TWI292484B - Device with a circuit for detecting an abnormal substrate - Google Patents
Device with a circuit for detecting an abnormal substrate Download PDFInfo
- Publication number
- TWI292484B TWI292484B TW094143705A TW94143705A TWI292484B TW I292484 B TWI292484 B TW I292484B TW 094143705 A TW094143705 A TW 094143705A TW 94143705 A TW94143705 A TW 94143705A TW I292484 B TWI292484 B TW I292484B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- dsa
- signal
- substrates
- setting
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002056570A JP3790175B2 (ja) | 2002-03-01 | 2002-03-01 | 基板異常検出回路付き装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200634322A TW200634322A (en) | 2006-10-01 |
TWI292484B true TWI292484B (en) | 2008-01-11 |
Family
ID=27784643
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096116860A TWI325060B (en) | 2002-03-01 | 2003-02-27 | Device with a circuit for detecting an abnormal substrate |
TW092104151A TWI277757B (en) | 2002-03-01 | 2003-02-27 | Device with a circuit for detecting an abnormal substrate |
TW094143705A TWI292484B (en) | 2002-03-01 | 2003-02-27 | Device with a circuit for detecting an abnormal substrate |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096116860A TWI325060B (en) | 2002-03-01 | 2003-02-27 | Device with a circuit for detecting an abnormal substrate |
TW092104151A TWI277757B (en) | 2002-03-01 | 2003-02-27 | Device with a circuit for detecting an abnormal substrate |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP3790175B2 (ko) |
KR (3) | KR100966686B1 (ko) |
CN (2) | CN1811479A (ko) |
DE (1) | DE10392347T5 (ko) |
MY (1) | MY134319A (ko) |
TW (3) | TWI325060B (ko) |
WO (1) | WO2003075026A1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100395718C (zh) * | 2004-03-13 | 2008-06-18 | 鸿富锦精密工业(深圳)有限公司 | 主机板功能测试板 |
KR100897349B1 (ko) | 2007-06-12 | 2009-05-15 | 주식회사 유니테스트 | 반도체 소자 테스트 장치 |
CN101551427B (zh) * | 2008-03-31 | 2012-04-04 | 无锡松下冷机有限公司 | 基板的检测方法 |
TWI385773B (zh) * | 2008-05-21 | 2013-02-11 | Lefram Technology Corp | Lead frame carrier and method of manufacturing the same |
CN102445635B (zh) * | 2010-10-11 | 2014-12-03 | 中国电信股份有限公司 | 跳线快速测试器 |
US8878182B2 (en) * | 2011-10-12 | 2014-11-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe pad design for 3DIC package yield analysis |
KR101316785B1 (ko) | 2013-07-31 | 2013-10-10 | 테스토피아 주식회사 | 수직식 실린더를 이용한 소켓보드 교체장치 |
CN103440567A (zh) * | 2013-08-28 | 2013-12-11 | 杭州华三通信技术有限公司 | 一种区分销往不同市场设备的方法及装置 |
KR102377694B1 (ko) * | 2020-07-28 | 2022-03-23 | 주식회사 에스티아이테크 | 보드 결합용 브래킷 및 이에 의한 보드 어셈블리 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4787143A (en) * | 1985-12-04 | 1988-11-29 | Tdk Corporation | Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor |
JP3730340B2 (ja) * | 1996-11-20 | 2006-01-05 | 株式会社アドバンテスト | 半導体試験装置 |
US6480751B1 (en) * | 1997-01-16 | 2002-11-12 | Matsushita Electric Industrial Co., Ltd. | Component supplying method, component arrangement data forming method and electronic component mounting apparatus using the methods |
US6040530A (en) * | 1997-12-05 | 2000-03-21 | Hewlett-Packard Company | Versatile printed circuit board for testing processing reliability |
JPH11326448A (ja) * | 1998-05-20 | 1999-11-26 | Advantest Corp | Ic試験装置 |
CN1240939A (zh) * | 1998-06-09 | 2000-01-12 | 株式会社爱德万测试 | 电子元器件试验装置 |
KR20000008963U (ko) * | 1998-10-29 | 2000-05-25 | 김영환 | 신규의 소켓 어댑터를 가지는 반도체 소자 패키지 테스트 장치 |
JP2000310664A (ja) * | 1999-04-27 | 2000-11-07 | Ando Electric Co Ltd | Ic試験装置、及びic試験装置における外部機器識別方法 |
JP3797529B2 (ja) * | 1999-05-20 | 2006-07-19 | 富士写真フイルム株式会社 | 導通状態検知機能付き集積回路 |
JP2001004701A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | Id認識方式及びその方式を用いたid認識装置 |
-
2002
- 2002-03-01 JP JP2002056570A patent/JP3790175B2/ja not_active Expired - Fee Related
-
2003
- 2003-02-25 CN CNA2006100042601A patent/CN1811479A/zh active Pending
- 2003-02-25 CN CN038049503A patent/CN1639579B/zh not_active Expired - Fee Related
- 2003-02-25 WO PCT/JP2003/002037 patent/WO2003075026A1/ja active Application Filing
- 2003-02-25 KR KR1020057023622A patent/KR100966686B1/ko active IP Right Grant
- 2003-02-25 KR KR1020107007132A patent/KR20100050568A/ko not_active Application Discontinuation
- 2003-02-25 KR KR1020047013570A patent/KR100624060B1/ko active IP Right Grant
- 2003-02-25 DE DE10392347T patent/DE10392347T5/de not_active Withdrawn
- 2003-02-27 TW TW096116860A patent/TWI325060B/zh not_active IP Right Cessation
- 2003-02-27 TW TW092104151A patent/TWI277757B/zh not_active IP Right Cessation
- 2003-02-27 TW TW094143705A patent/TWI292484B/zh not_active IP Right Cessation
- 2003-02-28 MY MYPI20030724A patent/MY134319A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI277757B (en) | 2007-04-01 |
MY134319A (en) | 2007-12-31 |
WO2003075026A1 (en) | 2003-09-12 |
TW200303990A (en) | 2003-09-16 |
CN1811479A (zh) | 2006-08-02 |
KR20040082446A (ko) | 2004-09-24 |
JP3790175B2 (ja) | 2006-06-28 |
KR100966686B1 (ko) | 2010-06-29 |
KR20100050568A (ko) | 2010-05-13 |
JP2003255020A (ja) | 2003-09-10 |
TW200634322A (en) | 2006-10-01 |
CN1639579B (zh) | 2011-01-26 |
TWI325060B (en) | 2010-05-21 |
KR20050121763A (ko) | 2005-12-27 |
CN1639579A (zh) | 2005-07-13 |
TW200739100A (en) | 2007-10-16 |
DE10392347T5 (de) | 2005-04-07 |
KR100624060B1 (ko) | 2006-09-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |