JP6215635B2 - Laminate and film capacitor - Google Patents

Description

  The present invention relates to a laminate and a film capacitor.

  The film capacitor has, for example, a metal film formed by vapor deposition on the surface of a dielectric film obtained by filming a polypropylene resin as an electrode. With such a configuration, even when a short-circuit occurs in an insulation defect portion of the dielectric film, the metal film around the defect portion is evaporated and scattered by the short-circuit energy to insulate and prevent dielectric breakdown of the film capacitor. It has an advantage (see, for example, Patent Document 1).

  For this reason, film capacitors are attracting attention because they can prevent ignition and electric shock when electrical circuits are short-circuited, and in recent years, they have been applied to power supply circuits such as LED (Light Emitting Diode) lighting, and their use has expanded. (For example, see Patent Document 2).

  In addition, as with other electronic components, there is an increasing demand for miniaturization of film capacitors, and attempts have been made to make dielectric films thinner. However, when the dielectric film is made thinner, the surface roughness of the dielectric film becomes smaller and smoother. For example, workability when forming a conductor layer on the surface of the dielectric film, There is a case where the winding property or the like in the case of producing an element becomes a problem, and there is a problem that a defect occurs in the dielectric film or the electrode, or the adhesion of the dielectric film becomes non-uniform.

JP 9-129475 A JP 2010-178571 A

  The present invention has been made in view of the above-described problems, and uses a dielectric film having excellent slidability and excellent handling properties in a winding process and the like, and a laminate and a film with less defects and more uniform adhesion of the dielectric film The object is to provide a capacitor.

The laminate of the present invention is a laminate in which a plurality of dielectric films containing a metal oxide, a resin, and a metal alkoxide are laminated via an electrode layer, and the first main surface of the dielectric film is a resin. And a plurality of flat hill-shaped portions including the metal oxide and projecting in a hill shape from the first resin surface, and the electrode layer is made of the dielectric film. The first electrode surface of the electrode layer that is provided on the second main surface and faces the first main surface is in contact with the hill-shaped portion, and the first electrode surface and the first electrode It has the space | gap between resin surfaces, It is characterized by the above-mentioned.
The laminate of the present invention is a laminate in which a plurality of dielectric films containing a metal oxide and a resin are laminated via an electrode layer, wherein the first main surface of the dielectric film is made of a resin. A first resin surface, and a plurality of flat hill-shaped portions including the metal oxide and protruding from the first resin surface in a hill shape, and the second main surface of the dielectric film Has a second resin surface made of resin and a plurality of flat island-shaped portions containing the metal oxide, and the second resin surface and the surfaces of the plurality of island-shaped portions are: The first electrode surface of the electrode layer facing the first main surface is in contact with the hill-shaped portion, being substantially flush or the electrode layer is provided on the second main surface. A gap is provided between the surface of the first electrode and the first resin surface.
Furthermore, the laminate of the present invention is a laminate in which a plurality of dielectric films containing a metal oxide and a resin are laminated via an electrode layer, and the first main surface of the dielectric film is a resin. And a plurality of flat hill-shaped portions including the metal oxide and protruding from the first resin surface in a hill shape, the second main surface of the dielectric film. The surface includes a second resin surface made of resin, and a plurality of flat island-shaped portions including the metal oxide and projecting in a hill shape from the second resin surface, and the electrode layer is The first electrode surface of the electrode layer that is provided on the second main surface and faces the first main surface is in contact with the hill-shaped portion, and the first electrode surface and the first electrode The area ratio occupied by the island-shaped portion having a gap between the resin surface and projecting in a hill shape on the second main surface is the first surface. It is larger than the area ratio occupied by the hill-shaped portion in the main surface.

  The film capacitor of the present invention includes the above-described laminate.

  According to the present invention, it is possible to obtain a laminate and a film capacitor in which there are few defects and the adhesion of the dielectric film is more uniform.

(A) is the perspective view which showed typically a part of laminated body which is one Embodiment of this invention, (b) is XX sectional drawing in (a). FIG. 9 is a schematic cross-sectional view showing another embodiment of the laminate of the present invention and showing that an island-shaped portion containing a metal oxide is substantially flush with a second resin surface of a dielectric film. The other aspect of the laminated body of this invention is shown, and it is a cross-sectional schematic diagram which shows that the island-shaped part containing a metal oxide protrudes in the shape of a hill from the 2nd resin surface of a dielectric film. It is an external appearance perspective view of a film capacitor.

  The laminated body and film capacitor of this invention are demonstrated based on FIGS. As shown in FIG. 1, the dielectric film 1 constituting the laminate according to one embodiment of the present invention includes a metal oxide 2 a and a resin 3, and the first main surface 1 </ b> A includes a resin 3. The first resin surface 3 </ b> A and a plurality of flat hill-shaped portions 2 including the metal oxide 2 a and protruding from the first resin surface 3 </ b> A in a hill shape are configured. Here, the hill shape refers to a flat shape in which, for example, the width and length of the skirt portion is approximately five times or more of the height. 1 to 3 exaggerate the lamination direction of the dielectric film for easy understanding, and do not reflect the actual dimensional relationship.

  On the other hand, the electrode layer 4 is formed on the second main surface 1B of the dielectric film 1, and the first electrode surface 4A of the electrode layer 4 and the first main surface 1A of the other dielectric film 1 are formed. A laminated body is formed by overlapping the dielectric films 1 so as to face each other. The laminated body here is one in which the dielectric films 1 and the electrode layers 4 are alternately overlapped. For example, the so-called rectangular dielectric films 1 and the electrode layers 4 are alternately laminated. In addition to the laminate, a structure in which the long dielectric film 1 and the electrode layer 4 are wound is included.

  In the present embodiment, the first electrode surface 4A and the first main surface 1A of the dielectric film 1 are in contact with each other at the hill-shaped portion 2, and the first electrode surface 4A and the first resin surface 3A are in contact with each other. It is important to have a gap 5 between them.

  The first electrode surface 4A and the first main surface 1A of the dielectric film 1 are in contact with each other at the hill-shaped portion 2, and there are gaps 5 between the first electrode surface 4A and the first resin surface 3A. As a result, the contact area between the first electrode surface 4A and the first main surface 1A of the dielectric film 1 is reduced, and the slip between the first electrode surface 4A and the first main surface 1A of the dielectric film 1 is reduced. Improves. As a result, even when the dielectric film 1 is wound in multiple layers, it is possible to reduce the stress generated by the restraint caused by the contact between the electrode layer 4 and the dielectric film 1, and the adhesion of the dielectric film 1 is further improved. In addition to uniforming, it is possible to suppress the occurrence of defects such as cracks caused by expansion of the dielectric film 1 when a voltage is applied by forming a film capacitor or the like.

  In addition, when it has the space | gap 5 between the 1st resin surface 3A and the 1st electrode surface 4A in this way, with the gas which exists in the space | gap 5, the 1st resin surface 3A, the 1st electrode surface 4A, A gas layer is formed between them, and the effect of improving the dielectric breakdown voltage (BDV) when a film capacitor or the like is formed is also obtained. As can be seen from Paschen's law, for example, when the gas layer is made of air at 1 atm, the thickness of the gap (the distance between the first resin surface 3A and the first electrode surface 4A), that is, In particular, when the thickness of the gas layer is 1000 nm or less, the BDV of the gas layer is about 300 V or more.

Although the metal oxide 2a may be exposed on the surface of the hill-shaped portion 2, it is preferable that a thin layer of an organic substance or the like is formed. This is because the metal oxide containing a metal component has higher adhesion to the metal constituting the electrode, and the organic material has higher slipping property with the first electrode surface 4A in contact with the hill-shaped portion 2 (lower coefficient of friction). ) Even when the metal oxide 2 a is exposed, it is preferable that the exposed portion is only part and the other most part is buried in the resin 3. Since most of the metal oxide 2 a is buried in the resin 3, it is possible to prevent the hill-shaped portion 2 from falling off the dielectric film 1.

  The size (average particle diameter) of the metal oxide 2a is preferably 10 to 250 nm because the aggregation of the metal oxide 2a is reduced and the metal oxide 2a is easily deformed when the metal oxides 2a come into contact with each other. .

