CN103974807A - Breathable sheet, method for adsorbing workpiece onto adsorption unit, and method for producing ceramic capacitor - Google Patents
Breathable sheet, method for adsorbing workpiece onto adsorption unit, and method for producing ceramic capacitor Download PDFInfo
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- CN103974807A CN103974807A CN201280053093.3A CN201280053093A CN103974807A CN 103974807 A CN103974807 A CN 103974807A CN 201280053093 A CN201280053093 A CN 201280053093A CN 103974807 A CN103974807 A CN 103974807A
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- sheet
- absorption
- gas permeability
- interarea
- resin molding
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- 238000000034 method Methods 0.000 title claims description 68
- 238000001179 sorption measurement Methods 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000003985 ceramic capacitor Substances 0.000 title claims description 25
- 229920005989 resin Polymers 0.000 claims abstract description 86
- 239000011347 resin Substances 0.000 claims abstract description 86
- 239000002245 particle Substances 0.000 claims abstract description 42
- 238000010521 absorption reaction Methods 0.000 claims description 151
- 230000035699 permeability Effects 0.000 claims description 80
- 238000000465 moulding Methods 0.000 claims description 76
- 239000000919 ceramic Substances 0.000 claims description 65
- 230000008569 process Effects 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 17
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000012528 membrane Substances 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 238000001354 calcination Methods 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 8
- 230000008020 evaporation Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 4
- 239000002033 PVDF binder Substances 0.000 claims description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 3
- -1 Merlon Polymers 0.000 claims 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims 1
- 239000011112 polyethylene naphthalate Substances 0.000 claims 1
- 239000007789 gas Substances 0.000 description 40
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 230000003746 surface roughness Effects 0.000 description 10
- 238000005530 etching Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010884 ion-beam technique Methods 0.000 description 6
- 238000001878 scanning electron micrograph Methods 0.000 description 6
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 5
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000007738 vacuum evaporation Methods 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000007844 bleaching agent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 241001036794 Microsorum maximum Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 1
- 229940077239 chlorous acid Drugs 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/308—Stacked capacitors made by transfer techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Filtering Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
This breathable sheet (4) is breathable in the thickness direction. The breathable sheet (4) is provided with: a resin film (9) in which are formed a plurality of straight holes (12) linearly passing through in the thickness direction; and a white-colored layer arranged atop a main surface (4b) of the resin film (9) and/or of white-colored particles (10) dispersed into the interior of the resin film (9). The diameter of the plurality of straight holes (12) is 20 mum or less. The whiteness of at least one main surface (4b) in the breathable sheet (4) is 70 or more. According to the breathable sheet (4), it is easy to visually check for adhered foreign matter.
Description
Technical field
The present invention relates to gas permeability sheet.The invention still further relates to and make operand thing be adsorbed onto the method on absorbing unit.The invention still further relates to the manufacture method of ceramic capacitor.
Background technology
In the electronic equipment such as mobile phone, PC, use ceramic capacitor.Ceramic capacitor is the charge storage element that utilizes dielectric effect, can store the electric charge corresponding with applied voltage by applying voltage.Ceramic capacitor uses in the wave filter of the coupling element of the signal that only extraction is expected etc. except denoising in the stand-by circuit or the power circuit etc. that for example make the stable smoothing circuit of supply voltage, holding circuit.
The general manufacture method of ceramic capacitor is as described below.First, the ceramic powder of the high-ks such as barium titanate is mixed with adhesive and organic solvent, prepare slurry.Then, slurry is applied on the stripping films such as PETG film, makes it dry, make ceramic green sheet.Then, by serigraphy, on ceramic green sheet, printing conductive body is stuck with paste, and forms electrode pattern.Then, to be formed with the ceramic green sheet of electrode pattern carry out overlapping, add thermo-compressed, and cut, carry out thus chip.Finally, the ceramic green sheet after chip is carried out to sintering, obtain ceramic capacitor.
In the manufacture method of above-mentioned ceramic capacitor, need to carry ceramic green sheet.In the conveying of ceramic green sheet, main employing used the absorption of metallicity adsorption head to fix conveying.But, in the fixing conveying of the absorption that uses metallicity adsorption head, cause the surface (interarea) of ceramic green sheet produce microlesion or adhere to spot because metallicity adsorption head contacts with ceramic green sheet sometimes, the quality of the ceramic capacitor of manufacturing reduces.For fear of the problems referred to above, between ceramic green sheet and ferrule, clamping has the sheet for absorption (for example, the porous resin sheet that comprises ultra-high molecular weight polyethylene (UHMWPE sheet) of patent documentation 1) of gas permeability.
Small-sized and the high capacity of ceramic capacitor develops, and the thin layerization of ceramic green sheet also develops.At present, developing the ceramic green sheet that thickness is approximately 1 μ m～approximately 2 μ m.Along with the thin layerization development of ceramic green sheet, ceramic green sheet self becomes has gas permeability, and the absorption of ceramic green sheet becomes difficulty.In addition, along with the thin layerization development of ceramic green sheet, the Van der Waals force between ceramic green sheet and mold release film increases, and the gravitation thereupon producing causes peeling off of ceramic green sheet to become difficulty.In order to address these problems, expect to improve the gas permeability of absorption sheet.
