TWI304257B - - Google Patents
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- Publication number
- TWI304257B TWI304257B TW095118484A TW95118484A TWI304257B TW I304257 B TWI304257 B TW I304257B TW 095118484 A TW095118484 A TW 095118484A TW 95118484 A TW95118484 A TW 95118484A TW I304257 B TWI304257 B TW I304257B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrostatic chuck
- dielectric substrate
- electrode
- plasma
- dielectric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005151483A JP2006332204A (ja) | 2005-05-24 | 2005-05-24 | 静電チャック |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200707695A TW200707695A (en) | 2007-02-16 |
TWI304257B true TWI304257B (ja) | 2008-12-11 |
Family
ID=37451929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095118484A TW200707695A (en) | 2005-05-24 | 2006-05-24 | Electrostatic chuck |
Country Status (6)
Country | Link |
---|---|
US (2) | US7468880B2 (ja) |
JP (1) | JP2006332204A (ja) |
KR (2) | KR100978996B1 (ja) |
CN (1) | CN100562983C (ja) |
TW (1) | TW200707695A (ja) |
WO (1) | WO2006126503A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI458043B (zh) * | 2012-01-31 | 2014-10-21 | A stage for a plasma processing device |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070283891A1 (en) * | 2006-03-29 | 2007-12-13 | Nobuyuki Okayama | Table for supporting substrate, and vacuum-processing equipment |
US7672111B2 (en) * | 2006-09-22 | 2010-03-02 | Toto Ltd. | Electrostatic chuck and method for manufacturing same |
JP2008205415A (ja) * | 2007-02-16 | 2008-09-04 | Creative Technology:Kk | 静電チャック |
JP5018244B2 (ja) * | 2007-05-30 | 2012-09-05 | 住友大阪セメント株式会社 | 静電チャック |
WO2009078923A2 (en) | 2007-12-19 | 2009-06-25 | Lam Research Corporation | Film adhesive for semiconductor vacuum processing apparatus |
CN102132395B (zh) * | 2008-08-27 | 2013-08-07 | 爱发科股份有限公司 | 静电卡盘及真空处理装置 |
JP2010199475A (ja) * | 2009-02-27 | 2010-09-09 | Tokyo Electron Ltd | プラズマ処理装置のクリーニング方法及び記憶媒体 |
JP2012204644A (ja) * | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | プラズマ処理装置及びプラズマ処理方法 |
JP5348439B2 (ja) * | 2011-09-30 | 2013-11-20 | Toto株式会社 | 静電チャック |
CN103327720B (zh) * | 2012-03-21 | 2016-01-20 | 长毅技研股份有限公司 | 可透视静电吸板 |
US9281226B2 (en) | 2012-04-26 | 2016-03-08 | Applied Materials, Inc. | Electrostatic chuck having reduced power loss |
JP5441019B1 (ja) * | 2012-08-29 | 2014-03-12 | Toto株式会社 | 静電チャック |
JP5441021B1 (ja) * | 2012-09-12 | 2014-03-12 | Toto株式会社 | 静電チャック |
KR102098981B1 (ko) | 2012-11-27 | 2020-04-08 | 가부시키가이샤 크리에이티브 테크놀러지 | 정전 척, 유리 기판 처리 방법 및 그 유리 기판 |
JP6071514B2 (ja) * | 2012-12-12 | 2017-02-01 | 東京エレクトロン株式会社 | 静電チャックの改質方法及びプラズマ処理装置 |
JP6132957B2 (ja) * | 2015-10-13 | 2017-05-24 | ヤス カンパニー リミテッド | 帯電処理による基板チャッキング方法及びシステム |
KR20190104040A (ko) * | 2017-01-27 | 2019-09-05 | 울트라테크 인크. | 기판-바이어스된 원자층 증착을 위한 향상된 전기적 절연을 가진 척 시스템 및 방법 |
US11911863B2 (en) | 2019-09-11 | 2024-02-27 | Creative Technology Corporation | Attachment and detachment device |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55132048A (en) * | 1979-04-03 | 1980-10-14 | Toshiba Corp | Semiconductor device |
JPS6096832A (ja) | 1983-11-01 | 1985-05-30 | Fukuo Iwabori | ガスライタの発火装置を製造する方法 |
JPH0697677B2 (ja) | 1987-04-21 | 1994-11-30 | 東陶機器株式会社 | 静電チャック基盤の製造方法 |
JP2521471B2 (ja) | 1987-05-14 | 1996-08-07 | 富士通株式会社 | 静電吸着装置 |
