TWI300744B - - Google Patents

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Publication number
TWI300744B
TWI300744B TW091107926A TW91107926A TWI300744B TW I300744 B TWI300744 B TW I300744B TW 091107926 A TW091107926 A TW 091107926A TW 91107926 A TW91107926 A TW 91107926A TW I300744 B TWI300744 B TW I300744B
Authority
TW
Taiwan
Prior art keywords
resin layer
layer
polyimide
based resin
laminate
Prior art date
Application number
TW091107926A
Other languages
English (en)
Chinese (zh)
Inventor
Katsufumi Hiraishi
Takarabe Taeko
Takiyama Syuji
Kabemura Eri
Kazuya Miyamoto
Matsuda Takashi
Sawamura Tazo
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Application granted granted Critical
Publication of TWI300744B publication Critical patent/TWI300744B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW091107926A 2001-04-19 2002-04-18 TWI300744B (US20020132095A1-20020919-C00002.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001121553 2001-04-19

Publications (1)

Publication Number Publication Date
TWI300744B true TWI300744B (US20020132095A1-20020919-C00002.png) 2008-09-11

Family

ID=18971402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091107926A TWI300744B (US20020132095A1-20020919-C00002.png) 2001-04-19 2002-04-18

Country Status (8)

Country Link
US (1) US7070864B2 (US20020132095A1-20020919-C00002.png)
EP (1) EP1393894B1 (US20020132095A1-20020919-C00002.png)
JP (1) JP3934057B2 (US20020132095A1-20020919-C00002.png)
KR (1) KR100852077B1 (US20020132095A1-20020919-C00002.png)
CN (1) CN1241735C (US20020132095A1-20020919-C00002.png)
AT (1) ATE524308T1 (US20020132095A1-20020919-C00002.png)
TW (1) TWI300744B (US20020132095A1-20020919-C00002.png)
WO (1) WO2002085616A1 (US20020132095A1-20020919-C00002.png)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4742200B2 (ja) * 2003-03-31 2011-08-10 新日鐵化学株式会社 配線基板用ポリイミド積層体
JP2004299312A (ja) * 2003-03-31 2004-10-28 Nippon Steel Chem Co Ltd 金属−ポリイミド積層体
JP2005015596A (ja) * 2003-06-25 2005-01-20 Shin Etsu Chem Co Ltd ポリイミド系前駆体樹脂溶液組成物シート
JP4619860B2 (ja) * 2004-07-13 2011-01-26 新日鐵化学株式会社 フレキシブル積層板及びその製造方法
JP4819336B2 (ja) * 2004-10-06 2011-11-24 三井化学株式会社 樹脂組成物及び金属積層板
KR101244589B1 (ko) * 2005-01-18 2013-03-25 가부시키가이샤 가네카 접착성이 개량된 신규 폴리이미드 필름
JP4757864B2 (ja) * 2005-02-23 2011-08-24 新日鐵化学株式会社 フレキシブルプリント配線基板用積層体
JP4544588B2 (ja) * 2005-03-14 2010-09-15 株式会社エー・エム・ティー・研究所 積層体
US20090142607A1 (en) * 2005-04-04 2009-06-04 Ube Industries Ltd Copper clad laminate
KR100809827B1 (ko) * 2005-09-15 2008-03-04 신닛테츠가가쿠 가부시키가이샤 동장적층판의 제조방법
JP2007230019A (ja) * 2006-02-28 2007-09-13 Kaneka Corp 金属張積層板の製造方法
EP2224036B1 (en) * 2007-12-14 2016-03-16 Toadenka Corporation Resin-metal bonded article and method for producing the same
TWI627065B (zh) * 2010-01-18 2018-06-21 鐘化股份有限公司 多層聚醯亞胺膜及使用其之可撓性金屬貼合積層板
CN102009515B (zh) * 2010-07-21 2013-01-02 广东生益科技股份有限公司 二层法双面挠性覆铜板的制作方法及该二层法双面挠性覆铜板
US8867219B2 (en) 2011-01-14 2014-10-21 Harris Corporation Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
US8693203B2 (en) * 2011-01-14 2014-04-08 Harris Corporation Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
SG191864A1 (en) * 2011-03-07 2013-08-30 Mitsubishi Gas Chemical Co Resin composition for printed-wiring board
JP5698585B2 (ja) 2011-03-31 2015-04-08 新日鉄住金化学株式会社 金属張積層板
KR101720218B1 (ko) * 2015-01-29 2017-03-27 에스케이이노베이션 주식회사 저흡습 연성 금속박 적층체
JP7195530B2 (ja) 2019-01-11 2022-12-26 エルジー・ケム・リミテッド フィルム、金属張積層板、フレキシブル基板、フィルムの製造方法、金属張積層板の製造方法、及びフレキシブル基板の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60243120A (ja) 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
JPS61111181A (ja) 1984-11-07 1986-05-29 Nitto Electric Ind Co Ltd ポリイミド−金属箔複合フイルムの製法
JPS61143434A (ja) 1984-12-15 1986-07-01 Nitto Electric Ind Co Ltd 耐湿性ポリイミド
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
JPH0742611B2 (ja) 1988-04-11 1995-05-10 帝人株式会社 ポリイミド繊維
JP2853218B2 (ja) 1989-11-24 1999-02-03 東洋紡績株式会社 積層体
US5112942A (en) * 1990-09-26 1992-05-12 Ethyl Corporation Polymide compositions
US5536584A (en) * 1992-01-31 1996-07-16 Hitachi, Ltd. Polyimide precursor, polyimide and metalization structure using said polyimide
US5741598A (en) * 1995-08-01 1998-04-21 Ube Industries, Ltd. Polyimide/metal composite sheet
JP2746555B2 (ja) * 1995-11-13 1998-05-06 新日鐵化学株式会社 フレキシブルプリント基板
US6203918B1 (en) * 1996-08-19 2001-03-20 Nippon Steel Chemical Co., Ltd. Laminate for HDD suspension and its manufacture
JP3794446B2 (ja) 1997-08-05 2006-07-05 株式会社カネカ ハードディスクサスペンション配線基材用ポリイミドフィルム
JP2000080272A (ja) 1998-09-03 2000-03-21 Toray Ind Inc 低誘電率重合体組成物
JP4147639B2 (ja) * 1998-09-29 2008-09-10 宇部興産株式会社 フレキシブル金属箔積層体
JP4560859B2 (ja) 1998-10-30 2010-10-13 日立化成デュポンマイクロシステムズ株式会社 テトラカルボン酸二無水物、その誘導体及び製造法、ポリイミド前駆体、ポリイミド、樹脂組成物、感光性樹脂組成物、レリーフパターンの製造法、並びに電子部品
US6998455B1 (en) * 1999-10-21 2006-02-14 Nippon Steel Chemical Co., Ltd. Laminate and process for producing the same
JP4799740B2 (ja) * 2001-01-17 2011-10-26 日東電工株式会社 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板

Also Published As

Publication number Publication date
KR100852077B1 (ko) 2008-08-13
EP1393894A4 (en) 2007-05-09
CN1503731A (zh) 2004-06-09
EP1393894B1 (en) 2011-09-14
WO2002085616A1 (fr) 2002-10-31
CN1241735C (zh) 2006-02-15
EP1393894A1 (en) 2004-03-03
JP3934057B2 (ja) 2007-06-20
ATE524308T1 (de) 2011-09-15
US7070864B2 (en) 2006-07-04
JPWO2002085616A1 (ja) 2004-08-05
KR20040012753A (ko) 2004-02-11
US20040105989A1 (en) 2004-06-03

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