In order to improve the gas permeability of sheet, generally adopt the volume that increases ventilative path and the method that reduces air permeance resistance.For example, the in the situation that of porous chips, improve the gas permeability of sheet by increasing its aperture and/or porosity.But, using porous chips as absorption use sheet in the situation that, when hole diameter enlargement, ceramic green sheet is easily inhaled in the absorption use hole on sheet surface, thereby causes the distortion of ceramic green sheet and stacked bad.On the other hand, increase when porosity, absorption is easily out of shape when the absorption of ceramic green sheet with sheet, thereby causes the distortion of ceramic green sheet and stacked bad.In ceramic green sheet after filming, especially easily produce distortion and stacked bad problem.In patent documentation 2, in absorption, with in sheet, by being formed on the straight hole that on thickness direction, linearity connects, the aperture (opening footpath) that is used in the hole of guaranteeing gas permeability keeps littlely, and guarantees gas permeability.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2006-26981 communique
Patent documentation 2: TOHKEMY 2011-171728 communique
Summary of the invention
Invent problem to be solved
In the operation of conveying ceramic green sheet, the foreign matter of the black systems (black, green etc.) such as dust is attached on ceramic green sheet sometimes.If the foreign matter being attached on ceramic green sheet is attached to absorption with on sheet, absorption reduces by the gas permeability of sheet, is difficult to fixing absorption ceramic green sheet.In addition, if be attached with sheet under the state of foreign matter and utilize absorption sheet to adsorb ceramic green sheet in absorption, foreign matter is pressed against on ceramic green sheet, makes sometimes ceramic green sheet produce damage (concavo-convex).Such damage makes the quality of the ceramic capacitor of manufacturing reduce (for example, dielectric constant changes partly), carries out the current of thin layer at ceramic green sheet, should avoid especially such damage.
The absorption sheet of recording in patent documentation 2 is transparent.The color of adsorption head is also black system sometimes, and now, almost illegible is attached to the foreign matter on sheet for transparent absorption (the particularly foreign matter of black system), is difficult to remove foreign matter from this absorption sheet.In addition, do not have in the past that can to suppress suction, the gas permeability of ceramic green sheet high and can easily recognize the absorption sheet of the foreign matter self adhering to.
In addition, for be filtered the filter membrane of liquid, filter material, the ventilated membrane that breather filter is used etc. that air cleaner is used for filtering for, sometimes also expect that gas permeability is high, can easily recognize the foreign matter adhering to.
Based on such situation, the object of the present invention is to provide the gas permeability sheet with good gas permeability and the foreign matter that easily identification is adhered to.
For the means of dealing with problems
The invention provides a kind of gas permeability sheet, on thickness direction, there is gas permeability,
It possesses:
Be formed with multiple straight holes that on described thickness direction linearity connects resin molding and
Be dispersed in described resin molding inside white particles and/or be configured in the white layer on the interarea of described resin molding,
The aperture of described multiple straight holes is below 20 μ m,
The whiteness of measuring according to JIS P8123 of at least one interarea of this gas permeability sheet is more than 70.
From another side, the invention provides a kind of operand thing that makes and be adsorbed onto the method on absorbing unit, wherein,
Comprise and make operand thing be adsorbed onto the absorption process on the adsorption plane of absorbing unit by absorption sheet, described absorption prevents that with sheet described operand thing from directly contacting with described adsorption plane and on thickness direction, having a gas permeability,
Described absorption configures in the first interarea the second interarea relative with described adsorption plane and this absorption sheet mode relative with described operand thing of this absorption sheet with sheet,
Described absorption possesses the white particles of the inside that is formed with the resin molding of multiple straight holes that linearity connects on described thickness direction and is dispersed in described resin molding and/or is configured in the white layer on described the second interarea with sheet,
The aperture of described multiple straight holes is below 20 μ m,
Described absorption with the air permeability of the thickness direction of sheet with the Ge Erlai number of measuring according to JIS P8117 count 10 seconds/below 100mL, described absorption is more than 70 by the whiteness according to JISP8123 mensuration of described second interarea of sheet.
From another side, the invention provides a kind of manufacture method of ceramic capacitor, wherein,
Comprise:
Stripping process, make to be formed on ceramic green sheet in mold release film is adsorbed onto absorbing unit adsorption plane by absorption sheet and peel off from described mold release film, described absorption prevents that with sheet described ceramic green sheet from directly contacting with described adsorption plane and on thickness direction, having a gas permeability;
Stacked operation is carried the described ceramic green sheet stripping down under the state being adsorbed on described adsorption plane, and is carrying destination and other ceramic green sheets stacked; And
Calcination process, the duplexer of the described ceramic green sheet obtaining repeatedly carrying out repeatedly described stripping process and described stacked operation is calcined;
In described stripping process and described stacked operation, described absorption configures in the first interarea the second interarea relative with described adsorption plane and this absorption sheet mode relative with described ceramic green sheet of this absorption sheet with sheet,
Described absorption possesses the white particles of the inside that is formed with the resin molding of multiple straight holes that linearity connects on described thickness direction and is dispersed in described resin molding and/or is configured in the white layer on described the second interarea with sheet,
The aperture of described multiple straight holes is below 20 μ m,
Described absorption with the air permeability of the thickness direction of sheet with the Ge Erlai number of measuring according to JIS P8117 count 10 seconds/below 100mL, described absorption is more than 70 by the whiteness according to JISP8123 mensuration of described second interarea of sheet.
Invention effect
In gas permeability sheet of the present invention, be formed with multiple straight holes that linearity connects on the thickness direction of resin molding, the aperture of straight hole is below 20 μ m.While using such gas permeability sheet to use sheet as absorption, can suppress operand thing and be inhaled into the hole (opening) of the interarea that is present in this absorption sheet, and can effectively adsorb this operand thing.
In addition, in gas permeability sheet of the present invention, at the inner dispersion adularescent particle of resin molding, and/or dispose white layer on the interarea of resin molding, the whiteness of measuring according to JIS P8123 of at least one interarea of gas permeability sheet is more than 70.In the case of using with sheet such gas permeability sheet as absorption, for example, if become operand thing (by the whiteness of sheet as the interarea of more than 70 sides taking absorption, ceramic green sheet) mode of side configures absorption sheet, and easily identification is attached to the foreign matter (the particularly foreign matter of black system) on this interarea.
In addition, gas permeability sheet of the present invention also can be suitable for use in the ventilated membrane that the filter membrane that is filtered liquid for filtering, filter material that air cleaner is used or breather filter are used.
In addition, make absorption that operand thing uses in being adsorbed onto the method on absorbing unit with being formed with straight hole in sheet of the present invention, this absorption with the air permeability of sheet be 10 seconds/below 100mL, therefore, according to this adsorption method, can suppress the suction of operand thing, and adsorption operations object effectively.In addition, the absorption using in this adsorption method is more than 70 by the whiteness of the second interarea of sheet, and easily identification is attached to the foreign matter on the second interarea, therefore can easily remove foreign matter.Therefore, can reduce the possibility that the foreign matter because being attached on the second interarea damages operand thing.