  In addition, the area ratio of the hill-shaped portion 2 in the first main surface 1A of the dielectric film 1 is desirably 5 to 70%. When the area ratio occupied by the hill-shaped portion 2 is 5 to 70%, a sufficient gap 5 is obtained between the first resin surface 3A of the dielectric film 1 and the first electrode surface 4A to obtain slipperiness. It can be ensured, and the rigidity of the dielectric film 1 can be kept low, which is suitable for, for example, a wound film capacitor. Further, from the viewpoint of improving the breakdown voltage, it is preferable to have more voids 5, and the area ratio occupied by the hill-shaped portion 2 is preferably 60% or less, and more preferably 30% or less.

  Moreover, it is preferable that the hill-shaped part 5 contains the resin 3. When the hill-shaped portion 2 contains the resin 3, the hill-shaped portion 5 itself is easily deformed, and thus when the dielectric film 1 is wound, for example, a laminate having a smaller curvature radius. Can be realized. The ratio of the resin 3 contained in the hill-shaped part 2 may be 5 to 50% in terms of an area ratio, for example.

  At this time, the space (closest distance) between the hill-shaped portions 2 on the first main surface 1A of the dielectric film 1 secures the gap 5 between the first electrode surface 4A and the first resin surface 3A. It is desirable that it is 0.1-5 micrometers from the reason for doing. In addition, if the deformability of the dielectric film 1 can be maintained within a practical range, the hill-shaped portion 2 may be partially connected to another adjacent hill-shaped portion 2. Good.

  Moreover, in the other aspect of this invention, as shown in FIG. 2, 2nd main surface 1B in which the electrode layer 4 of the dielectric film 1 is formed is 2nd resin surface 3B which consists of resin 2, and metal A plurality of flat island-like portions 6 including the oxide 2a are provided. Here, the surface of the island-like portion 6 is substantially flush with the second resin surface 3B. When the surface of the island-shaped portion 6 is not substantially flush with the second resin surface 3B, that is, when the island-shaped portion 6 protrudes from the resin surface 3B, a step with the resin surface 3B occurs in the vicinity of the periphery of the island-shaped portion 6. The island-shaped portion 6 itself or the metal film that is the electrode layer 4 formed on the second main surface 1B may be peeled off from the dielectric film 1 starting from the step. When the surface and the second resin surface 3B are substantially flush, the possibility of such peeling is reduced, and the second main surface 1B of the dielectric film 1 and the metal film can be firmly adhered to each other. it can. Note that the surface of the island-shaped portion 6 is substantially flush with the second resin surface 3B includes the case where there is a step of about several nanometers between the island-shaped portion 6 and the second resin surface 3B. Meaning.

  The island-shaped part 6 may protrude in a hill shape from the second resin surface 3B as shown in FIG. In that case, it is preferable that the area ratio which the island-shaped part 6 occupies in the 2nd main surface 1B of the dielectric film 1 is larger than the area ratio which the hill-shaped part 2 occupies in the 1st main surface 1A. Thereby, the island-like portion 6 protrudes in a hill shape from the second resin surface 3B, and the second electrode surface 4B which is a surface facing the second resin surface 3B and the second main surface 1B of the electrode layer 4. Even if a gap is generated between the first main surface 1B and the second electrode surface 4B, the contact area between the second main surface 1B and the second electrode surface 4B is larger than the contact area between the first main surface 1A and the first electrode surface 4A. It becomes large and the adhesiveness of the 2nd main surface 1B and the 2nd electrode surface 4B improves.

  In particular, the area ratio occupied by the island-like portions 6 in the second main surface 1B is more preferably five times or more than the area ratio occupied by the hill-like portions 2 in the first main surface 1A.

  In addition, a gap may be interposed between the second resin surface 3B and the second electrode surface 4B, but it is preferable that the second resin surface 3B and the second electrode surface 4B are in close contact with each other in order to ensure the capacity when a film capacitor is used. .

  Furthermore, since the metal oxide 2a constituting the island-shaped portion 6 contains a metal component, the metal oxide 2a has high adhesiveness with the metal constituting the electrode layer 4, so that most of the metal oxide 2a is exposed on the surface of the island-shaped portion 6. However, even when a thin layer of an organic substance or the like is formed on the surface of the metal oxide 2a, if the thickness is 10 nm or less, the same effect as the state where the metal oxide 2a is exposed is obtained. Can be obtained.

