TWI294156B - - Google Patents

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Publication number
TWI294156B
TWI294156B TW094119054A TW94119054A TWI294156B TW I294156 B TWI294156 B TW I294156B TW 094119054 A TW094119054 A TW 094119054A TW 94119054 A TW94119054 A TW 94119054A TW I294156 B TWI294156 B TW I294156B
Authority
TW
Taiwan
Prior art keywords
substrate
transport
transfer
processing
unit
Prior art date
Application number
TW094119054A
Other languages
English (en)
Chinese (zh)
Other versions
TW200610091A (en
Inventor
Taniguchi Takeshi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200610091A publication Critical patent/TW200610091A/zh
Application granted granted Critical
Publication of TWI294156B publication Critical patent/TWI294156B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW094119054A 2004-07-06 2005-06-09 Base plate treater TW200610091A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004199718A JP2006024643A (ja) 2004-07-06 2004-07-06 基板処理装置

Publications (2)

Publication Number Publication Date
TW200610091A TW200610091A (en) 2006-03-16
TWI294156B true TWI294156B (ja) 2008-03-01

Family

ID=35797722

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119054A TW200610091A (en) 2004-07-06 2005-06-09 Base plate treater

Country Status (4)

Country Link
JP (1) JP2006024643A (ja)
KR (1) KR100687565B1 (ja)
CN (1) CN1718521A (ja)
TW (1) TW200610091A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4509926B2 (ja) * 2005-12-27 2010-07-21 大日本スクリーン製造株式会社 基板処理装置
KR100978854B1 (ko) * 2008-06-03 2010-08-31 세메스 주식회사 기판 이송 장치
JP4370363B1 (ja) * 2009-03-16 2009-11-25 株式会社幸和 加熱及び冷却機能を備えたコンベア
CN102367201A (zh) * 2011-10-19 2012-03-07 东莞宏威数码机械有限公司 玻璃基板涂胶自动化系统及涂胶方法
CN102367202A (zh) * 2011-10-19 2012-03-07 东莞宏威数码机械有限公司 基板涂胶系统及涂胶方法
CN102838286A (zh) * 2012-09-06 2012-12-26 张家港市广丰玻璃有限公司 一种检测周转台
JP6079510B2 (ja) * 2013-08-30 2017-02-15 東京エレクトロン株式会社 基板処理システム、基板処理方法及び記憶媒体
CN104401767B (zh) * 2014-11-14 2017-03-15 广州兴森快捷电路科技有限公司 Pcb转角传输装置及方法
CN104326264B (zh) * 2014-11-18 2018-09-04 厦门航天思尔特机器人系统股份公司 一种汽车三角窗玻璃生产线
CN106179875A (zh) * 2016-07-29 2016-12-07 芜湖市振华戎科智能科技有限公司 一种加密光盘生产线用滴胶装置
JP7405889B2 (ja) 2022-03-23 2023-12-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7543473B1 (ja) 2023-03-16 2024-09-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3450138B2 (ja) * 1996-11-26 2003-09-22 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
JP2006024643A (ja) 2006-01-26
KR20060049892A (ko) 2006-05-19
TW200610091A (en) 2006-03-16
CN1718521A (zh) 2006-01-11
KR100687565B1 (ko) 2007-02-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees