MY141248A - Electropolishing electrolyte and method for planarizing a metal layer using the same - Google Patents

Electropolishing electrolyte and method for planarizing a metal layer using the same

Info

Publication number
MY141248A
MY141248A MYPI20054707A MYPI20054707A MY141248A MY 141248 A MY141248 A MY 141248A MY PI20054707 A MYPI20054707 A MY PI20054707A MY PI20054707 A MYPI20054707 A MY PI20054707A MY 141248 A MY141248 A MY 141248A
Authority
MY
Malaysia
Prior art keywords
acid
metal layer
planarizing
same
phosphoric acid
Prior art date
Application number
MYPI20054707A
Other languages
English (en)
Inventor
Shieh Jia-Min
Liu Sue-Hong
Dai Bou-Tong
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of MY141248A publication Critical patent/MY141248A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/12—Working media
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/61—Formation of materials, e.g. in the shape of layers or pillars of insulating materials using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/04—Planarisation of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
  • Fuel Cell (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • ing And Chemical Polishing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
MYPI20054707A 2004-10-06 2005-10-06 Electropolishing electrolyte and method for planarizing a metal layer using the same MY141248A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093130211A TWI294923B (en) 2004-10-06 2004-10-06 Electropolishing electrolyte and method for planarizing a metal layer using the same

Publications (1)

Publication Number Publication Date
MY141248A true MY141248A (en) 2010-03-31

Family

ID=35636650

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20054707A MY141248A (en) 2004-10-06 2005-10-06 Electropolishing electrolyte and method for planarizing a metal layer using the same

Country Status (13)

Country Link
US (1) US7501051B2 (https=)
EP (1) EP1935013A1 (https=)
JP (1) JP2008516083A (https=)
KR (1) KR20070061579A (https=)
AT (1) AT503087A2 (https=)
CH (1) CH698385B1 (https=)
DE (1) DE112005002414T5 (https=)
GB (1) GB2434159B (https=)
IL (1) IL182224A0 (https=)
MY (1) MY141248A (https=)
RU (1) RU2007116697A (https=)
TW (1) TWI294923B (https=)
WO (1) WO2006037584A1 (https=)

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Publication number Priority date Publication date Assignee Title
KR100783006B1 (ko) * 2007-08-09 2007-12-07 신승균 동 도금된 마그네슘합금 및 그 형성방법
MX2012005909A (es) * 2009-11-23 2012-11-12 MetCon LLC Soliucion de electrolitos y metodos de electropulido.
US8580103B2 (en) 2010-11-22 2013-11-12 Metcon, Llc Electrolyte solution and electrochemical surface modification methods
CN102337569B (zh) * 2011-09-19 2014-06-11 华南理工大学 一种钴-钨纳米合金镀层及其制备方法
RU2471595C1 (ru) * 2011-12-07 2013-01-10 Открытое акционерное общество "Научно-производственное объединение "Сатурн" Электролит для электрохимической обработки
KR101464860B1 (ko) * 2013-02-06 2014-11-24 인천대학교 산학협력단 알릴 알콜을 포함하는 금속 씨앗층 평탄제 및 이를 이용한 씨앗층의 형성방법
US9648723B2 (en) 2015-09-16 2017-05-09 International Business Machines Corporation Process of fabricating printed circuit board
WO2020138976A1 (ko) * 2018-12-26 2020-07-02 한양대학교에리카산학협력단 반도체 소자의 제조 방법
DE102020200815A1 (de) 2020-01-23 2021-07-29 Mahle International Gmbh Zusammensetzung als Elektrolyt zum Auflösen und/oder Abscheiden von Metallen, Metalloxiden und/oder Metalllegierungen sowie Verwendungen dieser Zusammensetzung
KR102258702B1 (ko) 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면 구조를 가지는 버스바
KR102258703B1 (ko) 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면구조를 가지는 버스바 제조방법
KR102608626B1 (ko) * 2020-11-30 2023-12-04 한국과학기술연구원 Cis계 박막의 평탄화 방법, 이를 이용하여 제조된 cis계 박막 및 상기 cis계 박막을 포함하는 태양전지
US11447887B2 (en) * 2020-12-10 2022-09-20 Saudi Arabian Oil Company Surface smoothing of copper by electropolishing
US11512400B2 (en) 2020-12-10 2022-11-29 Saudi Arabian Oil Company Electrochemical reduction of carbon dioxide
CN113337877A (zh) * 2021-05-17 2021-09-03 安徽昀水表面科技有限公司 一种电解抛光药水及电解抛光加工工艺
US11718575B2 (en) 2021-08-12 2023-08-08 Saudi Arabian Oil Company Methanol production via dry reforming and methanol synthesis in a vessel
US12258272B2 (en) 2021-08-12 2025-03-25 Saudi Arabian Oil Company Dry reforming of methane using a nickel-based bi-metallic catalyst
US11787759B2 (en) 2021-08-12 2023-10-17 Saudi Arabian Oil Company Dimethyl ether production via dry reforming and dimethyl ether synthesis in a vessel
US11578016B1 (en) 2021-08-12 2023-02-14 Saudi Arabian Oil Company Olefin production via dry reforming and olefin synthesis in a vessel
US11617981B1 (en) 2022-01-03 2023-04-04 Saudi Arabian Oil Company Method for capturing CO2 with assisted vapor compression