  In addition, the area ratio of the island-like portion 6 in the second main surface 1B of the dielectric film 1 is desirably 5 to 70%. When the area ratio of the island-shaped portion 6 is 5 to 70%, the adhesion between the second main surface 1B of the dielectric film 1 and the second electrode surface 4B can be enhanced, and the island-shaped portion 6 Since the second resin surface 3 </ b> B having no surface is present, the rigidity of the dielectric film 1 can be kept low.

  Moreover, it is desirable that the ratio (area ratio) of the metal oxide 2a in the area of the island-shaped portion 6 is 70 to 95%. When the ratio (area ratio) of the metal oxide 2a in the area of the island-shaped portion 6 is 70 to 95%, the ratio of the metal oxide 2a having high adhesiveness with the metal constituting the electrode layer 4 is increased. The adhesion strength of the electrode layer 4 to the second main surface 1B of the dielectric film 1 can be further increased. Even in this case, since the island-shaped portion 6 contains the resin 3, the island-shaped portion 6 itself is easily deformed, and when the dielectric film 1 is wound by this, for example, It becomes possible to realize a laminate having a smaller radius of curvature. At this time, the distance between the island-like portions 6 on the second main surface 1B of the dielectric film 1 (the closest distance) is smaller than the region where the second electrode surface 4B and the second resin surface 3B are in contact with each other. For the reason that the possibility of peeling of the electrode layer 4 from the second main surface 1B can be reduced, 0.1 to 5 μm is desirable. In addition, if the deformability of the dielectric film 1 can be maintained within a practical range, the island-like portion 6 may be in a state where a part of the island-like portion 6 is connected to another adjacent island-like portion 6. Good. In this case, since the island-like portion 6 and the second electrode surface 4B have a continuous adhesive portion even in part, the second main surface 1B of the dielectric film 1 and the second electrode surface The adhesive force between 4B can be further increased.

  As the dielectric film 1 having the above-described configuration, a thin film having an average thickness of 3 μm, particularly 2 μm can be suitably used. Also, the arithmetic average roughness (Sa) of the main surfaces 1A and 1B is suitable to have a smooth surface of 50 nm or less, particularly 10 nm or less.

  Here, as the metal oxide 2a constituting the dielectric film 1 of the present embodiment, at least one selected from silicon oxide, titanium oxide, zirconium oxide, and aluminum oxide is preferable. Since these metal oxides 2a have a higher relative dielectric constant than that of the resin 3, it is possible to increase the dielectric constant of the dielectric film 1 obtained.

Moreover, the density | concentration of the metal component in the metal oxide 2a in the hill-shaped part 2 or the island-shaped part 6 is the hill-shaped part 2 or the island-shaped part 6 when the main surfaces 1A and 1B of the dielectric film 1 are viewed in plan. It differs in the central part and the peripheral part, or the surface side and the inner side of the hill-shaped part 2 in the cross section of the dielectric film, and as it goes from the central part to the peripheral part or from the surface side of the hill-shaped part 2 to the inner side. It is desirable that the concentration of the metal component decreases, in other words, the ratio of the organic component (for example, metal alkoxide) increases. When the ratio of the organic component contained in the metal oxide 2a is larger in the peripheral portion than in the central portion, the metal oxide 2a is in a state of being bonded to the resin 3 constituting the dielectric film 1, and the metal oxide The bonding strength of the metal oxide 2a to the dielectric film 1 can be increased as compared with the case where the object 2a is present in the resin 3 via a clear interface, such as ceramic particles.

  Regarding the state of the hill-like portion 2 of the dielectric film 1 and the presence or absence of the gap 5, for example, the surface from which the electrode layer 4 is removed from the dielectric film 1 of a laminate such as a film capacitor by a chemical method or a physical method, The cross section perpendicular to the stacking direction or winding axis of a laminate such as a film capacitor can be confirmed by observing it using an analyzer such as a scanning electron microscope (SEM).