JPH01240243A (ja) * | 1988-03-18 | 1989-09-25 | Tokuda Seisakusho Ltd | 電極およびその製造方法 |
JPH04133443A (ja) | 1990-09-26 | 1992-05-07 | Fujitsu Ltd | 半導体装置の製造方法 |
JP2552420Y2 (ja) * | 1991-05-30 | 1997-10-29 | 京セラ株式会社 | セラミック製静電チャック |
JP2971369B2 (ja) * | 1995-08-31 | 1999-11-02 | トーカロ株式会社 | 静電チャック部材およびその製造方法 |
JP3457477B2 (ja) | 1995-09-06 | 2003-10-20 | 日本碍子株式会社 | 静電チャック |
JP3225850B2 (ja) | 1995-09-20 | 2001-11-05 | 株式会社日立製作所 | 静電吸着電極およびその製作方法 |
JPH10154745A (ja) | 1996-11-26 | 1998-06-09 | Hitachi Ltd | 静電吸着装置 |
JP3527823B2 (ja) | 1997-01-31 | 2004-05-17 | 京セラ株式会社 | 静電チャック |
JPH10261697A (ja) | 1997-03-19 | 1998-09-29 | Kobe Steel Ltd | 静電チャック |
JP4156699B2 (ja) | 1998-02-16 | 2008-09-24 | 株式会社巴川製紙所 | 静電チャック装置用シートおよび静電チャック装置 |
JP3888766B2 (ja) * | 1998-03-16 | 2007-03-07 | 太平洋セメント株式会社 | 静電チャック及びその製造方法 |
JP2001060619A (ja) | 1999-06-16 | 2001-03-06 | Toto Ltd | 静電チャック及びその製造方法 |
JP2001284328A (ja) | 2000-03-31 | 2001-10-12 | Taiheiyo Cement Corp | セラミック部品 |
JP2001313331A (ja) | 2000-04-28 | 2001-11-09 | Sumitomo Osaka Cement Co Ltd | 静電吸着装置 |
JP2001338970A (ja) | 2000-05-26 | 2001-12-07 | Sumitomo Osaka Cement Co Ltd | 静電吸着装置 |
JP2002093896A (ja) | 2000-09-12 | 2002-03-29 | Nippon Steel Corp | 静電チャック及びその製造方法 |
JP4917715B2 (ja) | 2001-07-24 | 2012-04-18 | 太平洋セメント株式会社 | 静電チャック |
JP4008230B2 (ja) * | 2001-11-14 | 2007-11-14 | 住友大阪セメント株式会社 | 静電チャックの製造方法 |
JP2003168725A (ja) | 2001-11-30 | 2003-06-13 | Kyocera Corp | ウエハ支持部材及びその製造方法 |
JP2002324834A (ja) | 2002-04-03 | 2002-11-08 | Tomoegawa Paper Co Ltd | 静電チャック装置、静電チャック用積層シート、および静電チャック用接着剤 |
JP2004168609A (ja) | 2002-11-21 | 2004-06-17 | Taiheiyo Cement Corp | 窒化アルミニウム焼結体およびそれを用いた静電チャック |
JP2004200462A (ja) | 2002-12-19 | 2004-07-15 | Nhk Spring Co Ltd | 静電チャックおよびその製造方法 |
JP2004235563A (ja) | 2003-01-31 | 2004-08-19 | Tomoegawa Paper Co Ltd | 静電チャック装置用電極シート及びこれを用いた静電チャック装置 |
JP4064835B2 (ja) | 2003-02-07 | 2008-03-19 | 太平洋セメント株式会社 | 静電チャック及びその製造方法 |
JP4369765B2 (ja) * | 2003-07-24 | 2009-11-25 | 京セラ株式会社 | 静電チャック |
-
2005
- 2005-05-24 JP JP2005151483A patent/JP2006332204A/ja active Pending
- 2005-12-13 US US11/299,802 patent/US7468880B2/en active Active
-
2006
- 2006-05-23 WO PCT/JP2006/310182 patent/WO2006126503A1/ja active Application Filing
- 2006-05-23 KR KR1020087029373A patent/KR100978996B1/ko active IP Right Grant
- 2006-05-23 KR KR1020077021337A patent/KR100968019B1/ko active IP Right Grant
- 2006-05-23 CN CNB2006800178949A patent/CN100562983C/zh active Active
- 2006-05-24 TW TW095118484A patent/TW200707695A/zh unknown
-
2008
- 2008-07-07 US US12/217,532 patent/US7760484B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI458043B (zh) * | 2012-01-31 | 2014-10-21 | A stage for a plasma processing device |
Also Published As
Publication number | Publication date |
---|---|
US20080273284A1 (en) | 2008-11-06 |
US20060268491A1 (en) | 2006-11-30 |
US7468880B2 (en) | 2008-12-23 |
CN100562983C (zh) | 2009-11-25 |
KR100968019B1 (ko) | 2010-07-07 |
TW200707695A (en) | 2007-02-16 |
US7760484B2 (en) | 2010-07-20 |
JP2006332204A (ja) | 2006-12-07 |
KR100978996B1 (ko) | 2010-08-30 |
KR20090007476A (ko) | 2009-01-16 |
WO2006126503A1 (ja) | 2006-11-30 |
CN101180721A (zh) | 2008-05-14 |
KR20070106782A (ko) | 2007-11-05 |
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