TWI491465B - The manufacturing method of fixed fixture and fixed fixture - Google Patents

Description

Fixing fixture manufacturing method and fixing fixture

The present invention relates to a method for producing a fixing jig for adsorbing and fixing a plate-shaped object to be cut or a cut product obtained by cutting the object to be cut, and a fixing jig manufactured by the manufacturing method.

The substrate is divided into a plurality of regions in a lattice shape, and after the wafer-shaped electronic components are mounted on the respective regions, the entire substrate is resin-sealed. The resin sealing body is cut by a rotary knife or the like, and cut into individual area units to become an electronic component.

In the cutting device for cutting the resin sealing body, a fixing jig for adsorbing and fixing the resin sealing body is provided. The fixture is formed by a base that is freely movable and rotatable, and a plate that is fixed to the base. The plate is provided with: an adsorption groove disposed in a concave space corresponding to a position of the plurality of regions in the resin sealing body; an adsorption hole disposed at a bottom of the adsorption groove; and a cutting groove for cutting the resin When the sealing body is used, it is passed through a rotary knife or the like. Each of the adsorption holes is connected to the exhaust pump through a through-channel provided in the base, and each region in the resin sealing body is also adsorbed and held by the respective adsorption grooves and adsorption holes at the time of cutting (Patent Document 1).

A conventional fixture as disclosed in Patent Document 1 is generally manufactured by the following method.

First, a metal substrate in which a plurality of through paths are provided in a lattice dot shape is produced.

Next, a plate made of a fluororubber or a fluororesin is drawn corresponding to the resin sealing body as a purpose. The plurality of regions are divided, and a cut groove is formed by machining on a single side along a line dividing the plurality of regions. Further, by the mechanical processing, the adsorption grooves are formed at positions corresponding to the plurality of through-passes, and the adsorption holes are formed at the bottom of each of the adsorption grooves.

Finally, the position of the plate is performed on the substrate in such a manner that the position of the adsorption hole coincides with the position of the through path, and the plate is then fixed to the substrate.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-202311

In recent years, the miniaturization of electronic components has been progressing, and on the other hand, in order to increase the manufacturing efficiency of electronic components, the demand for increasing the size of substrates and increasing the number of electronic components on one substrate has become stronger. As a result, the fixed jig is enlarged, and the division of the plates or the adsorption grooves and the adsorption holes are made smaller.

However, the manufacturing method of the conventional fixed jig described above has the following problems, and thus it is difficult to sufficiently satisfy such a demand.

(1) It is necessary to adsorb and hold the resin sealing body. Therefore, the board must have moderate flexibility, but it is difficult to perform meticulous machining on the board having flexibility, and it is particularly difficult to make an adsorption tank.

(2) When the machined board is subsequently fixed to the base, it is difficult to perform positioning due to the expansion and contraction of the board.

(3) The finer the machining, the more the manufacturing cost increases. Further, as described above, the board must have moderate flexibility, but it requires not only mechanical processing but also moderate hardness. Can use the above A fluororubber or fluororesin board is used as such a board, but these materials are expensive.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a fixed jig which can easily produce an adsorption tank and which is easy to position and which is inexpensive to manufacture, and a fixed treatment manufactured by the manufacturing method. With.

The present invention provides a method for producing a fixed jig, comprising: a plate having a cut object for adsorbing and holding a plate-shaped object to be cut and a cut object obtained by cutting the plate-shaped object to be cut. An adsorption tank and an adsorption hole disposed at a bottom of the adsorption tank; and a substrate fixed to the plate and having a through passage corresponding to the adsorption hole respectively; wherein: a) a molding step, the mold is molded The cavity is supplied with a room temperature curable liquid resin, the mold having: the cavity corresponding to the plate; and a convex portion disposed on a bottom surface of the cavity and corresponding to the adsorption groove; b) an abutting step of positioning the substrate And abutting on a surface of the mold to which the mold of the room temperature curable liquid resin is supplied in the cavity; c) a hardening step to cure the room temperature curable liquid resin; d) a demolding step by demolding a plate is formed on the substrate; and e) an adsorption hole forming step of forming an adsorption hole in the plate by perforating the plate through the through-pass.