In addition, the absorption using in the manufacture method of ceramic capacitor of the present invention is with being formed with straight hole in sheet, this absorption with the air permeability of sheet be 10 seconds/below 100mL, therefore, according to this manufacture method, can suppress the suction of ceramic green sheet, and can effectively adsorb ceramic green sheet.In addition, the absorption using in this manufacture method is more than 70 by the whiteness of the second interarea of sheet, and easily identification is attached to the foreign matter on the second interarea, therefore can easily remove foreign matter.Therefore, can reduce the possibility that the foreign matter because being attached on the second interarea reduces the quality of the damage of operand thing, ceramic capacitor.
Brief description of the drawings
Fig. 1 be schematically illustrated use the first embodiment absorption sheet, make operand thing be adsorbed onto the sectional view of an example of the method on absorbing unit.
Fig. 2 is the stereogram of sheet for the absorption of the first embodiment.
Fig. 3 is the top view of the sheet of the absorption shown in Fig. 2.
Fig. 4 is the sectional view of the sheet of the absorption shown in Fig. 2.
Fig. 5 A is the schematic diagram that the stripping process of an example of the manufacture method of ceramic capacitor is shown.
Fig. 5 B is the schematic diagram that the stacked operation of an example of the manufacture method of ceramic capacitor is shown.
Fig. 5 C is the schematic diagram that the calcination process of an example of the manufacture method of ceramic capacitor is shown.
Fig. 6 is the stereogram of sheet for the absorption of the second embodiment.
Fig. 7 is the top view of the sheet of the absorption shown in Fig. 6.
Fig. 8 is the sectional view of the sheet of the absorption shown in Fig. 6.
Fig. 9 is the SEM image of the interarea of sample A.
Figure 10 is the SEM image of the interarea of sample C.
Figure 11 is the SEM image of the interarea of sample H.
Detailed description of the invention
Below, with reference to accompanying drawing, embodiments of the present invention are described.
(the first embodiment)
In the first embodiment, to using gas permeability sheet to describe as the absorption mode of sheet.Below, the absorption that uses present embodiment is described by method sheet, that operand thing is adsorbed onto on absorbing unit.In the absorption process shown in Fig. 1, adsorption operations object 15 on absorbing unit 14 (for example, ceramic green sheet).The sheet 4 for absorption shown in allocation plan 1 on the adsorption plane 13 of absorbing unit 14, operand thing 15 uses sheet 4 to be adsorbed onto on adsorption plane 13 by absorption.Particularly, absorption configures with the mode of operand thing 15 relative (contacts) with the first interarea 4a relative with adsorption plane 13 (contact) and the absorption second interarea 4b of sheet 4 of absorption sheet 4 with sheet 4.Absorbing unit 14 is connected with the pump (not shown) that makes absorbing unit 14 produce attraction.On the adsorption plane 13 of the absorbing unit 14 shown in Fig. 1, be formed with multiple holes 16, on the adsorption plane 13 of absorbing unit 14, produce attraction by hole 16.The whiteness of the second interarea 4b is high, therefore, even be attached with foreign matter on the second interarea 4b, also can easily recognize the foreign matter (details as described later) adhering to.It should be noted that, typically, the range L 1 of the formation of absorbing unit 14 porose 16 is narrower than the range L of operand thing 15 2.
Fig. 2 illustrates the sheet 4 for absorption of the first embodiment of the present invention.Absorption is the sheets on thickness direction with gas permeability with sheet 4, possesses resin molding 9 and the white particles 10 of inside that is dispersed in resin molding 9.Top view when through-thickness is observed to absorption with sheet 4 is shown in Fig. 3.In addition, the sectional view of using the cross section cut-out absorption parallel with thickness direction to obtain with sheet 4 is shown in to Fig. 4.
Absorption is more than 70 by the whiteness of measuring according to JIS P8123 of an interarea (the second interarea 4b) of sheet 4, is preferably more than 75, more preferably more than 80.Absorption can regulate according to content and the particle diameter of the white particles 10 of absorption sheet 4 by the whiteness of the second interarea 4b of sheet 4.
If reduce the transmission of visible light of absorption sheet 4, the discovery of foreign matter becomes easy.Consider from this viewpoint, absorption is preferably below 60% with the transmission of visible light of the thickness direction of sheet 4, more preferably below 50%.
Absorption with the air permeability of the thickness direction of sheet 4 counting for example 10 seconds/below 100mL, to be preferably 3 seconds according to the Ge Erlai number of JIS P8117 mensuration/below 100mL.Absorption can regulate according to the density (surface density) of the aperture of the straight hole of resin molding 9 12 (details as described later) and straight hole 12 with the air permeability of sheet 4.
From utilizing operand thing 15 and absorption to prevent operand thing 15 with the friction of sheet 4 in the viewpoint misplacing by the vertical direction of the thickness direction of sheet 4 with absorption and avoiding making the surface of operand thing 15 to produce the viewpoint consideration of microlesion, preferably absorption is level and smooth sheet with sheet 4.Consider from this viewpoint, while mensuration according to JIS B0601, absorption is preferably below 1.0 μ m with the arithmetic average roughness Ra on the surface (the second interarea 4b) of sheet 4, below 0.6 μ m, for example, is more preferably 0.07～1.0 μ m.Maximum height Rmax is preferably below 2.0 μ m, below 1.5 μ m, for example, is more preferably 0.1～2.0 μ m.
The film of resin molding 9 for comprising macromolecule resin.The size of resin molding 9 is not particularly limited, and the thickness of resin molding 9 is for example 10～200 μ m.
Resin molding 9 is nonporous membrane, is formed with multiple straight holes 12 that linearity connects on thickness direction on resin molding 9.Resin molding 9 has gas permeability on thickness direction.It should be noted that non-porous referring to, except this straight hole 12, do not have the hole in the ventilative path that becomes thickness direction.Resin molding 9 typically is the film that there is no hole except this straight hole 12.
The aperture (opening footpath) of the straight hole 12 of resin molding 9 is below 20 μ m.Thus, can suppress operand thing 15 is inhaled in the hole (opening) that is present in the second interarea 4b that adsorbs use sheet 4.When the aperture of straight hole 12 exceedes 20 μ m, operand thing 15 easily sucks and is present in the straight hole 12 of the second interarea 4b.In addition, even if be unlikely to cause suction, also can mark on the surface of operand thing 15 vestige of opening, easily make thus the thickness of operand thing 15 produce deviation.In the situation that operand thing 15 is ceramic green sheet, the deviation of the thickness of sheet is relevant to the stacked bad generation of ceramic green sheet in stacked operation.The aperture of straight hole 12 is preferably below 10 μ m.This fine straight hole 12 for example can form by ion beam irradiation and etching.The lower limit in the aperture (opening footpath) of straight hole 12 can so that absorption with the air permeability of sheet 4 counting 10 seconds according to the Ge Erlai number of JISP8117 mensuration/mode below 100mL determines.This lower limit is for example 0.8 μ m.
The shape of overlooking (while observation along the thickness direction of absorption sheet 4) of straight hole 12 is not particularly limited, and as its opening shape, can illustrate circular and unsetting.In resin molding 9, the opening shape of overlooking of straight hole 12 is for circular.In addition, the cross sectional shape of straight hole 12 (shape of the straight hole 12 in the cross section parallel with thickness direction) is also not particularly limited, and can illustrate rectangle, the shape that trapezoidal, central fovea is entered.In resin molding 9, the cross sectional shape of straight hole 12 is rectangle.As the three-dimensional shape of straight hole 12, can illustrate cylindrical, truncated cone, hourglass shape (bottom surface of the side that 2 frustum of a cone combinations and area are separately little connects and the shape that obtains).In resin molding 9, the three-dimensional shape of straight hole 12 is cylindrical.
The axis of straight hole 12 extends conventionally in the direction vertical with the interarea of resin molding 9.As long as this straight hole 12 runs through the thickness direction (utilize this straight hole 12, guarantee thickness direction ventilative of resin molding 9) of resin molding 9, can tilt with respect to the direction vertical with interarea.In addition, 2 above straight holes 12 can connect.
The material that forms resin molding 9 is not particularly limited.Resin molding 9 is for example made up of the material that utilizes ion beam irradiation and etching to form above-mentioned straight hole 12.Such material etch processes liquid that contains alkaline matter and/or oxidant of for example serving as reasons decomposes the material of (having water-disintegrable and/or oxidation Decomposition).Alkaline matter is for example potassium hydroxide, NaOH.Oxidant is for example chlorous acid and salt thereof, hypochlorous acid and salt thereof, hydrogen peroxide, potassium permanganate.
As the material of resin molding 9, for example, can from be selected from least one material PETG (PET), Merlon (PC), polyimides (PI), PEN (PEN) and polyvinylidene fluoride (PVdF), select.These resins serve as reasons contain alkaline matter and/or oxidant etch processes liquid decompose material.PI decomposes as the etch processes liquid of main component by containing clorox.Other resins decompose as the etch processes liquid of main component by containing NaOH.
As the material of resin molding 9, preferably PET.If utilize PET to form resin molding 9, the second interarea 4b of this resin molding 9 becomes smoothly, can suppress the distortion of operand thing 15 in the time utilizing absorption with sheet 4 adsorption operations object 15.Particularly, if form resin molding 9 by PET, can make to measure according to JIS B0601 time, the surperficial surface roughness Ra of when white particles 10 (omit) resin molding 9 is approximately 0.05 μ m, making maximum height Rmax is approximately 0.1 μ m.For UHMWPE sheet, consider that surperficial surface roughness Ra is that approximately 0.5 μ m, maximum height Rmax are approximately 15 μ m, with regard to quantitative aspect, PET is also the preferred material of resin molding 9, uses the absorption sheet 4 of the resin molding 9 that comprises PET to be suitable for the absorption of operand thing 15.The thickness and precision of the resin molding 9 being made up of PET in addition, is can be at sheet thick is in the scope of 12.5～100 μ m to be approximately ± 2 μ m.This thickness and precision with by surface modulation to the thickness and precision of level and smooth UHMWP porous chips (± 5 μ m) compared with, very good.
The porosity of resin molding 9 is not particularly limited.The viewpoint of the distortion of absorption sheet 4 is considered when suppressing the absorption of operand thing 15, is preferably below 40%, more preferably below 30%.Even in the case of the porosity of resin molding 9 is so low, owing to forming the shape of straight hole 12 in its ventilative path, resin molding 9 (i.e. sheet 4 for absorption) also has very high gas permeability.
Can implement to of resin molding 9 face (the second interarea 4b) coating of the release property for improving this face.Coating for example has the coating of the compound of the effect that reduces surperficial coefficient of friction for fluorochemical etc.Thus, the release property that operand thing 15 (ceramic green sheet) is peeled off from absorbing unit 14 is improved.
Also can be upper so that the mode that the opening of the straight hole 12 of this face exposes disposes adhesive at of resin molding 9 face (the second interarea 4b).The kind of adhesive is not particularly limited.As long as meet the afore mentioned rules relevant to the air permeability of resin molding 9, at least a portion of the opening of straight hole 12 is exposed.
In the present embodiment, white particles 10 is scattered in the inside of resin molding 9.As the concrete example of resin molding 9 that is dispersed with white particles 10, can enumerate: by the white PET that disperses Titanium particles to make in the pet polymer solution that comprises terephthalic acid (TPA) and ethylene glycol.
The particle diameter of white particles 10 is not particularly limited, if but excessive, absorption is difficult to bleach (, whiteness is difficult to increase) by the color of sheet 4.On the other hand, if too small, absorption may excessively reduce by the intensity of sheet 4.Consider these factors, the scope of the particle diameter of white particles 10 is for example 300nm～5 μ m, is preferably 500nm～5 μ m, more preferably 500nm～2 μ m.If the particle diameter of white particles 10 is less than the opening footpath of straight hole 12, white particles 10 can occlusion of openings, easily guarantees gas permeability.