  Such a laminate can be suitably used for a functional substrate such as a multilayer wiring board as well as a film capacitor. It can also be applied to various electronic parts such as actuators used in mobile camera drive units, artificial muscles, medical pumps, various sensors for detecting vibration, sound, acceleration, pressure, temperature, etc., and power generation elements. is there.

  FIG. 4 is an external perspective view of the film capacitor. The film capacitor of the present embodiment may be a laminated film capacitor using a so-called laminated body in which rectangular dielectric films 1 and electrode layers 4 are alternately laminated, or a long dielectric body. A winding type film capacitor using a laminate having a structure in which the film 1 and the electrode layer 4 are wound may be used. Even in the case of a multilayer film capacitor, the dielectric film 1 may be wound in the process, and defects generated in the process can be reduced by improving the slipperiness. In addition, the presence of the gap 5 provides the effect of improving the dielectric breakdown voltage (BDV) as described above regardless of the stacked type or the wound type.

  These film capacitors may further have a lead wire 15 as a terminal on the external electrode 14, but a structure without the lead wire 15 is desirable in terms of miniaturization of the film capacitor. Further, a part of the capacitor body 13, the external electrode 14, and the lead wire 15 may be covered with the exterior member 16 in terms of insulation and environment resistance.

  The laminated body of this embodiment can be obtained by the manufacturing method as shown below, for example. First, a resin 3 serving as a base material for the dielectric film 1 is prepared. As the resin 3, polyethylene terephthalate (PET), polypropylene (PP), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), cycloolefin polymer (COP), and the like are suitable.

  The relative dielectric constant (ε) of these resins 3 at room temperature (about 25 ° C.) is, for example, 3.3 for polyethylene terephthalate (PET), 2.3 for polypropylene (PP), and 3.0 for polyphenylene sulfide (PPS). The cycloolefin polymer (COP) is 2.2 to 3.0.

  The dielectric breakdown electric field (BDE) of these resins 3 at room temperature (about 25 ° C.) is, for example, 310 (V / μm) for polyethylene terephthalate (PET), 380 (V / μm) for polypropylene (PP), polyphenylene The sulfide (PPS) is 210 (V / μm), and the cycloolefin polymer (COP) is 370 to 510 (V / μm).

Examples of the raw material composition to be the metal oxide 2a include tetraethoxysilane, tetra-i-propoxytitanium, tetra-n-butoxytitanium, tetra-n-butoxyzirconium, tri-i-propoxyaluminum, and tri-n-butoxy. At least one metal alkoxide compound selected from aluminum can be used.

  When forming the dielectric film 1, for example, a PET film is applied as a substrate, and a molding method such as a solution casting method is applied to the surface to form a flat hill-shaped portion containing the metal oxide 2 a The dielectric film 1 can be obtained by forming a resin sheet having 2. In this case, the hill-shaped portion 2 is not formed on the dielectric film 1 on the PET film side, and the surface becomes a smooth surface.

  The slurry for the dielectric film 1 is a resin slurry prepared by dissolving the resin 3 in a solvent, a metal alkoxide or a metal alkoxide solution diluted with a solvent (hereinafter, a metal alkoxide and a metal alkoxide solution diluted with a solvent are simply referred to as alkoxides). Prepared by mixing).

  In this case, when the dielectric film 1 is formed by a combination of a specific concentration of the resin 3, the solvent and the alkoxide, the metal component contained in the alkoxide is nucleated at a specific number density in the resin 3 by hydrolysis reaction. Generate. On the other hand, the excess alkoxide that has not been taken into the resin 3 moves to the surface of the resin sheet, where the hydrolysis reaction proceeds, so that a flat hill-like portion 2 is formed on the surface of the resin sheet. At this time, unreacted metal alkoxide may remain in the dielectric film 1. The metal alkoxide has a high affinity with the resin 3 and has an effect of suppressing peeling and dropping of the hill-shaped portion 2 and the metal oxide 2a from the dielectric film 1. In many cases, islands 6 are formed on the surface of the resin sheet on the base film side, but the surface of the base film is smooth and substantially flush.

  In the case where the hill-shaped portion 2 is formed only on the first main surface of the dielectric film 1 and the island-shaped portion 6 is not formed on the second main surface, the film is formed by a solution casting method. What is necessary is just to form in the air atmosphere which has finite humidity (40-70% RH) on a base material. Further, by overlapping two smooth surfaces using the two dielectric films 1 having the hill-shaped portion 2, the first main surface 1A has the hill-shaped portion 2 and the second main surface 1B. A dielectric film 1 having island-like portions 6 protruding in a hill shape can be obtained.

  For film formation, a kind of molding method selected from a doctor blade method, a die coater method, a knife coater method and the like is used. The conditions for forming the flat hill-like portion 2 or island-like portion 6 containing the metal oxide 2a include the concentration of the metal component in the slurry, the concentration of the metal alkoxide with respect to the resin, the temperature at the time of film formation, Etc. as appropriate.

  Examples of the solvent used for film formation include methanol, isopropanol, n-butanol, ethylene glycol, ethylene glycol monopropyl ether, methyl ethyl ketone, methyl isobutyl ketone, xylene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, dimethylacetamide, It is preferable to use an organic solvent containing cyclohexane, ethylcyclohexane, or a mixture of two or more selected from these.

  Next, the electrode layer 4 is deposited by vapor-depositing a metal component such as Al (aluminum) using the surface of the dielectric film 1 having a large area ratio of the smooth or hill-like protruding portion as the second main surface. Then, the dielectric film 1 on which the electrode layer 4 is formed is wound to obtain a laminate.

Next, the obtained laminated body is used as the main body 13 of the film capacitor, and the external electrode 14 is formed on the end face where the electrode layer 4 is exposed. For forming the external electrode 14, for example, metal spraying, sputtering, plating, or the like is suitable. Here, the lead wire 15 may be formed on the external electrode 14. Next, the film capacitor of the present embodiment can be obtained by forming the exterior resin 16 on the surface of the main body 13 on which the external electrodes 14 (including the lead wires 15) are formed.

  A specific material was selected to produce a dielectric film, and the following evaluation was performed.

  First, a metal alkoxide compound containing any one of Si, Ti, Zr, and Al, and a cycloolefin polymer (COP; molecular weight: Mw = 20000) as a resin were prepared.

  Next, the above metal alkoxide compound dissolved in cyclohexane was mixed and dispersed in a cycloolefin polymer solution using cyclohexane as a solvent to prepare a coating solution. Table 1 shows the types of metal alkoxide compounds and their concentrations relative to the resin.

  Then, the dielectric film was produced by apply | coating the said slurry on a polyethylene terephthalate (PET) film with a coater on the conditions which made relative humidity 55% +/- 5%. In the produced dielectric film, a flat hill-shaped portion containing a metal oxide is formed on one surface (first main surface) of the dielectric film, and the other smooth surface (second surface) on the PET film side. An island-like part was formed on the main surface. Moreover, the area ratio of the hill-shaped part in the 1st main surface of the produced dielectric film is 11-56% (The sample whose metal alkoxide is 10 mass% is 11%, The sample of 20 mass% is 50-56%). there were. Moreover, the ratio (area ratio) of the metal oxide in the hill-shaped portion was in the range of 70 to 90% (90% for the sample with 10% by mass of metal alkoxide and 70 to 78% for the sample with 20% by mass). .

  The produced dielectric film was desolvated at 180 ° C. Table 2 shows the average thickness of the dielectric film after solvent removal. In addition, the average thickness of the dielectric film was calculated | required from the average value which cut off a part of produced dielectric film and measured the area | region divided into 10 parts.

  Next, an Al electrode layer having an average thickness of 75 nm was formed on the smooth surface, which is the second main surface of the dielectric film, by vacuum deposition. The obtained dielectric film with an electrode layer was wound to form a laminate, external electrodes were formed by a metallicon treatment, and lead wires were connected to the surface of the metallicon layer to produce a film capacitor.

  The slipperiness of the dielectric film was confirmed by measuring the static friction coefficient of the dielectric film. When the static friction coefficient of the dielectric film was less than 0.6, the slipperiness was good, and when it was 0.6 or more, the slipperiness was judged as poor.

  The surface morphology of the hills and islands in the dielectric film and the metal compound were confirmed by observation with energy dispersive X-ray spectroscopy (EDS) and scanning electron microscope (SEM). The voids in the laminate were confirmed by processing the produced film capacitor with a cross section polisher (CP) and observing the obtained cross section with a scanning electron microscope (SEM). These results are shown in Table 2.

  As a comparative example, a dielectric film containing an alumina powder having an average particle diameter of 100 nm was prepared, and the same evaluation was performed (Sample No. 6).

  From the results of Table 2, in the samples (Nos. 1 to 5), the first main surface of the dielectric film is in a state where a plurality of flat hills containing a metal oxide are present, and the first of the laminates There was a gap between the resin surface and the surface of the first electrode, and the dielectric film had good sliding properties.

  On the other hand, in the sample (No. 6) using the dielectric film prepared by mixing alumina powder, the sample No. 6 was formed on the surface of the dielectric film. The hill-shaped part containing a metal oxide as seen in 1-5 was not formed. For this reason, it was inferior to the slipperiness of a dielectric film.

  Moreover, when the dielectric breakdown electric field (BDE) was measured about each sample, sample No. without a space | gap was measured. 6 was 300 V / μm. Nos. 1 to 5 had voids with an average thickness of less than 1000 nm, and BDE showed a high value of 400 V / μm.

1: Dielectric film 1A: First main surface 1B of dielectric film: Second main surface 2 of dielectric film: Hill-shaped portion 2a: Metal oxide 3: Resin 3A: First resin surface 3B: First 2 resin surface 4: electrode layer 4A: first electrode surface 4B: second electrode surface 5: gap 6: island-shaped portion
13: Body 14: External electrode 15: Lead 16: Exterior member

Claims (6)

A dielectric film including a metal oxide, a resin, and a metal alkoxide is a laminate in which a plurality of dielectric films are laminated via an electrode layer,
The first main surface of the dielectric film is a first resin surface made of resin, and a plurality of flat hill-shaped portions that include the metal oxide and protrude in a hill shape from the first resin surface, Have
The electrode layer is provided on the second main surface of the dielectric film, the first electrode surface of the electrode layer facing the first main surface is in contact with the hill-shaped portion, and the first A laminate having a gap between one electrode surface and the first resin surface. A dielectric film including a metal oxide and a resin is a laminate in which a plurality of dielectric films are laminated via an electrode layer,
The first main surface of the dielectric film is a first resin surface made of resin, and a plurality of flat hill-shaped portions that include the metal oxide and protrude in a hill shape from the first resin surface, Have
The second main surface of the dielectric film has a second resin surface made of resin, and a plurality of flat island-shaped portions containing the metal oxide,
And the second resin surface and the plurality of island-shaped portions of the surface, Ri substantially flush der,
The electrode layer is provided on the second main surface, and the first electrode surface of the electrode layer facing the first main surface is in contact with the hill-shaped portion, and the first electrode surface product Sotai characterized by having an air gap between the first resin surface and. A dielectric film containing a metal oxide and a resin is a laminate in which a plurality of dielectric films are laminated via an electrode layer,
The first main surface of the dielectric film is a first resin surface made of resin, and a plurality of flat hill-shaped portions that include the metal oxide and protrude in a hill shape from the first resin surface, Have
The second main surface of the dielectric film is a second resin surface made of a resin, and a plurality of flat island-shaped portions including the metal oxide and projecting in a hill shape from the second resin surface, Have
The electrode layer is provided on the second main surface, and the first electrode surface of the electrode layer facing the first main surface is in contact with the hill-shaped portion, and the first electrode surface And a gap between the first resin surface,
It said second of said island portion occupied area ratio projecting hill shape in the main surface is, the first product you being greater than the area ratio occupied by the hill-shaped portion in the main surface Sotai. It said dielectric film, also claim 2 further comprising a metal alkoxide
Is a laminate according to 3 .   The laminate according to any one of claims 1 to 4, wherein the metal oxide is at least one selected from silicon oxide, titanium oxide, zirconium oxide, and aluminum oxide. Film capacitor, characterized in that it comprises a laminate according to any one of claims 1 to 5.