reduced (the voltages applied to the first electrode 34 and the second electrode 35 are made substantially the same). The attracted object 41 and the second attracted object 42 are attracted to the electrostatic chuck device 10. The potential difference is determined by the materials, thicknesses, and the like of the first object to be adsorbed 41 and the second object to be adsorbed 42, and cannot be defined unconditionally. In the case of a combination example of the glass plate, stainless steel plate and electrostatic chuck device, the potential difference is preferably 0 to 1.0 kV, more preferably 0.
The potential difference is an absolute value of the difference between the voltage of the first electrode 34 and the voltage of the second electrode 35.

  In Step C, the potential difference between the first electrode 34 and the second electrode 35 is made larger than the potential difference in Step B, so that the second object to be adsorbed remains adsorbed to the second object. Only the adsorbed material 42 is detached from the electrostatic chuck device 10. The potential difference is determined by the materials, thicknesses, and the like of the first object to be adsorbed 41 and the second object to be adsorbed 42, and cannot be defined unconditionally. In the case of a combination example of the glass plate, stainless steel plate, and electrostatic chuck device, the potential difference is preferably 2.0 kV or more, and more preferably 2.5 kV or more.

Examples of a method for increasing the potential difference between the first electrode 34 and the second electrode 35 include the following methods.
(A) A method of lowering the voltage of one of the first electrode 34 and the second electrode 35 without changing one of the voltages.
(B) A method of increasing the voltage of one of the first electrode 34 and the second electrode 35 without changing one of the voltages.
(C) A method of raising one voltage of the first electrode 34 and the second electrode 35 and lowering the other voltage.

  In the method, when the voltage applied to the first electrode 34 and the second electrode 35 is a positive voltage, the second object 42 is reliably adsorbed while the first object 41 is adsorbed. The method (b) is preferable because only the resin can be detached from the electrostatic chuck device 10.

  In the case of the methods (a) and (b), when the difference in electrical conductivity between the two types of objects to be adsorbed is relatively large, the first electrode 34 and the second electrode 35 have different electrostatic areas. By using the chuck device 10 and changing the voltage applied to the electrode having the larger area, the areas of the first electrode 34 and the second electrode 35 are smaller than when the same electrostatic chuck device 10 is used. Only the second object to be adsorbed 42 can be separated by the amount of change in voltage. On the other hand, when the difference in electrical conductivity between the two types of objects to be adsorbed is relatively small, the electrostatic chuck device 10 having different areas of the first electrode 34 and the second electrode 35 is used. By changing the voltage applied to the first electrode 34 and the second electrode 35, the amount of change in voltage must be increased as compared with the case where the electrostatic chuck device 10 having the same area is used. Fine adjustment for separating only the second object to be adsorbed 42 is facilitated. The electrostatic chuck device 10 having the same area of the first electrode 34 and the second electrode 35 is used, or the electrostatic chuck device 10 having different areas of the first electrode 34 and the second electrode 35 is used. If they are different, the voltage to be applied to which electrode is changed according to the combination of the first object to be adsorbed 41 and the second object to be adsorbed 42 so as to be easily controlled by the practitioner of the present invention. Just choose.

  In the electrostatic chucking method of the present invention described above, since the voltage having the same polarity is applied to the first electrode 34 and the second electrode 35, the first chucked object 41 is attached to the electrostatic chuck device. At the same time, the second object to be adsorbed 42 can be adsorbed to the electrostatic chuck device 10 via the first object to be adsorbed 41.

  In addition, if the potential difference between the first electrode 34 and the second electrode 35 is increased while the first electrode 34 and the second electrode 35 are attracted to the electrostatic chuck device 10, Only the second object to be adsorbed 42 can be detached from the electrostatic chuck device 10 while the adsorbed object 41 is adsorbed.

The electrostatic chuck device in the present invention is not limited to the electrostatic chuck device 10 in the illustrated example, and may be an electrostatic chuck device having three or more electrodes. When there are p electrodes (p is an integer of 2 or more), the electrodes are divided into two groups [q groups and (pq) groups] (q is 1 or more and (p-1) or less. And may be carried out according to the method of (a), (b) or (c).
Further, the number of objects to be attracted to the electrostatic chuck device is not limited to two, and may be three or more.

  When n objects (n is an integer of 2 or more) are adsorbed, by increasing the potential difference between the electrodes, i objects (i is 1 or more and n-1 or less) close to the electrostatic chuck device. The other objects to be adsorbed can be detached from the electrostatic chuck device while adsorbing the objects to be adsorbed. The number of n can be changed by adjusting the voltage applied to the electrodes, and the number of i can be changed by adjusting the potential difference between the electrodes.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

As the electrostatic chuck device, bipolar electrostatic chuck devices (1) and (2) having a configuration shown in FIGS. 1 and 2 and a monopolar electrostatic chuck device (3) were prepared.
Electrostatic chuck device (1): Size of electrode sheet: 150 mm × 150 mm, width of first electrode and second electrode: 1.5 mm, distance between first electrode and second electrode: 1.5 mm , Substrate: aluminum substrate, insulating organic film: polyimide film.
Electrostatic chuck device (2): Size of electrode sheet: 150 mm × 150 mm, width of first electrode: 1.0 mm, width of second electrode: 2.0 mm, first electrode and second electrode Spacing: 1.5 mm, the area of the second electrode is twice the area of the first electrode, substrate: aluminum substrate, insulating organic film: polyimide film.
Electrostatic chuck device (3): electrode sheet size: 150 mm × 150 mm, electrode size: 148 mm × 148 mm, substrate: aluminum substrate, insulating organic film: polyimide film.

Two types of objects to be adsorbed were prepared as objects to be adsorbed.
Glass plate (first adsorbent, insulator): Pyrex (registered trademark) glass plate having a size of 120 mm × 120 mm and a thickness of 0.7 mm.
Stainless steel plate (second object to be adsorbed, conductor): stainless steel plate having a size of 130 mm × 130 mm and a thickness of 0.3 mm.

[Example 1]
A stainless steel plate was placed on a horizontal laboratory bench connected to earth, and a glass plate was stacked on the stainless steel plate.
(I) The electrostatic chuck device (1) was moved on the glass plate with the electrode sheet side facing down, and the electrode sheet side was brought into contact with the surface of the glass plate without applying a voltage to the electrode.
(Ii) When a voltage of −4.0 kV is simultaneously applied to the first electrode and the second electrode and the electrostatic chuck device (1) is gently moved upward, the glass plate and the stainless steel plate are moved to the electrostatic chuck device. It was confirmed that (1) was adsorbed. It was kept for 3 minutes.

(Iii) While maintaining the voltage of the first electrode at −4.0 kV, the voltage of the second electrode was changed in the positive direction at a speed of +1.0 kV / sec.
(Iv) When the voltage of the second electrode becomes −0.5 kV, only the stainless steel plate is detached from the electrostatic chuck device (1) and dropped, and the glass plate is adsorbed to the electrostatic chuck device (1). It was up to.

[Example 2]
A stainless steel plate was placed on a horizontal laboratory bench connected to earth, and a glass plate was stacked on the stainless steel plate.
(I) The electrostatic chuck device (1) was moved on the glass plate with the electrode sheet side facing down, and the electrode sheet side was brought into contact with the surface of the glass plate without applying a voltage to the electrode.
(Ii) A voltage of −4.3 kV was simultaneously applied to the first electrode and a voltage of −3.7 kV was applied to the second electrode, and the electrostatic chuck device (1) was gently moved upward. It was confirmed that the stainless steel plate was adsorbed to the electrostatic chuck device (1). It was kept for 3 minutes.

(Iii) While maintaining the voltage of the first electrode at −4.3 kV, the voltage of the second electrode was changed in the positive direction at a speed of +1.0 kV / sec.
(Iv) When the voltage of the second electrode becomes −0.7 kV, only the stainless steel plate is detached from the electrostatic chuck device (1) and dropped, and the glass plate is adsorbed to the electrostatic chuck device (1). It was up to.

Example 3
A stainless steel plate was placed on a horizontal laboratory bench connected to earth, and a glass plate was stacked on the stainless steel plate.
(I) The electrostatic chuck device (2) was moved on the glass plate with the electrode sheet side facing down, and the electrode sheet side was brought into contact with the surface of the glass plate without applying a voltage to the electrode.
(Ii) When a voltage of −4.0 kV is simultaneously applied to the first electrode and the second electrode and the electrostatic chuck device (2) is gently moved upward, the glass plate and the stainless steel plate are moved to the electrostatic chuck device. It was confirmed that it was adsorbed in (2). It was kept for 3 minutes.

(Iii) While maintaining the voltage of the first electrode at −4.0 kV, the voltage of the second electrode was changed in the positive direction at a speed of +1.0 kV / sec.
(Iv) When the voltage of the second electrode becomes −1.3 kV, only the stainless steel plate is detached from the electrostatic chuck device (2) and dropped, and the glass plate is adsorbed to the electrostatic chuck device (2). It was up to.
When the above operation was repeated twice more, the same result was obtained and it was confirmed that there was reproducibility.

Example 4
A stainless steel plate was placed on a horizontal laboratory bench connected to earth, and a glass plate was stacked on the stainless steel plate.
(I) The electrostatic chuck device (2) was moved on the glass plate with the electrode sheet side facing down, and the electrode sheet side was brought into contact with the surface of the glass plate without applying a voltage to the electrode.
(Ii) When a voltage of −4.0 kV is simultaneously applied to the first electrode and the second electrode and the electrostatic chuck device (2) is gently moved upward, the glass plate and the stainless steel plate are moved to the electrostatic chuck device. It was confirmed that it was adsorbed in (2). It was kept for 3 minutes.

(Iii) While maintaining the voltage of the second electrode at −4.0 kV, the voltage of the first electrode was changed in the positive direction at a speed of +1.0 kV / sec.
(Iv) When the voltage of the first electrode becomes −0.2 kV, only the stainless steel plate is detached from the electrostatic chuck device (2) and dropped, and the glass plate is adsorbed to the electrostatic chuck device (2). It was up to.

[Comparative Example 1]
A stainless steel plate was placed on a horizontal laboratory bench connected to earth, and a glass plate was stacked on the stainless steel plate.
(I) The electrostatic chuck device (3) was moved on the glass plate with the electrode sheet side facing down, and the electrode sheet side was brought into contact with the surface of the glass plate without applying a voltage to the electrode.
(Ii) When a voltage of −4.0 kV was applied to the electrode and the electrostatic chuck device (3) was gently moved upward, the glass plate and the stainless steel plate were attracted to the electrostatic chuck device (3). confirmed. It was kept for 3 minutes.

(Iii) The voltage of the electrode was changed in the positive direction at a speed of +1.0 kV / sec.
(Iv) When the voltage of the electrode became −1.3 kV, the glass plate and the stainless steel plate were detached from the electrostatic chuck device (3) and dropped.

  According to the electrostatic adsorption method of the present invention, when the surface of the first object to be adsorbed such as a glass substrate for a flat panel display device is covered with the second object to be adsorbed such as a metal mask, various processes are performed. The second object to be adsorbed can be securely fixed and only the second object to be adsorbed can be easily detached after the processing is completed, and the first object to be adsorbed can be transferred to the next step. The production efficiency of glass substrates for panel display devices can be improved.

It is sectional drawing which shows an example of the electrostatic chuck apparatus in this invention. It is a front view which shows an example of an electrode sheet. It is sectional drawing which shows the other example of the electrostatic chuck apparatus in this invention. It is sectional drawing which shows the other example of the electrostatic chuck apparatus in this invention. It is sectional drawing which shows a mode that the 1st to-be-adsorbed object and the 2nd to-be-adsorbed object were piled up on the stand. It is sectional drawing which shows a mode that the 1st to-be-adsorbed object and the 2nd to-be-adsorbed object were made to adsorb | suck to an electrostatic chuck apparatus. It is sectional drawing which shows a mode that only the 2nd to-be-adsorbed object was made to detach | leave from an electrostatic chuck apparatus.

Explanation of symbols

10 electrostatic chuck device 34 first electrode 35 second electrode 41 first object to be adsorbed 42 second object to be adsorbed

Claims (3)

The electrostatic chuck is applied in a state where n (n is an integer of 2 or more) adherents are stacked by applying a voltage having the same polarity to each electrode of the electrostatic chuck device having two or more electrodes. An electrostatic adsorption method for adsorbing to an apparatus ,
By making the potential of any one of the electrodes close to 0 V and increasing the potential difference between the electrodes, i pieces (i is an integer between 1 and n−1) close to the electrostatic chuck device. An electrostatic adsorption method in which another object to be adsorbed is detached from the electrostatic chuck device while the object to be adsorbed is adsorbed . The electrode comprises a first electrode and a second electrode;
Making the area of the second electrode larger than the area of the first electrode;
Wherein without changing the voltage of the first electrode, changing the voltage of the second electrode, the electrostatic adsorption method of claim 1. The electrode comprises a first electrode and a second electrode;
Making the area of the second electrode larger than the area of the first electrode;
Wherein without changing the voltage of the second electrode, changing the voltage of the first electrode, the electrostatic adsorption method of claim 1.

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