KR20070061579A - 전해연마 전해질 및 이를 사용한 금속층의 평탄화 방법 - Google Patents

전해연마 전해질 및 이를 사용한 금속층의 평탄화 방법 Download PDF

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Publication number
KR20070061579A
KR20070061579A KR1020077010183A KR20077010183A KR20070061579A KR 20070061579 A KR20070061579 A KR 20070061579A KR 1020077010183 A KR1020077010183 A KR 1020077010183A KR 20077010183 A KR20077010183 A KR 20077010183A KR 20070061579 A KR20070061579 A KR 20070061579A
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KR
South Korea
Prior art keywords
acid
electropolishing
phosphoric acid
volume ratio
metal layer
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Withdrawn
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KR1020077010183A
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English (en)
Korean (ko)
Inventor
지아 민 시에
수 홍 리우
다이 보우 통
Original Assignee
바스프 악티엔게젤샤프트
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Application filed by 바스프 악티엔게젤샤프트 filed Critical 바스프 악티엔게젤샤프트
Publication of KR20070061579A publication Critical patent/KR20070061579A/ko
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/12—Working media
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/61—Formation of materials, e.g. in the shape of layers or pillars of insulating materials using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/04—Planarisation of conductive or resistive materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
  • Fuel Cell (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • ing And Chemical Polishing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020077010183A 2004-10-06 2005-10-01 전해연마 전해질 및 이를 사용한 금속층의 평탄화 방법 Withdrawn KR20070061579A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW93130211 2004-10-06
TW093130211A TWI294923B (en) 2004-10-06 2004-10-06 Electropolishing electrolyte and method for planarizing a metal layer using the same

Publications (1)

Publication Number Publication Date
KR20070061579A true KR20070061579A (ko) 2007-06-13

Family

ID=35636650

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077010183A Withdrawn KR20070061579A (ko) 2004-10-06 2005-10-01 전해연마 전해질 및 이를 사용한 금속층의 평탄화 방법

Country Status (13)

Country Link
US (1) US7501051B2 (https=)
EP (1) EP1935013A1 (https=)
JP (1) JP2008516083A (https=)
KR (1) KR20070061579A (https=)
AT (1) AT503087A2 (https=)
CH (1) CH698385B1 (https=)
DE (1) DE112005002414T5 (https=)
GB (1) GB2434159B (https=)
IL (1) IL182224A0 (https=)
MY (1) MY141248A (https=)
RU (1) RU2007116697A (https=)
TW (1) TWI294923B (https=)
WO (1) WO2006037584A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100783006B1 (ko) * 2007-08-09 2007-12-07 신승균 동 도금된 마그네슘합금 및 그 형성방법
KR101464860B1 (ko) * 2013-02-06 2014-11-24 인천대학교 산학협력단 알릴 알콜을 포함하는 금속 씨앗층 평탄제 및 이를 이용한 씨앗층의 형성방법
WO2020138976A1 (ko) * 2018-12-26 2020-07-02 한양대학교에리카산학협력단 반도체 소자의 제조 방법
KR102258703B1 (ko) 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면구조를 가지는 버스바 제조방법
KR102258702B1 (ko) 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면 구조를 가지는 버스바
WO2022114330A1 (ko) * 2020-11-30 2022-06-02 한국과학기술연구원 Cis계 박막의 평탄화 방법, 이를 이용하여 제조된 cis계 박막 및 상기 cis계 박막을 포함하는 태양전지

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2012005909A (es) * 2009-11-23 2012-11-12 MetCon LLC Soliucion de electrolitos y metodos de electropulido.
US8580103B2 (en) 2010-11-22 2013-11-12 Metcon, Llc Electrolyte solution and electrochemical surface modification methods
CN102337569B (zh) * 2011-09-19 2014-06-11 华南理工大学 一种钴-钨纳米合金镀层及其制备方法
RU2471595C1 (ru) * 2011-12-07 2013-01-10 Открытое акционерное общество "Научно-производственное объединение "Сатурн" Электролит для электрохимической обработки
US9648723B2 (en) 2015-09-16 2017-05-09 International Business Machines Corporation Process of fabricating printed circuit board
DE102020200815A1 (de) 2020-01-23 2021-07-29 Mahle International Gmbh Zusammensetzung als Elektrolyt zum Auflösen und/oder Abscheiden von Metallen, Metalloxiden und/oder Metalllegierungen sowie Verwendungen dieser Zusammensetzung
US11447887B2 (en) * 2020-12-10 2022-09-20 Saudi Arabian Oil Company Surface smoothing of copper by electropolishing
US11512400B2 (en) 2020-12-10 2022-11-29 Saudi Arabian Oil Company Electrochemical reduction of carbon dioxide
CN113337877A (zh) * 2021-05-17 2021-09-03 安徽昀水表面科技有限公司 一种电解抛光药水及电解抛光加工工艺
US11718575B2 (en) 2021-08-12 2023-08-08 Saudi Arabian Oil Company Methanol production via dry reforming and methanol synthesis in a vessel
US12258272B2 (en) 2021-08-12 2025-03-25 Saudi Arabian Oil Company Dry reforming of methane using a nickel-based bi-metallic catalyst
US11787759B2 (en) 2021-08-12 2023-10-17 Saudi Arabian Oil Company Dimethyl ether production via dry reforming and dimethyl ether synthesis in a vessel
US11578016B1 (en) 2021-08-12 2023-02-14 Saudi Arabian Oil Company Olefin production via dry reforming and olefin synthesis in a vessel
US11617981B1 (en) 2022-01-03 2023-04-04 Saudi Arabian Oil Company Method for capturing CO2 with assisted vapor compression