In addition, the content of white particles 10 is also not particularly limited, if but too high, absorption becomes excessive sometimes by the surface roughness of the second interarea 4b of sheet 4.On the other hand, if too low, absorption is difficult to bleach by the color of sheet 4.Consider these factors, the content of the white particles 10 when adsorbing weight by sheet 4 entirety as benchmark, for example as 1～10 % by weight, is preferably 3～8 % by weight, more preferably 3～5 % by weight.
As the particle that forms white particles 10, can enumerate inorganic particulate (particle that comprises inorganic matter), particularly, can enumerate: Titanium particles, Zirconia particles, silicon oxide particle, aluminium oxide particles etc.Particularly, while using Titanium particles, absorption improves by the weatherability of sheet 4, can long term maintenance adsorb the whiteness with sheet 4.
In the past, used porous UHMWPE sheet as absorption sheet.But, for porous chips, become the out-of-shape in the hole in ventilative path, usually change along ventilative path, and between hole, intricately connects.Therefore,, for having the porous chips in the aperture identical with the aperture of the straight hole 12 of resin molding 9, compared with this resin molding 9, air permeance resistance significantly increases, gas permeability variation.In addition, porous chips not only has gas permeability on the thickness direction of this sheet, and also has gas permeability on in-plane, therefore, in the time using with sheet as absorption, the side leakage that can produce so-called absorption affinity.In the time using gas permeability absorption low and generation side leakage to use sheet, in order to adsorb the operand things such as ceramic green sheet, need to can change (particularly adsorbing the end absorption affinity reduction of using sheet) with the position of sheet according to absorption compared with large suction pressure and absorption affinity, therefore, in the time of absorption, easily produce the distortion of operand thing.
On the other hand, in resin molding 9, the perforation direction that becomes the straight hole 12 in ventilative path is the thickness direction of resin molding 9, and the shape of straight hole 12 also changes hardly on ventilative path.Absorption has such resin molding 9 with sheet 4, and therefore, the air permeance resistance of thickness direction is very low, has good gas permeability, and becomes the sheet that there is no side leakage.
In addition, absorption is more than 70 by the whiteness of sheet 4, therefore, and the foreign matter (the particularly foreign matter of the black such as black, green system) that easily identification is adhered to., according to the sheet 4 for absorption of present embodiment, can guarantee good gas permeability, and can easily recognize the foreign matter adhering to.
Then, use absorption is described by an example of the manufacture method of the ceramic capacitor of sheet 4.This manufacture method comprises: stripping process, makes to be formed on ceramic green sheet in mold release film is adsorbed onto absorbing unit adsorption plane by above-mentioned absorption sheet and peel off from mold release film; Stacked operation: the ceramic green sheet stripping down is carried under the state being adsorbed on adsorption plane and carried destination and other ceramic green sheets stacked; And calcination process, the duplexer of the ceramic green sheet obtaining repeatedly carrying out repeatedly stripping process and stacked operation is calcined.Herein, in stripping process and stacked operation, as long as absorption configures by the mode that sheet is relative with adsorption plane with the first above-mentioned interarea and above-mentioned the second interarea is relative with ceramic green sheet, the details of each operation is not particularly limited, can be according to known method.
With reference to Fig. 5 A～Fig. 5 C, an example of the manufacture method to ceramic capacitor describes.
In the stripping process shown in Fig. 5 A, the ceramic green sheet 22 (with reference to Fig. 5 A (1)) that makes to be formed in mold release film 21 is adsorbed onto on the adsorption plane 13 of absorbing unit 14, peels off (with reference to (2), (3) of Fig. 5 A) from mold release film 21.On the surface of adsorption plane 13, dispose above-mentioned sheet 4 for absorption, ceramic green sheet 22 uses sheet 4 to be adsorbed on adsorption plane 13 by absorption.
In the stacked operation shown in Fig. 5 B, the ceramic green sheet stripping down in stripping process 22 is carried under the state being adsorbed on adsorption plane 13, and carried destination and other ceramic green sheets 22 stacked (with reference to (1)～(3) of Fig. 5 B).
In the calcination process shown in Fig. 5 C, the duplexer 23 of the ceramic green sheet 22 obtaining repeatedly carrying out repeatedly the stacked operation shown in the stripping process shown in Fig. 5 A and Fig. 5 B is calcined (S in Fig. 5 C represents calcining), obtains calcined body 24.Then, the operation of process configured electrodes on calcined body 24 etc., obtain ceramic capacitor.In Fig. 5 C, for figure is easily understood, the quantity of the layer that forms duplexer 23 is set as to 8 layers, but in fact, can be by repeatedly carrying out stripping process and stacked operation stacked more ceramic green sheet 22.
In stripping process and stacked operation, absorption configures with the mode of ceramic green sheet 22 relative (contacts) with the first interarea 4a relative with adsorption plane 13 (contact) and the absorption second interarea 4b of sheet 4 of absorption sheet 4 with sheet 4.The whiteness of the second interarea 4b is high, therefore, even be attached with foreign matter on the second interarea 4b, also can easily recognize accompanying foreign matter.
The details of the stripping process in the manufacture method of the ceramic capacitor of present embodiment, stacked operation and calcination process can be according to the manufacture method of known ceramic capacitor.In addition, the manufacture method of the ceramic capacitor of present embodiment also can comprise stripping process, stacked operation and calcination process any operation in addition as required.
(the second embodiment)
Fig. 6 illustrates the sheet 104 for absorption as the gas permeability sheet of the second embodiment of the present invention.Absorption shown in Fig. 6 possesses resin molding 109 and white layer 131 with sheet 104.Top view when through-thickness is observed to absorption with sheet 104 is shown in Fig. 7.In addition, the sectional view of using the cross section cut-out absorption parallel with thickness direction to obtain with sheet 104 is shown in to Fig. 8.
Resin molding 109 is film identical with resin molding 9 except not being dispersed with white particles in inside.On resin molding 109, be formed with the straight hole same with straight hole 12 112.
White layer 131, for comprising the layer of the material same with the material of white particles 10, is configured in absorption with on an interarea (the second interarea 104b in Fig. 6) of sheet 104.White layer 131 can form by being for example coated with preformed white particles 110 (white particles that comprises the material same with the material of white particles 10).White layer 131 can form by film forming technologies such as sputtering method, vapour deposition method, CVD methods.According to film forming technology, can make white layer 131 (, the second interarea 104b) level and smooth.Now, can make the surface roughness arithmetic average roughness Ra of the second interarea 104b is 0.3～0.5 μ m, and making maximum height Rmax is 0.4～0.6 μ m.In addition, if whiteness is more than 70, the thickness of white layer 131 is not particularly limited, for example, be 0.025～1 μ m, is preferably 0.05～0.1 μ m.
In addition, in the present embodiment, between resin molding 109 and white layer 131, be folded with basalis 132.Basalis 132 contacts with resin molding 109 and white layer 131.The layer of basalis 132 for reducing for the light transmission that makes absorption sheet 104.While there is 132 layers of basalises, the transmission of visible light that can make thickness direction, for for example below 10%, is preferably below 5%, more preferably below 3%.But, as long as absorption is more than 70 by the whiteness of sheet 104, can omit basalis 132.
The material that forms basalis 132 can be for being for example selected from least one in metal, metal carbides, metal nitride, metal oxide and metal fluoride.As preferred basalis 132, can enumerate alumina layer.When basalis 132 is alumina layer, consider it is favourable from viewpoint, the viewpoint of easy degree of manufacture (sputter) and the viewpoint of the easy degree of operation of viewpoint, heat resistance and the insulating properties of cost.
The method that forms white layer 131 and basalis 132 is not particularly limited.In the time forming alumina layer as basalis 132, for example, can on resin molding 109, pile up aluminium oxide by sputter, evaporation (vacuum evaporation), other film forming technologies.In addition, while forming basalis 132, on basalis 132, form white layer 131.The method that forms white layer 131 is not particularly limited, and can form white layer 131 by evaporation.The example of the white layer 131 of piling up by evaporation is the layer that comprises titanium oxide.In addition, compared with not forming the situation of basalis 132, while forming basalis 132, easily pile up white layer 132.; manufacture method according to following absorption with sheet; can be applicable to making absorption sheet, described absorption possesses by the manufacture method of sheet: it is the operation of the resin molding of the multiple straight holes below 20 μ m that preparation is formed with on thickness direction linearity perforation and aperture, by sputtering at the operation of piling up the operation of basalis on this resin molding and piling up white layer on basalis.It should be noted that, also can adopt the operation of preparing the operation of resin base material and utilize ion beam irradiation and etching to form to connect multiple straight holes that the mode of resin base material extends on thickness direction to replace the operation of preparing resin molding.
In the situation that not forming basalis, can make absorption sheet by the manufacture method of sheet by following absorption, described absorption possesses by the manufacture method of sheet: preparation be formed with on thickness direction linearity perforation and aperture be the multiple straight holes below 20 μ m resin molding operation and on resin molding, pile up the operation of white layer.Now, can on resin molding, form white layer by evaporation (vacuum evaporation), coating etc.Like this, can suitably obtain possessing white layer and resin molding directly contacts with white layer and comprises resin molding and this two-layer absorption sheet of white layer.Comprise resin molding and this two-layer absorption of white layer does not form basalis with sheet by making, can cut down Master Cost and cut down manufacturing process.
In the present embodiment, absorption with the interarea of a side contrary with a side that is formed with white layer 131 in the interarea of sheet 104 be the first interarea 104a be should be relative with adsorption plane 13 interarea, the interarea that is formed with a side of white layer 131 be the second interarea 104b be should be relative with operand thing 15 (ceramic green sheet 22) interarea.The second interarea 104b is made up of white layer 131.
It should be noted that, in the first embodiment and the second embodiment, to using gas permeability sheet to be illustrated as the absorption example of sheet, but above-mentioned gas permeability sheet also can be applied in the filter membrane that is filtered liquid for filtering, other purposes such as filter material, the ventilated membrane that breather filter is used that air cleaner is used.
Embodiment
(embodiment 1)
In embodiment 1, make the sample same with the absorption sheet 4 of the first embodiment shown in Fig. 2～Fig. 4.
First, prepare the sheet (Mitsubishi Plastics Inc manufactures, W-100) at inner dispersion adularescent particle.This sheet is to be the sheet of the atresia of the titanium oxide (white particles) of the particle diameter 1.0 μ m that contain 3.0 % by weight taking the weight of sheet entirety as benchmark in the PET film of 25 μ m at thickness.
Then, by ion beam irradiation and be etched on this sheet and form straight hole.The aperture of the straight hole obtaining is 1.0 μ m
, the porosity that forms the sheet after straight hole is 4.7%.The ionic species of the ion beam using in ion beam irradiation is Xe, and accelerating potential is 560MeV, and shot densities is 6.0 × 10
6individual ion/cm
2, vacuum is 10
-3pa level.The etching solution using in etching is 0.5M, the NaOH solution of approximately 60 DEG C.Like this, make sample A.
(embodiment 2)
Except changing etching condition, make similarly to Example 1 sample B.The etching solution using in etching in the making of sample B is 0.1～1.0M, the NaOH solution of 50～80 DEG C, and the processing time is 30～180 minutes.In sample B, straight hole is
, the porosity that forms the sheet after straight hole is 42%.
(embodiment 3)
In embodiment 3, make the sample same with the absorption sheet 104 of the second embodiment shown in Fig. 6～Fig. 8.
First, prepare to be formed with
straight hole and the porosity non-porous PI film that is 7.9%.Then, on the surface of this PI film, form alumina layer by sputter.Sputter in oxygen containing gas atmosphere and implement.In sputter, use sputter evaporation coating device (ULVC (ア of Co., Ltd. Le バ ッ Network) company manufactures, SMH-2306RE), vacuum is set as to 1Pa, voltage is set as to 500V, the time of sputter is set as to 2 minutes.