As the room temperature curable liquid resin, specifically, a neon resin or a fluorine resin can be used.

The method for manufacturing the fixing jig of the present invention is to supply a room temperature curable liquid resin. After the mold is given to the mold cavity, the substrate is positioned relative to the mold surface of the mold, the resin is cured at room temperature, and the sheet is formed on the substrate by following the substrate.

Further, the adhesion to the substrate may be naturally followed by the curing of the resin. However, in order to further improve the adhesion strength, it is preferred to apply a primer to the surface of the substrate in advance.

In the manufacturing method, a mold having a convex portion corresponding to the adsorption groove is used on the bottom surface of the cavity, thereby eliminating the step of mechanically processing the adsorption groove on the plate.

Moreover, by positioning the substrate relative to the surface of the mold, the positioning of the plate relative to the substrate is relatively easy compared to conventional methods.

In the method of the present invention, as described above, the manufacturing cost is reduced by eliminating the mechanical processing steps of the adsorption tank. When an inexpensive xenon-based resin is used as the room temperature curable liquid resin, the production cost can be further suppressed.

Further, in the method of the present invention, by using a room temperature curable liquid resin, it is not necessary to heat the resin when it is cured. Assuming that a thermosetting liquid resin is used, when the substrate is made of metal, the resin is hardened by heating on the expanded substrate, and when it is cooled to normal temperature, the substrate is bent or shaken when the substrate shrinks. . In the present invention, such a problem can be avoided, and a fixed jig having a high dimensional accuracy can be manufactured.

In the method of the present invention, preferably, the base is provided with a protruding surface having a planar shape substantially the same as the opening of the cavity, and the protruding surface is inserted into the opening of the cavity in the abutting step. Thereby, the positioning of the board and the substrate can be made more precise.

In this case, in the above molding step, it is preferable that the room temperature curable liquid resin is supplied to the cavity slightly. Thereby, when the base is brought into contact with the mold surface of the mold in the abutting step, the room temperature curable liquid resin enters the base. The above-mentioned through-pass of the bottom improves the adhesion of the substrate to the cured resin, and the positioning of the two is more assured.

Further, the amount of the room temperature curable liquid resin supplied to the cavity is further increased, and when the substrate is brought into contact with the mold surface of the mold in the abutting step, the room temperature curable liquid resin may be penetrated from the substrate. The road overflows to the inside of the substrate. Thereby, the adhesion of the board after hardening of the resin to the substrate and the positioning of the two are more sure.

In either case, in the above-described adsorption hole forming step, the resin is perforated through the through-hole of the substrate, and the hardened resin is removed, so that the resin does not have a problem in entering the through-pass.

In the manufacturing method of the fixing jig of the present invention, since the plate is molded using a mold having a convex portion corresponding to the adsorption groove in the cavity, the adsorption groove of the desired shape can be easily produced.

Moreover, the positioning of the board relative to the substrate can be easily performed as compared to conventional methods.

Further, by eliminating the mechanical processing steps of the adsorption tank as described above, it is possible to achieve a reduction in manufacturing cost. When an inexpensive xenon-based resin is used as the room temperature curable liquid resin, the production cost can be further suppressed.

Thereby, a large-sized fixture having a fine adsorption tank and an adsorption hole can be easily manufactured at a low manufacturing cost.

Further, in the manufacturing method of the fixing jig of the present invention, the cutting groove is produced by mechanical processing in the same manner as in the prior art, but the cutting groove can be produced relatively easily and at low cost even by mechanical processing.

1‧‧‧fixed fixture

2‧‧‧ boards

3‧‧‧Base

10‧‧‧Mold

11‧‧‧ convex

13‧‧‧Mold surface

14‧‧‧ cavity

20‧‧‧Resin

21‧‧‧Area

22‧‧‧cutting trough

23‧‧‧Adsorption tank

24‧‧‧Adsorption holes

31‧‧‧Outstanding face

32‧‧‧through road

50‧‧‧ bubbles

61‧‧‧vacuum dryer

62‧‧‧ oven

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an overall perspective view of a fixed jig manufactured by a method of manufacturing a fixed jig according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view taken along the line A-A' of the fixing jig 1 of Fig. 1.

Figure 3 is a longitudinal sectional view of the mold 10 of the present embodiment.

Fig. 4 is a view showing the manufacturing steps of the fixing jig of the embodiment.

Hereinafter, an embodiment of a method for producing a fixed jig of the present invention will be described with reference to the drawings. Fig. 1 is an overall perspective view of a fixing jig 1 manufactured by the method of the present embodiment, and Fig. 2 is a cross-sectional view taken along line A-A' of the fixing jig 1 of Fig. 1.

The fixing jig 1 of the present embodiment is used to divide a substrate into a plurality of regions in a lattice shape, and after mounting a wafer-shaped electronic component in each region, the resin sealing body in which the entire substrate is resin-sealed is cut. The fixing jig 1 is composed of a rectangular base 3 having a rectangular projecting surface 31 projecting from the upper surface, and a plate 2 provided to cover the projecting surface 31.

The base 3 is made of metal, and a plurality of through passages 32 are provided in a lattice dot shape in a range having the protruding surface 31. In the present embodiment, five in the longitudinal direction of the fixed jig 1 and four in the width direction are provided, and a total of twenty through-passages 32 are provided.

In the plate 2, a room temperature-hardening liquid resin is formed into a plate shape, and the upper surface thereof is divided into a plurality of rectangular regions 21 by the cutting grooves 22 in accordance with the intended resin sealing body. The cutting groove 22 is a place where the rotary blade passes when the resin sealing body is cut. In the present embodiment, five in the longitudinal direction, four in the width direction, and a total of twenty regions 21 are provided in a lattice shape so as to be adjacent to the cutting groove 22. However, the arrangement and number of the regions 21 are not limited thereto. A space having a rectangular concave shape smaller than the area 21, that is, a suction groove 23 is formed in the region 21, and further, a bottom surface of the adsorption groove 23 The adsorption hole 24 is provided through.

The plate 2 is fixed to the protruding surface 31 of the base 3 at a position where each of the adsorption holes 24 communicates with each of the through passages 32 of the base 3. Each of the adsorption holes 24 is connected to an exhaust pump (not shown) through each of the through passages 32.

Next, a method of manufacturing the fixing jig 1 of the present embodiment will be described with reference to Figs. 3 and 4 . 3 is a longitudinal sectional view of a mold 10 for fabricating the sheet 2, and FIG. 4 is a view showing a manufacturing step of the fixing jig 1.

The mold 10 has a cavity 14 corresponding to one plate 2. The convex portion 11 corresponding to each of the adsorption grooves 23 of the plate 2 is disposed on the bottom surface of the cavity 14. The opening of the cavity 14 is substantially the same as the convex surface 31 of the base 3, but is designed to be slightly larger than the protruding surface 31 so that the protruding surface 31 of the base 3 can be inserted.

First, a xenon-based room temperature curable liquid resin 20 (hereinafter simply referred to as "resin 20") is injected into the cavity 14 of the mold 10 (step S1 in Fig. 4: corresponding to the "molding step" of the present invention). At this time, the liquid level of the resin 20 exceeds the mold surface 13 of the mold 10.

Further, the resin 20 described above is not limited to the oxime system, and a fluorine resin may also be used.

Next, the mold 10 is placed in a vacuum dryer 61 to which a dry rotary pump is attached, and the bubble 50 inside the resin 20 is removed by standing at a normal temperature of about 100 kPa for 20 minutes (step S2 of FIG. 4). ).

Further, a primer is applied to the protruding surface 31 of the base 3, and the protruding surface 31 is inserted into the opening of the cavity 14, and the base 3 is brought into contact with the mold surface 13 of the mold 10 (step S3: equivalent to the present invention) Abut the step"). The position of the substrate 3 relative to the mold surface 13 is determined by inserting the protruding surface 31 into the cavity 14.