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB726133A (en) * 1952-10-09 1955-03-16 Metro Cutanit Ltd Improvements relating to the electrolytic treatment of metal wire and the like
JPS5242134B2 (https=) * 1972-12-30 1977-10-22
SU779453A1 (ru) * 1978-04-24 1980-11-15 Ленинградский Институт Ядерной Физики Им. Б.П.Константинова Ан Ссср Раствор дл электрохимического полировани металлической поверхности
US4920361A (en) * 1987-06-26 1990-04-24 Canon Kabushiki Kaisha Image recording method and apparatus therefor
US5066370A (en) * 1990-09-07 1991-11-19 International Business Machines Corporation Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands
JP2649625B2 (ja) 1991-12-10 1997-09-03 株式会社 ケミカル山本 含クロム合金鋼の電解琢磨用電解液
FR2747399B1 (fr) 1996-04-12 1998-05-07 Commissariat Energie Atomique Electrolyte pour l'electropolissage, procede d'electropolissage d'un acier inoxydable ou d'un alliage de nickel mettant en oeuvre cet electrolyte, et son application a la decontamination
US6491808B2 (en) * 1997-09-11 2002-12-10 Canon Kabushiki Kaisha Electrolytic etching method, method for producing photovoltaic element, and method for treating defect of photovoltaic element
AT410043B (de) * 1997-09-30 2003-01-27 Sez Ag Verfahren zum planarisieren von halbleitersubstraten
US6811658B2 (en) * 2000-06-29 2004-11-02 Ebara Corporation Apparatus for forming interconnects
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
TW567545B (en) 2002-06-04 2003-12-21 Merck Kanto Advanced Chemical Electropolishing electrolytic solution formulation

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100783006B1 (ko) * 2007-08-09 2007-12-07 신승균 동 도금된 마그네슘합금 및 그 형성방법
KR101464860B1 (ko) * 2013-02-06 2014-11-24 인천대학교 산학협력단 알릴 알콜을 포함하는 금속 씨앗층 평탄제 및 이를 이용한 씨앗층의 형성방법
WO2020138976A1 (ko) * 2018-12-26 2020-07-02 한양대학교에리카산학협력단 반도체 소자의 제조 방법
KR102258703B1 (ko) 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면구조를 가지는 버스바 제조방법
KR102258702B1 (ko) 2020-09-07 2021-06-01 주식회사 근우 전기 전도율 향상을 위한 표면 구조를 가지는 버스바
WO2022114330A1 (ko) * 2020-11-30 2022-06-02 한국과학기술연구원 Cis계 박막의 평탄화 방법, 이를 이용하여 제조된 cis계 박막 및 상기 cis계 박막을 포함하는 태양전지
KR20220075884A (ko) * 2020-11-30 2022-06-08 한국과학기술연구원 Cis계 박막의 평탄화 방법, 이를 이용하여 제조된 cis계 박막 및 상기 cis계 박막을 포함하는 태양전지

Also Published As

Publication number Publication date
JP2008516083A (ja) 2008-05-15
GB0707076D0 (en) 2007-05-23
CH698385B1 (de) 2009-07-31
TWI294923B (en) 2008-03-21
MY141248A (en) 2010-03-31
RU2007116697A (ru) 2008-11-20
GB2434159B (en) 2009-05-06
IL182224A0 (en) 2007-09-20
DE112005002414T5 (de) 2007-09-27
US7501051B2 (en) 2009-03-10
WO2006037584A1 (en) 2006-04-13
US20060070888A1 (en) 2006-04-06
TW200611998A (en) 2006-04-16
GB2434159A (en) 2007-07-18
EP1935013A1 (en) 2008-06-25
AT503087A2 (de) 2007-07-15

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