Then, on the surface of alumina layer, form white titanium oxide layer by vacuum evaporation.
In vacuum evaporation, use sputter evaporation coating device (ULVC company manufactures, SMH-2306RE), vacuum is set as to 1.0 × 10
-3below Pa.Like this, make sample C.
(comparative example 1)
Using except inside does not disperse titanium oxide with the PET film of the same atresia of PET film using in embodiment 1 as sample D.
(comparative example 2)
Using the PI film of atresia same with the PI film of preparing in embodiment 3 except not being formed with straight hole as sample E.
(comparative example 3)
Using the non-porous PI film that is formed with straight hole of preparing in embodiment 3 as sample F.
(comparative example 4)
The non-porous film obtaining form alumina layer similarly to Example 3 on the surface of the PI film of making in embodiment 3 is as sample G.It should be noted that, the thickness of this alumina layer is very thin, is not the situation that forms the white layer illustrating in the second embodiment.
(comparative example 5)
Be that 200 μ m, average pore size are that the UHMWPE porous chips (Dong electrician company manufacture, サ Application マ ッ プ LCT5320S) of 20 μ m is as sample H by thickness.
(comparative example 6)
Common copied to paper using as sample I.
For sample A～I, measure in the following manner the surface roughness of whiteness, transmission of visible light (transmission of visible light of thickness direction), aperture, Ge Erlai air permeability (the Ge Erlai air permeability of thickness direction) and surface (the second interarea, lower same).
[whiteness]
About whiteness, use colour difference meter (Japanese electricity Se Industrial Co., Ltd manufactures, ND-1001DP), by obtaining Hunter whiteness according to the mensuration of JIS P8123.
[transmission of visible light]
About transmission of visible light, use spectrophotometer (company of Hitachi Ltd. manufactures, U-4100), the wavelength region of 300～2700nm is measured.
[aperture]
Utilize SEM (JEOL company (Jeol Ltd.) manufacture, JSM-6510LV) to take the surface of each sample, according to the surperficial aperture of the each sample of SEM determining image obtaining.
[air permeability]
Ge Erlai number is evaluated, as air permeability.About Ge Erlai number, according to JIS P8117, use Ge Erlaishi air permeability instrument (peace field essence mechanism is done manufacturing) or Wang Yan formula air permeability experimental rig (rising sun Seiko is manufactured, EG02-S) to obtain.
[surface roughness]
Surface roughness is used contact pin type surface roughness meter (the goods, サ ー of Tokyo Seimitsu Co., Ltd Off コ system 550A) to measure.Condition determination is set as point diameter R250 μ m, speed 0.3mm/ second, measured length 4mm.As surface roughness, measure arithmetic average roughness Ra and maximum height Rmax.
Whiteness said determination, sample A～I, transmission of visible light, aperture, Ge Erlai air permeability and surface roughness are concluded and be recorded in table 1.In addition, the surperficial SEM image of sample A, sample C, sample H is shown in to Fig. 9～11.It should be noted that, the SEM image of Fig. 9 and Figure 10 is that multiplying power is set as to 5000 times of figure that take and obtain, and the SEM image of Figure 11 is that multiplying power is set as to 100 times of figure that take and obtain.
The aperture of ※ sample A～C and F～G represents the aperture of straight hole, and the aperture of sample H represents the aperture of loose structure.
As shown in table 1, the surperficial whiteness of sample A is 77.1, and the surperficial whiteness of sample B is 73.8, and the surperficial whiteness of sample C is 75.1.That is, for sample A～C, surperficial whiteness is more than 70, and therefore, in the time using with sheet as absorption, easily identification is attached to the foreign matter that the lip-deep black of this absorption sheet is.
The aperture of the straight hole of sample A is 1.0 μ m, and the aperture of the straight hole of sample B is 3.0 μ m, and the aperture of the straight hole of sample C is 5.0 μ m.In addition, the Ge Erlai air permeability of sample A is 8.79 seconds/100mL, and the Ge Erlai air permeability of sample B is 2.47 seconds/100mL, and the Ge Erlai air permeability of sample C is 3.59 seconds/100mL.That is, for sample A～C, aperture be the following and Ge Erlai air permeability of 20 μ m be 10 seconds/below 100mL, therefore, in the time using with sheet as absorption, can suppress the suction of operand thing and effectively adsorb this operand thing.
On the other hand, for sample D～G, the whiteness on surface is less than 70, therefore, using sample D～G as absorption while using with sheet, almost illegible is attached to the foreign matter of this absorption with the black system on sheet.In addition, for sample D～E and sample H～I, Ge Erlai air permeability is greater than 10 seconds/100mL, therefore, is difficult to adsorption operations object effectively.
Claims (15)
1. a gas permeability sheet has gas permeability on thickness direction,
It possesses:
Be formed with multiple straight holes that on described thickness direction linearity connects resin molding and
Be dispersed in described resin molding inside white particles and/or be configured in the white layer on the interarea of described resin molding,
The aperture of described multiple straight holes is below 20 μ m,
The whiteness of measuring according to JIS P8123 of at least one interarea of this gas permeability sheet is more than 70.
2. gas permeability sheet as claimed in claim 1, wherein, the transmission of visible light of described thickness direction is below 60%.
3. gas permeability sheet as claimed in claim 1, wherein, possesses described white layer, and possesses and be folded in the basalis contacting between described resin molding and described white layer and with described white layer.
4. gas permeability sheet as claimed in claim 3, wherein, described basalis is the alumina layer forming by evaporation aluminium oxide.
5. gas permeability sheet as claimed in claim 1, wherein, described white particles and/or described white layer comprise inorganic matter.
6. gas permeability sheet as claimed in claim 5, wherein, described white particles and/or described white layer comprise titanium oxide.
7. gas permeability sheet as claimed in claim 6, wherein, possesses the described white layer forming by evaporation titanium oxide.
8. gas permeability sheet as claimed in claim 1, wherein, described resin molding comprises at least one resin being selected from PETG, Merlon, polyimides, PEN and polyvinylidene fluoride.
