RU2007116697A - Электрополирующий электролит и способ выравнивания металлического слоя с его использованием - Google Patents
Электрополирующий электролит и способ выравнивания металлического слоя с его использованием Download PDFInfo
- Publication number
- RU2007116697A RU2007116697A RU2007116697/28A RU2007116697A RU2007116697A RU 2007116697 A RU2007116697 A RU 2007116697A RU 2007116697/28 A RU2007116697/28 A RU 2007116697/28A RU 2007116697 A RU2007116697 A RU 2007116697A RU 2007116697 A RU2007116697 A RU 2007116697A
- Authority
- RU
- Russia
- Prior art keywords
- metal layer
- electrolyte according
- electropolishing
- phosphoric acid
- volume ratio
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/12—Working media
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/61—Formation of materials, e.g. in the shape of layers or pillars of insulating materials using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/04—Planarisation of conductive or resistive materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Weting (AREA)
- Fuel Cell (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- ing And Chemical Polishing (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93130211 | 2004-10-06 | ||
| TW093130211A TWI294923B (en) | 2004-10-06 | 2004-10-06 | Electropolishing electrolyte and method for planarizing a metal layer using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2007116697A true RU2007116697A (ru) | 2008-11-20 |
Family
ID=35636650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2007116697/28A RU2007116697A (ru) | 2004-10-06 | 2005-10-01 | Электрополирующий электролит и способ выравнивания металлического слоя с его использованием |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US7501051B2 (https=) |
| EP (1) | EP1935013A1 (https=) |
| JP (1) | JP2008516083A (https=) |
| KR (1) | KR20070061579A (https=) |
| AT (1) | AT503087A2 (https=) |
| CH (1) | CH698385B1 (https=) |
| DE (1) | DE112005002414T5 (https=) |
| GB (1) | GB2434159B (https=) |
| IL (1) | IL182224A0 (https=) |
| MY (1) | MY141248A (https=) |
| RU (1) | RU2007116697A (https=) |
| TW (1) | TWI294923B (https=) |
| WO (1) | WO2006037584A1 (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100783006B1 (ko) * | 2007-08-09 | 2007-12-07 | 신승균 | 동 도금된 마그네슘합금 및 그 형성방법 |
| MX2012005909A (es) * | 2009-11-23 | 2012-11-12 | MetCon LLC | Soliucion de electrolitos y metodos de electropulido. |
| US8580103B2 (en) | 2010-11-22 | 2013-11-12 | Metcon, Llc | Electrolyte solution and electrochemical surface modification methods |
| CN102337569B (zh) * | 2011-09-19 | 2014-06-11 | 华南理工大学 | 一种钴-钨纳米合金镀层及其制备方法 |
| RU2471595C1 (ru) * | 2011-12-07 | 2013-01-10 | Открытое акционерное общество "Научно-производственное объединение "Сатурн" | Электролит для электрохимической обработки |
| KR101464860B1 (ko) * | 2013-02-06 | 2014-11-24 | 인천대학교 산학협력단 | 알릴 알콜을 포함하는 금속 씨앗층 평탄제 및 이를 이용한 씨앗층의 형성방법 |
| US9648723B2 (en) | 2015-09-16 | 2017-05-09 | International Business Machines Corporation | Process of fabricating printed circuit board |
| WO2020138976A1 (ko) * | 2018-12-26 | 2020-07-02 | 한양대학교에리카산학협력단 | 반도체 소자의 제조 방법 |
| DE102020200815A1 (de) | 2020-01-23 | 2021-07-29 | Mahle International Gmbh | Zusammensetzung als Elektrolyt zum Auflösen und/oder Abscheiden von Metallen, Metalloxiden und/oder Metalllegierungen sowie Verwendungen dieser Zusammensetzung |
| KR102258702B1 (ko) | 2020-09-07 | 2021-06-01 | 주식회사 근우 | 전기 전도율 향상을 위한 표면 구조를 가지는 버스바 |
| KR102258703B1 (ko) | 2020-09-07 | 2021-06-01 | 주식회사 근우 | 전기 전도율 향상을 위한 표면구조를 가지는 버스바 제조방법 |
| KR102608626B1 (ko) * | 2020-11-30 | 2023-12-04 | 한국과학기술연구원 | Cis계 박막의 평탄화 방법, 이를 이용하여 제조된 cis계 박막 및 상기 cis계 박막을 포함하는 태양전지 |
| US11447887B2 (en) * | 2020-12-10 | 2022-09-20 | Saudi Arabian Oil Company | Surface smoothing of copper by electropolishing |
| US11512400B2 (en) | 2020-12-10 | 2022-11-29 | Saudi Arabian Oil Company | Electrochemical reduction of carbon dioxide |
| CN113337877A (zh) * | 2021-05-17 | 2021-09-03 | 安徽昀水表面科技有限公司 | 一种电解抛光药水及电解抛光加工工艺 |
| US11718575B2 (en) | 2021-08-12 | 2023-08-08 | Saudi Arabian Oil Company | Methanol production via dry reforming and methanol synthesis in a vessel |