If the substrate 3 is abutted against the mold surface 13 of the mold 10, the protruding surface 31 is used for the mold. The resin 20 inside the chamber 14 is pressurized, whereby the resin 20 enters the through-path 32 of the substrate 3 and overflows to the inside of the substrate 3. In this state, the mold 10 and the base 3 were allowed to stand at room temperature for 24 hours to completely cure the resin 20 (step S4: corresponding to the "hardening step" of the present invention). Thereby, the adhesion of the board 2 to the base 3 and the positioning of both are made true.

Further, if a thermosetting liquid resin is used, the resin is cured on the expanded substrate 3 by heating, and when cooled to a normal temperature, the substrate 3 is contracted, and the sheet 2 is bent or shaken. In the present embodiment, such a problem can be avoided by using a room temperature curable liquid resin, and a fixed jig 1 having a high dimensional accuracy can be manufactured.

After the resin 20 is cured, the mold 10 and the substrate 3 are placed in an oven 62, and heated at 100 ° C for 1 hour (step S5 of Fig. 4: corresponding to the "subsequent step" of the present invention). Thereby, the primer applied to the protruding surface 31 of the substrate 3 is hardened, and the resin 20 is firmly adhered to the protruding surface 31.

Further, the resin 20 may be substantially followed by the hardening of the resin 20 as long as sufficient adhesion strength is obtained for the substrate 3. In this case, no coating of the primer and subsequent steps are required.

Thereafter, the resin 20 reaching the inner side of the substrate 3 is removed, and the mold 10 is removed (step S6 of Fig. 4: corresponding to the "release step" of the present invention). Thereby, the plate 2 is formed on the protruding surface 31 of the base 3.

Finally, the cutting groove 22 is produced by a portion of the linear cutting plate 2 in which the adsorption groove 23 is not formed by a disk. Further, the through hole 32 is perforated by a drill, the resin 20 hardened inside the through passage 32 is removed, and the adsorption hole 24 is formed in the plate 2 (step S7: corresponding to the "adsorption hole" of the present invention Production steps"). In this way, the fixing jig 1 of the present embodiment can be obtained.

As described above, in the manufacturing method of the fixing jig 1 of the present invention, the plate 2 is molded using the mold 10 having the convex portion 11 corresponding to the adsorption groove 23 in the cavity 14, so that the desired shape can be easily produced. Adsorption tank 23.

Moreover, the positioning of the panel 2 relative to the substrate 3 can be easily performed as compared to conventional methods.

Further, by eliminating the machining step of the adsorption tank 23 as described above, the manufacturing cost can be reduced. When an inexpensive oxygen-based resin is used as the room temperature curable liquid resin 20, the production cost can be further suppressed.

Thereby, the large-sized fixed jig 1 having the fine adsorption tank 23 and the adsorption holes 24 can be easily manufactured at a low manufacturing cost.

Further, in the manufacturing method of the fixing jig of the present invention, the cutting groove 22 is produced by mechanical processing in the same manner as in the prior art, but the cutting groove 22 can be easily and inexpensively produced even by machining.

In the above embodiment, the shape of the plate 2 and the base 3 is rectangular, but other shapes may be adopted depending on the shape of the object to be cut which is held by the fixing jig 1 . Further, the shape of the adsorption groove 23 may be a circular shape or an elliptical shape.

Further, the amount of the resin 20 supplied to the mold 10 may be slightly less than the above amount (that is, the liquid level of the resin 20 exceeds the amount of the mold surface 13 of the mold 10), and the resin 20 is immersed in the through passage 32 of the substrate 3. The amount of the degree.

The resin 20 may be supplied to the mold 10, and the carbon dioxide may be added to the resin 20 to impart conductivity to the sheet 2. In the fixing jig 1 having such a plate 2, the generated static electricity can be eliminated when the resin sealing body is attached or detached, and thus the static electricity can be prevented from being damaged to the electronic components inside the resin sealing body.

Further, by using the resin 20 to which the transparent resin 20 or the pigment is added, the transparent plate 2 or the plate 2 of a desired color can be produced.