9. gas permeability sheet as claimed in claim 1, wherein, the air permeability of the thickness direction of this gas permeability sheet with according to JIS P8117 measure Ge Erlai number count 10 seconds/below 100mL.
10. an absorption sheet, it possesses gas permeability sheet claimed in claim 1.
11. 1 kinds of filter membranes, are filtered liquid for filtering, and wherein, possess gas permeability sheet claimed in claim 1.
12. 1 kinds of filter materials, the filter material that it is used for air cleaner, wherein, possesses gas permeability sheet claimed in claim 1.
13. 1 kinds of ventilated membranes, the ventilated membrane that it is used for breather filter, wherein, possesses gas permeability sheet claimed in claim 1.
14. 1 kinds make operand thing be adsorbed onto the method on absorbing unit, wherein,
Comprise and make operand thing be adsorbed onto the absorption process on the adsorption plane of absorbing unit by absorption sheet, described absorption prevents that with sheet described operand thing from directly contacting with described adsorption plane and on thickness direction, having a gas permeability,
Described absorption configures in the first interarea the second interarea relative with described adsorption plane and this absorption sheet mode relative with described operand thing of this absorption sheet with sheet,
Described absorption possesses the white particles of the inside that is formed with the resin molding of multiple straight holes that linearity connects on described thickness direction and is dispersed in described resin molding and/or is configured in the white layer on described the second interarea with sheet,
The aperture of described multiple straight holes is below 20 μ m,
Described absorption with the air permeability of the thickness direction of sheet with the Ge Erlai number of measuring according to JIS P8117 count 10 seconds/below 100mL, described absorption is more than 70 by the whiteness according to JISP8123 mensuration of described second interarea of sheet.
The manufacture method of 15. 1 kinds of ceramic capacitors, wherein,
Comprise:
Stripping process, make to be formed on ceramic green sheet in mold release film is adsorbed onto absorbing unit adsorption plane by absorption sheet and peel off from described mold release film, described absorption prevents that with sheet described ceramic green sheet from directly contacting with described adsorption plane and on thickness direction, having a gas permeability;
Stacked operation is carried the described ceramic green sheet stripping down under the state being adsorbed on described adsorption plane, and is carrying destination and other ceramic green sheets stacked; And
Calcination process, the duplexer of the described ceramic green sheet obtaining repeatedly carrying out repeatedly described stripping process and described stacked operation is calcined;
In described stripping process and described stacked operation, described absorption configures in the first interarea the second interarea relative with described adsorption plane and this absorption sheet mode relative with described ceramic green sheet of this absorption sheet with sheet,
Described absorption possesses the white particles of the inside that is formed with the resin molding of multiple straight holes that linearity connects on described thickness direction and is dispersed in described resin molding and/or is configured in the white layer on described the second interarea with sheet,
The aperture of described multiple straight holes is below 20 μ m,
Described absorption with the air permeability of the thickness direction of sheet with the Ge Erlai number of measuring according to JIS P8117 count 10 seconds/below 100mL, described absorption is more than 70 by the whiteness according to JISP8123 mensuration of described second interarea of sheet.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2011-237213 | 2011-10-28 | ||
| JP2011237213 | 2011-10-28 | ||
| PCT/JP2012/006788 WO2013061579A1 (en) | 2011-10-28 | 2012-10-23 | Breathable sheet, method for adsorbing workpiece onto adsorption unit, and method for producing ceramic capacitor |
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| CN103974807A true CN103974807A (en) | 2014-08-06 |
| CN103974807B CN103974807B (en) | 2015-09-09 |
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| CN201280053093.3A Expired - Fee Related CN103974807B (en) | 2011-10-28 | 2012-10-23 | Gas permeability sheet, operand thing is made to be adsorbed onto the manufacture method of method on absorbing unit and ceramic capacitor |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5941821B2 (en) |
| KR (1) | KR20140085537A (en) |
| CN (1) | CN103974807B (en) |
| WO (1) | WO2013061579A1 (en) |
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| CN110386457A (en) * | 2018-04-17 | 2019-10-29 | 威光自动化设备（南京）有限公司 | Negative pressure adsorber for special-shaped sheet article |
| TWI682948B (en) * | 2015-04-30 | 2020-01-21 | 日商日東電工股份有限公司 | Polymer resin film, gas-permeable membrane, sound-permeable membrane, acoustic resistor, gas-permeable membrane member, sound-permeable membrane member, acoustic resistor member, acoustic device, and manufacturing method of polymer resin membrane |
| CN111463014A (en) * | 2019-01-22 | 2020-07-28 | 三星电机株式会社 | Capacitor assembly and method of manufacturing the same |
| CN112399325A (en) * | 2019-08-15 | 2021-02-23 | 新科实业有限公司 | Thin film filter, thin film filter substrate, MEMS microphone, and method for manufacturing the same |
| CN113226752A (en) * | 2018-12-28 | 2021-08-06 | 日东电工株式会社 | Breathable adhesive sheet and breathable product |
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| JP6396737B2 (en) * | 2014-09-24 | 2018-09-26 | 日東電工株式会社 | Adsorption sheet, adsorption method of work object to adsorption unit, and ceramic capacitor manufacturing method |
| CN108995200B (en) * | 2018-08-28 | 2023-06-30 | 莱芜钢铁集团有限公司 | Gas extraction type film laying device and method |
| JP7421894B2 (en) * | 2019-09-30 | 2024-01-25 | 富士紡ホールディングス株式会社 | Resin sheet for adhering objects to the surface |
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| WO2011089926A1 (en) * | 2010-01-25 | 2011-07-28 | 日東電工株式会社 | Method of suction of object to be worked upon suction unit and method of manufacture of ceramic capacitor |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20140085537A (en) | 2014-07-07 |
| JP5941821B2 (en) | 2016-06-29 |
| WO2013061579A1 (en) | 2013-05-02 |
| CN103974807B (en) | 2015-09-09 |
| JP2013108066A (en) | 2013-06-06 |
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