TWI294923B - Electropolishing electrolyte and method for planarizing a metal layer using the same - Google Patents

Electropolishing electrolyte and method for planarizing a metal layer using the same Download PDF

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Publication number
TWI294923B
TWI294923B TW093130211A TW93130211A TWI294923B TW I294923 B TWI294923 B TW I294923B TW 093130211 A TW093130211 A TW 093130211A TW 93130211 A TW93130211 A TW 93130211A TW I294923 B TWI294923 B TW I294923B
Authority
TW
Taiwan
Prior art keywords
acid
additive
metal layer
alcohol
volume ratio
Prior art date
Application number
TW093130211A
Other languages
English (en)
Chinese (zh)
Other versions
TW200611998A (en
Inventor
Jia Min Shieh
Sue Hong Liu
Bou Tong Dai
Original Assignee
Basf Electronic Materials Taiwan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Electronic Materials Taiwan Ltd filed Critical Basf Electronic Materials Taiwan Ltd
Priority to TW093130211A priority Critical patent/TWI294923B/zh
Priority to US11/051,163 priority patent/US7501051B2/en
Priority to KR1020077010183A priority patent/KR20070061579A/ko
Priority to JP2007535073A priority patent/JP2008516083A/ja
Priority to EP05797350A priority patent/EP1935013A1/en
Priority to GB0707076A priority patent/GB2434159B/en
Priority to AT0939305A priority patent/AT503087A2/de
Priority to DE112005002414T priority patent/DE112005002414T5/de
Priority to RU2007116697/28A priority patent/RU2007116697A/ru
Priority to CH00561/07A priority patent/CH698385B1/de
Priority to PCT/EP2005/010628 priority patent/WO2006037584A1/en
Priority to MYPI20054707A priority patent/MY141248A/en
Publication of TW200611998A publication Critical patent/TW200611998A/zh
Priority to IL182224A priority patent/IL182224A0/en
Application granted granted Critical
Publication of TWI294923B publication Critical patent/TWI294923B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/12—Working media
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/61—Formation of materials, e.g. in the shape of layers or pillars of insulating materials using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/04—Planarisation of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
  • Fuel Cell (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • ing And Chemical Polishing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW093130211A 2004-10-06 2004-10-06 Electropolishing electrolyte and method for planarizing a metal layer using the same TWI294923B (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
TW093130211A TWI294923B (en) 2004-10-06 2004-10-06 Electropolishing electrolyte and method for planarizing a metal layer using the same
US11/051,163 US7501051B2 (en) 2004-10-06 2005-02-04 Electropolishing electrolyte and method for planarizing a metal layer using the same
CH00561/07A CH698385B1 (de) 2004-10-06 2005-10-01 Elektropolier-Elektrolyt und Verfahren zur Planarisierung einer Metallschicht unter Verwendung desselben.
EP05797350A EP1935013A1 (en) 2004-10-06 2005-10-01 Electropolishing electrolyte and method for planarizing a metal layer using the same
GB0707076A GB2434159B (en) 2004-10-06 2005-10-01 Electropolishing electrolyte and method for planarizing a metal layer using the same
AT0939305A AT503087A2 (de) 2004-10-06 2005-10-01 Elektropolier-elektrolyt und verfahren zur planarisierung einer metallschicht unter verwendung desselben
KR1020077010183A KR20070061579A (ko) 2004-10-06 2005-10-01 전해연마 전해질 및 이를 사용한 금속층의 평탄화 방법
RU2007116697/28A RU2007116697A (ru) 2004-10-06 2005-10-01 Электрополирующий электролит и способ выравнивания металлического слоя с его использованием
JP2007535073A JP2008516083A (ja) 2004-10-06 2005-10-01 電解研磨電解質および前記電解質を使用して金属層を平坦化する方法
PCT/EP2005/010628 WO2006037584A1 (en) 2004-10-06 2005-10-01 Electropolishing electrolyte and method for planarizing a metal layer using the same
DE112005002414T DE112005002414T5 (de) 2004-10-06 2005-10-01 Elektropolier-Elektrolyt und Verfahren zur Planarisierung einer Metallschicht unter Verwendung desselben
MYPI20054707A MY141248A (en) 2004-10-06 2005-10-06 Electropolishing electrolyte and method for planarizing a metal layer using the same
IL182224A IL182224A0 (en) 2004-10-06 2007-03-27 Electropolishing electrolyte and method for planarizing a metal layer using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093130211A TWI294923B (en) 2004-10-06 2004-10-06 Electropolishing electrolyte and method for planarizing a metal layer using the same

Publications (2)

Publication Number Publication Date
TW200611998A TW200611998A (en) 2006-04-16
TWI294923B true TWI294923B (en) 2008-03-21

Family

ID=35636650

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130211A TWI294923B (en) 2004-10-06 2004-10-06 Electropolishing electrolyte and method for planarizing a metal layer using the same

Country Status (13)

Country Link
US (1) US7501051B2 (https=)
EP (1) EP1935013A1 (https=)
JP (1) JP2008516083A (https=)
KR (1) KR20070061579A (https=)
AT (1) AT503087A2 (https=)
CH (1) CH698385B1 (https=)
DE (1) DE112005002414T5 (https=)
GB (1) GB2434159B (https=)
IL (1) IL182224A0 (https=)
MY (1) MY141248A (https=)
RU (1) RU2007116697A (https=)
TW (1) TWI294923B (https=)
WO (1) WO2006037584A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100783006B1 (ko) * 2007-08-09 2007-12-07 신승균 동 도금된 마그네슘합금 및 그 형성방법
MX2012005909A (es) * 2009-11-23 2012-11-12 MetCon LLC Soliucion de electrolitos y metodos de electropulido.
US8580103B2 (en) 2010-11-22 2013-11-12 Metcon, Llc Electrolyte solution and electrochemical surface modification methods
CN102337569B (zh) * 2011-09-19 2014-06-11 华南理工大学 一种钴-钨纳米合金镀层及其制备方法
RU2471595C1 (ru) * 2011-12-07 2013-01-10 Открытое акционерное общество "Научно-производственное объединение "Сатурн" Электролит для электрохимической обработки
KR101464860B1 (ko) * 2013-02-06 2014-11-24 인천대학교 산학협력단 알릴 알콜을 포함하는 금속 씨앗층 평탄제 및 이를 이용한 씨앗층의 형성방법
US9648723B2 (en) 2015-09-16 2017-05-09 International Business Machines Corporation Process of fabricating printed circuit board
WO2020138976A1 (ko) * 2018-12-26 2020-07-02 한양대학교에리카산학협력단 반도체 소자의 제조 방법
DE102020200815A1 (de) 2020-01-23 2021-07-29 Mahle International Gmbh Zusammensetzung als Elektrolyt zum Auflösen und/oder Abscheiden von Metallen, Metalloxiden und/oder Metalllegierungen sowie Verwendungen dieser Zusammensetzung
KR102258702B1 (ko) 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면 구조를 가지는 버스바
KR102258703B1 (ko) 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면구조를 가지는 버스바 제조방법
KR102608626B1 (ko) * 2020-11-30 2023-12-04 한국과학기술연구원 Cis계 박막의 평탄화 방법, 이를 이용하여 제조된 cis계 박막 및 상기 cis계 박막을 포함하는 태양전지
US11447887B2 (en) * 2020-12-10 2022-09-20 Saudi Arabian Oil Company Surface smoothing of copper by electropolishing
US11512400B2 (en) 2020-12-10 2022-11-29 Saudi Arabian Oil Company Electrochemical reduction of carbon dioxide
CN113337877A (zh) * 2021-05-17 2021-09-03 安徽昀水表面科技有限公司 一种电解抛光药水及电解抛光加工工艺
US11718575B2 (en) 2021-08-12 2023-08-08 Saudi Arabian Oil Company Methanol production via dry reforming and methanol synthesis in a vessel
US12258272B2 (en) 2021-08-12 2025-03-25 Saudi Arabian Oil Company Dry reforming of methane using a nickel-based bi-metallic catalyst
US11787759B2 (en) 2021-08-12 2023-10-17 Saudi Arabian Oil Company Dimethyl ether production via dry reforming and dimethyl ether synthesis in a vessel
US11578016B1 (en) 2021-08-12 2023-02-14 Saudi Arabian Oil Company Olefin production via dry reforming and olefin synthesis in a vessel
US11617981B1 (en) 2022-01-03 2023-04-04 Saudi Arabian Oil Company Method for capturing CO2 with assisted vapor compression

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB726133A (en) * 1952-10-09 1955-03-16 Metro Cutanit Ltd Improvements relating to the electrolytic treatment of metal wire and the like
JPS5242134B2 (https=) * 1972-12-30 1977-10-22
SU779453A1 (ru) * 1978-04-24 1980-11-15 Ленинградский Институт Ядерной Физики Им. Б.П.Константинова Ан Ссср Раствор дл электрохимического полировани металлической поверхности
US4920361A (en) * 1987-06-26 1990-04-24 Canon Kabushiki Kaisha Image recording method and apparatus therefor
US5066370A (en) * 1990-09-07 1991-11-19 International Business Machines Corporation Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands
JP2649625B2 (ja) 1991-12-10 1997-09-03 株式会社 ケミカル山本 含クロム合金鋼の電解琢磨用電解液
FR2747399B1 (fr) 1996-04-12 1998-05-07 Commissariat Energie Atomique Electrolyte pour l'electropolissage, procede d'electropolissage d'un acier inoxydable ou d'un alliage de nickel mettant en oeuvre cet electrolyte, et son application a la decontamination
US6491808B2 (en) * 1997-09-11 2002-12-10 Canon Kabushiki Kaisha Electrolytic etching method, method for producing photovoltaic element, and method for treating defect of photovoltaic element
AT410043B (de) * 1997-09-30 2003-01-27 Sez Ag Verfahren zum planarisieren von halbleitersubstraten
US6811658B2 (en) * 2000-06-29 2004-11-02 Ebara Corporation Apparatus for forming interconnects
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
TW567545B (en) 2002-06-04 2003-12-21 Merck Kanto Advanced Chemical Electropolishing electrolytic solution formulation

Also Published As

Publication number Publication date
JP2008516083A (ja) 2008-05-15
GB0707076D0 (en) 2007-05-23
CH698385B1 (de) 2009-07-31
MY141248A (en) 2010-03-31
RU2007116697A (ru) 2008-11-20
GB2434159B (en) 2009-05-06
IL182224A0 (en) 2007-09-20
DE112005002414T5 (de) 2007-09-27
US7501051B2 (en) 2009-03-10
KR20070061579A (ko) 2007-06-13
WO2006037584A1 (en) 2006-04-13
US20060070888A1 (en) 2006-04-06
TW200611998A (en) 2006-04-16
GB2434159A (en) 2007-07-18
EP1935013A1 (en) 2008-06-25
AT503087A2 (de) 2007-07-15

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