2‧‧‧ boards

3‧‧‧Base

10‧‧‧Mold

11‧‧‧ convex

13‧‧‧Mold surface

14‧‧‧ cavity

20‧‧‧Resin

21‧‧‧Area

22‧‧‧cutting trough

24‧‧‧Adsorption holes

31‧‧‧Outstanding face

32‧‧‧through road

50‧‧‧ bubbles

61‧‧‧vacuum dryer

62‧‧‧ oven

Claims (12)

A method for manufacturing a fixed jig, comprising: a plate having a suction groove for sucking and holding a plate-shaped object to be cut and a cutting object obtained by cutting the plate-shaped object to be cut, and setting An adsorption hole at the bottom of the adsorption tank; and a substrate fixed to the plate and having a through-path corresponding to the adsorption hole respectively; wherein: a) a molding step for supplying room temperature hardening in a cavity of the mold a liquid resin, the mold having: the cavity corresponding to the plate; and a convex portion disposed on a bottom surface of the cavity and corresponding to the adsorption groove; b) an abutting step of positioning and abutting the substrate The mold cavity is supplied with a mold surface of the mold of the room temperature curable liquid resin; c) a hardening step to cure the room temperature curable liquid resin; d) a demolding step of forming a plate by demolding the substrate And e) an adsorption hole production step of forming an adsorption hole in the plate by perforating the plate through the through-pass. The manufacturing method of the fixing jig according to the first aspect of the invention, wherein in the abutting step, a primer is applied to the surface of the substrate that is in contact with the mold surface of the mold, and after the hardening step And before the demolding step, there is: f) a step of adhering the room temperature curable liquid resin to the substrate by curing the primer. The method of manufacturing a fixed jig according to claim 1, wherein the base has a protruding surface having a planar shape substantially the same as an opening of the cavity, and the abutting step The protrusion surface is inserted into the opening of the cavity. The method of manufacturing a fixed jig according to claim 2, wherein the base has a protruding surface having a substantially planar shape identical to an opening of the cavity, and the protruding portion is formed in the abutting step The face is inserted into the opening of the above cavity. The method of manufacturing a fixed jig according to the third aspect of the invention, wherein the amount of the resin in which the room temperature curable liquid resin is impregnated into the through passage of the base in the abutting step is supplied to the above-mentioned molding step. Cavity cavity. The method for producing a fixed jig according to the third aspect of the invention, wherein in the abutting step, the amount of the resin of the room temperature curable liquid resin reaching the inner side of the base through the through passage of the base is in the forming step. Supply to the above cavity. The method of manufacturing a fixed jig according to the fourth aspect of the invention, wherein the amount of the resin in which the room temperature curable liquid resin is impregnated into the through passage of the base in the abutting step is supplied to the above-mentioned molding step. Cavity cavity. The method for producing a fixed jig according to the fourth aspect of the invention, wherein in the abutting step, the amount of the room temperature curable liquid resin reaches the inner side of the base through the through passage of the base, in the forming step Supply to the above cavity. The method for producing a fixed jig according to any one of claims 1 to 8, wherein the room temperature curable liquid resin is a neodymium resin. The method of manufacturing a fixed jig according to any one of claims 1 to 8, wherein after the demolding step, the cutting groove is formed by cutting the disk on the plate. The method of manufacturing a fixed jig according to any one of claims 1 to 8, wherein The plate is kept electrically conductive by adding carbon powder to the room temperature curable liquid resin before curing. A fixing jig includes: a plate having an adsorption groove for adsorbing and holding a plate-shaped object to be cut and a cutting object obtained by cutting the plate-shaped object to be cut, and a bottom of the adsorption groove provided at the bottom of the adsorption groove An adsorption hole; and a substrate for fixing the plate and having a through-path corresponding to the adsorption hole respectively; wherein the substrate is manufactured by the method of: a) forming step of supplying room temperature hardening in a cavity of the mold; a liquid resin comprising: the cavity corresponding to the plate; and a convex portion disposed on a bottom surface of the cavity and corresponding to the adsorption groove; b) an abutting step of positioning and abutting the substrate a mold surface of the mold to which the room temperature curable liquid resin is supplied in the cavity; c) a hardening step to cure the room temperature curable liquid resin; d) a demolding step formed by demolding on the substrate a plate; and e) an adsorption hole forming step of forming an adsorption hole in the plate by perforating the plate through the through-pass.