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
GB726133A (en) * 1952-10-09 1955-03-16 Metro Cutanit Ltd Improvements relating to the electrolytic treatment of metal wire and the like
JPS5242134B2 (https=) * 1972-12-30 1977-10-22
SU779453A1 (ru) * 1978-04-24 1980-11-15 Ленинградский Институт Ядерной Физики Им. Б.П.Константинова Ан Ссср Раствор дл электрохимического полировани металлической поверхности
US4920361A (en) * 1987-06-26 1990-04-24 Canon Kabushiki Kaisha Image recording method and apparatus therefor
US5066370A (en) * 1990-09-07 1991-11-19 International Business Machines Corporation Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands
JP2649625B2 (ja) 1991-12-10 1997-09-03 株式会社 ケミカル山本 含クロム合金鋼の電解琢磨用電解液
FR2747399B1 (fr) 1996-04-12 1998-05-07 Commissariat Energie Atomique Electrolyte pour l'electropolissage, procede d'electropolissage d'un acier inoxydable ou d'un alliage de nickel mettant en oeuvre cet electrolyte, et son application a la decontamination
US6491808B2 (en) * 1997-09-11 2002-12-10 Canon Kabushiki Kaisha Electrolytic etching method, method for producing photovoltaic element, and method for treating defect of photovoltaic element
AT410043B (de) * 1997-09-30 2003-01-27 Sez Ag Verfahren zum planarisieren von halbleitersubstraten
US6811658B2 (en) * 2000-06-29 2004-11-02 Ebara Corporation Apparatus for forming interconnects
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
TW567545B (en) 2002-06-04 2003-12-21 Merck Kanto Advanced Chemical Electropolishing electrolytic solution formulation

Also Published As

Publication number Publication date
JP2008516083A (ja) 2008-05-15
GB0707076D0 (en) 2007-05-23
CH698385B1 (de) 2009-07-31
TWI294923B (en) 2008-03-21
RU2007116697A (ru) 2008-11-20
GB2434159B (en) 2009-05-06
IL182224A0 (en) 2007-09-20
DE112005002414T5 (de) 2007-09-27
US7501051B2 (en) 2009-03-10
KR20070061579A (ko) 2007-06-13
WO2006037584A1 (en) 2006-04-13
US20060070888A1 (en) 2006-04-06
TW200611998A (en) 2006-04-16
GB2434159A (en) 2007-07-18
EP1935013A1 (en) 2008-06-25
AT503087A2 (de) 2007-07-15

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