| US12258272B2 (en) | 2021-08-12 | 2025-03-25 | Saudi Arabian Oil Company | Dry reforming of methane using a nickel-based bi-metallic catalyst |
| US11787759B2 (en) | 2021-08-12 | 2023-10-17 | Saudi Arabian Oil Company | Dimethyl ether production via dry reforming and dimethyl ether synthesis in a vessel |
| US11578016B1 (en) | 2021-08-12 | 2023-02-14 | Saudi Arabian Oil Company | Olefin production via dry reforming and olefin synthesis in a vessel |
| US11617981B1 (en) | 2022-01-03 | 2023-04-04 | Saudi Arabian Oil Company | Method for capturing CO2 with assisted vapor compression |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB726133A (en) * | 1952-10-09 | 1955-03-16 | Metro Cutanit Ltd | Improvements relating to the electrolytic treatment of metal wire and the like |
| JPS5242134B2 (https=) * | 1972-12-30 | 1977-10-22 | ||
| SU779453A1 (ru) * | 1978-04-24 | 1980-11-15 | Ленинградский Институт Ядерной Физики Им. Б.П.Константинова Ан Ссср | Раствор дл электрохимического полировани металлической поверхности |
| US4920361A (en) * | 1987-06-26 | 1990-04-24 | Canon Kabushiki Kaisha | Image recording method and apparatus therefor |
| US5066370A (en) * | 1990-09-07 | 1991-11-19 | International Business Machines Corporation | Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands |
| JP2649625B2 (ja) | 1991-12-10 | 1997-09-03 | 株式会社 ケミカル山本 | 含クロム合金鋼の電解琢磨用電解液 |
| FR2747399B1 (fr) | 1996-04-12 | 1998-05-07 | Commissariat Energie Atomique | Electrolyte pour l'electropolissage, procede d'electropolissage d'un acier inoxydable ou d'un alliage de nickel mettant en oeuvre cet electrolyte, et son application a la decontamination |
| US6491808B2 (en) * | 1997-09-11 | 2002-12-10 | Canon Kabushiki Kaisha | Electrolytic etching method, method for producing photovoltaic element, and method for treating defect of photovoltaic element |
| AT410043B (de) * | 1997-09-30 | 2003-01-27 | Sez Ag | Verfahren zum planarisieren von halbleitersubstraten |
| US6811658B2 (en) * | 2000-06-29 | 2004-11-02 | Ebara Corporation | Apparatus for forming interconnects |
| US7128825B2 (en) * | 2001-03-14 | 2006-10-31 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| TW567545B (en) | 2002-06-04 | 2003-12-21 | Merck Kanto Advanced Chemical | Electropolishing electrolytic solution formulation |
-
2004
- 2004-10-06 TW TW093130211A patent/TWI294923B/zh not_active IP Right Cessation
-
2005
- 2005-02-04 US US11/051,163 patent/US7501051B2/en not_active Expired - Fee Related
- 2005-10-01 JP JP2007535073A patent/JP2008516083A/ja not_active Withdrawn
- 2005-10-01 DE DE112005002414T patent/DE112005002414T5/de not_active Withdrawn
- 2005-10-01 KR KR1020077010183A patent/KR20070061579A/ko not_active Withdrawn
- 2005-10-01 EP EP05797350A patent/EP1935013A1/en not_active Withdrawn
- 2005-10-01 RU RU2007116697/28A patent/RU2007116697A/ru not_active Application Discontinuation
- 2005-10-01 GB GB0707076A patent/GB2434159B/en not_active Expired - Fee Related
- 2005-10-01 CH CH00561/07A patent/CH698385B1/de not_active IP Right Cessation
- 2005-10-01 AT AT0939305A patent/AT503087A2/de not_active Application Discontinuation
- 2005-10-01 WO PCT/EP2005/010628 patent/WO2006037584A1/en not_active Ceased
- 2005-10-06 MY MYPI20054707A patent/MY141248A/en unknown
-
2007
- 2007-03-27 IL IL182224A patent/IL182224A0/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008516083A (ja) | 2008-05-15 |
| GB0707076D0 (en) | 2007-05-23 |
| CH698385B1 (de) | 2009-07-31 |
| TWI294923B (en) | 2008-03-21 |
| MY141248A (en) | 2010-03-31 |
| GB2434159B (en) | 2009-05-06 |
| IL182224A0 (en) | 2007-09-20 |
| DE112005002414T5 (de) | 2007-09-27 |
| US7501051B2 (en) | 2009-03-10 |
| KR20070061579A (ko) | 2007-06-13 |
| WO2006037584A1 (en) | 2006-04-13 |
| US20060070888A1 (en) | 2006-04-06 |
| TW200611998A (en) | 2006-04-16 |
| GB2434159A (en) | 2007-07-18 |
| EP1935013A1 (en) | 2008-06-25 |
| AT503087A2 (de) | 2007-07-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA92 | Acknowledgement of application withdrawn (lack of supplementary materials submitted) |
Effective date: 20100405 |